Diodes SDM1L30BLP User Manual

Product Summary
(V)
V
V
(V) IO (A)
RRM
30 1 0.42 1
F MAX
@ +25°C
I
R MAX
@ +25°C
(mA)
Description and Applications
Packaged in the compact DFN5060-4 the SDM1L30BLP has been
designed with low forward voltage and soft switching characteristics
to meet the needs of wireless charging applications.
Top View
Device Schematic
Green
1.0A SURFACE MOUNT SCHOTTKY BRIDGE
Features
Low profile package, ideal for thin portable applications
Low Forward Voltage Drop reduces power dissipation
Soft switching characteristic ensures that EMI and EFI are
minimised
Guard Ring Die Construction for transient Protection
Lead-Free Finish; RoHS Compliant (Notes 1 & 2)
Halogen and Antimony Free. “Green” Device (Note 3)
Qualified to AEC-Q101 Standards for High Reliability
Mechanical Data
Case: V-DFN5060-4
Case Material: Molded Plastic, “Green” Molding Compound. UL
Flammability Classification Rating 94V-0
Moisture Sensitivity: Level 1 per J-STD-020
Terminals: Finish - Matte Tin annealed over Copper leadframe.
Solderable per MIL-STD-202, Method 208
Polarity: See Diagram
Weight: 0.0715 grams (approximate)
Top View Bottom View
Ordering Information
Part Number Case Packaging
SDM1L30BLP-13 V-DFN5060-4 3000/Tape & Reel
Notes: 1. EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant. All applicable RoHS exemptions applied.
2. See http://www.diodes.com/quality/lead_free.html for more information about Diodes Incorporated’s definitions of Halogen- and Antimony-free, "Green" and Lead-free.
3. Halogen- and Antimony-free "Green” products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and <1000ppm antimony compounds.
4. For packaging details, go to our website at http://www.diodes.com/products/packages.html.
(Note 4)
Marking Information
Date Code Key
Year 2012 2013 2014 2015 2016 2017 2018
Code Z A B C D E F
Month Jan Feb Mar Apr May Jun Jul Aug Sep Oct Nov Dec
Code 1 2 3 4 5 6 7 8 9 O N D
SDM1L30BLP
Document number: DS35906 Rev. 6 - 2
SD3S
YM
www.diodes.com
D3 = Product Type Marking Code
SS YM = Date Code Marking Y = Year (ex: W =2012) M = Month (ex: 9 = September)
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November 2013
© Diodes Incorporated
P
P
OWER
PATIO
Maximum Ratings (@T
Single phase, half wave, 60Hz, resistive or inductive load. For capacitance load, derate current by 20%.
Characteristic Symbol Value Unit
Peak Repetitive Reverse Voltage Working Peak Reverse Voltage DC Blocking Voltage
Average Rectified Output Current
Non-Repetitive Peak Forward Surge Current 8.3ms Single Half Sine-Wave Superimposed on Rated Load (Per Diode)
= +25°C, unless otherwise specified.)
A
Thermal Characteristics
Characteristic Symbol Value Unit
Typical Thermal Resistance Junction to Case (Note 5)
Operating and Storage Temperature Range
SDM1L30BLP
V
RRM
V
RWM
V
RM
I
O
I
FSM
R
θJC
T
, T
J
STG
30 V
1.0 mA
50 A
15 °C/W
-55 to +150 °C
Electrical Characteristics (@T
= +25°C, unless otherwise specified.)
A
Characteristic Symbol Min Typ Max Unit Test Condition
I
Forward Voltage Drop (Per Diode)
Leakage Current (Note 6) (Per Diode)
Total Capacitance
Notes: 5. Device mounted on Polymide PCB with 1x recommended pad layout, with minimum recommended pad layout per http://www.diodes.com.
6. Short duration pulse test used to minimize self-heating effect.
V
F
I
R
C
T
— — 1.0 mA
— 90 — pF
1.6
0.21
0.31
10
1.4
1.2
N (W)
1.0
DISSI
0.8
0.1
1
0.42
T = 125°C
A
T = 85°C
A
T = 150°C
A
V
0.6
,
0.4
D
0.01
= 0.1A, TJ = +25°C
F
= 1.0A, TJ = +25°C
I
F
VR = 30V, TJ = +25°C
V
= 30V, f = 1.0MHz,
R
= +25°C
T
J
T = 25°C
A
T = -55°C
A
0.2
F
0.0 0 0.5 1 1.5 2 2.5 3 3.5
I AVERAGE FORWARD CURRENT (A)
F(AV)
Figure 1 Forward Power Dissipation
SDM1L30BLP
Document number: DS35906 Rev. 6 - 2
2 of 5
www.diodes.com
I , INSTANTANEOUS FORWARD CURRENT (A)
0.001 0 0.1 0.2 0.3 0.4 0.5 0.6
V , INSTANTANEOUS FORWARD VOLTAGE (V)
F
Figure 2 Typical Forward Characteristics
November 2013
© Diodes Incorporated
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