Diodes SDM1L30BLP User Manual

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Product Summary

(V)

V

V

(V) IO (A)

RRM

30 1 0.42 1

F MAX

@ +25°C

I

R MAX

@ +25°C

(mA)

Description and Applications

Packaged in the compact DFN5060-4 the SDM1L30BLP has been

designed with low forward voltage and soft switching characteristics

to meet the needs of wireless charging applications.

Top View

Device Schematic

Green

SDM1L30BLP

1.0A SURFACE MOUNT SCHOTTKY BRIDGE

Features

 Low profile package, ideal for thin portable applications

 Low Forward Voltage Drop reduces power dissipation

 Soft switching characteristic ensures that EMI and EFI are

minimised

 Guard Ring Die Construction for transient Protection

 Lead-Free Finish; RoHS Compliant (Notes 1 & 2)

 Halogen and Antimony Free. “Green” Device (Note 3)

 Qualified to AEC-Q101 Standards for High Reliability

Mechanical Data

 Case: V-DFN5060-4

 Case Material: Molded Plastic, “Green” Molding Compound. UL

Flammability Classification Rating 94V-0

 Moisture Sensitivity: Level 1 per J-STD-020

 Terminals: Finish - Matte Tin annealed over Copper leadframe.

Solderable per MIL-STD-202, Method 208

 Polarity: See Diagram

 Weight: 0.0715 grams (approximate)

Top View Bottom View

Ordering Information

Part Number Case Packaging

SDM1L30BLP-13 V-DFN5060-4 3000/Tape & Reel

Notes: 1. EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant. All applicable RoHS exemptions applied.

2. See http://www.diodes.com/quality/lead_free.html for more information about Diodes Incorporated’s definitions of Halogen- and Antimony-free, "Green"
and Lead-free.

3. Halogen- and Antimony-free "Green” products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and
<1000ppm antimony compounds.

4. For packaging details, go to our website at http://www.diodes.com/products/packages.html.

(Note 4)

Marking Information

Date Code Key

Year 2012 2013 2014 2015 2016 2017 2018

Code Z A B C D E F

Month Jan Feb Mar Apr May Jun Jul Aug Sep Oct Nov Dec

Code 1 2 3 4 5 6 7 8 9 O N D

SDM1L30BLP

Document number: DS35906 Rev. 6 - 2

SD3S

YM

www.diodes.com

D3 = Product Type Marking Code

SS
YM = Date Code Marking
Y = Year (ex: W =2012)
M = Month (ex: 9 = September)

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P

P

OWER

PATIO

Maximum Ratings (@T

Single phase, half wave, 60Hz, resistive or inductive load.
For capacitance load, derate current by 20%.

Characteristic Symbol Value Unit

Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage

Average Rectified Output Current

Non-Repetitive Peak Forward Surge Current 8.3ms
Single Half Sine-Wave Superimposed on Rated Load (Per Diode)

= +25°C, unless otherwise specified.)

A

Thermal Characteristics

Characteristic Symbol Value Unit

Typical Thermal Resistance Junction to Case (Note 5)

Operating and Storage Temperature Range

SDM1L30BLP

V

RRM

V

RWM

V

RM

I

O

I

FSM

R

θJC

T

, T

J

STG

30 V

1.0 mA

50 A

15 °C/W

-55 to +150 °C

Electrical Characteristics (@T

= +25°C, unless otherwise specified.)

A

Characteristic Symbol Min Typ Max Unit Test Condition

I

Forward Voltage Drop (Per Diode)

Leakage Current (Note 6) (Per Diode)

Total Capacitance

Notes: 5. Device mounted on Polymide PCB with 1x recommended pad layout, with minimum recommended pad layout per http://www.diodes.com.

6. Short duration pulse test used to minimize self-heating effect.

V

F

I

R

C

T

—

— — 1.0 mA

— 90 — pF

1.6

0.21

0.31

10

1.4

1.2

N (W)

1.0

DISSI

0.8

0.1

1

—

0.42

T = 125°C

A

T = 85°C

A

T = 150°C

A

V

0.6

,

0.4

D

0.01

= 0.1A, TJ = +25°C

F

= 1.0A, TJ = +25°C

I

F

VR = 30V, TJ = +25°C

V

= 30V, f = 1.0MHz,

R

= +25°C

T

J

T = 25°C

A

T = -55°C

A

0.2

F

0.0
0 0.5 1 1.5 2 2.5 3 3.5

I AVERAGE FORWARD CURRENT (A)

F(AV)

Figure 1 Forward Power Dissipation

SDM1L30BLP

Document number: DS35906 Rev. 6 - 2

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I , INSTANTANEOUS FORWARD CURRENT (A)

0.001
0 0.1 0.2 0.3 0.4 0.5 0.6

V , INSTANTANEOUS FORWARD VOLTAGE (V)

F

Figure 2 Typical Forward Characteristics

November 2013

© Diodes Incorporated

NSTAN

TAN

O

U

GE C

URREN

T

C, TOT

CAPACITAN

C

RAG

O

RWARD CUR

RENT

mA)

S LEAKA

E

0.0001

R

I, I

0.00001

(A)

1000

T = 125°C

100

10

A

T = 85°C

A

1

T = 25°C

A

0.1

0.01

0.001

T = -55°C

A

0 5 10 15 20 25 30

V , INSTANTANEOUS REVERSE VOLTAGE (V)

R

Figure 3 Typical Reverse Characteristics

1.2

1.0

SDM1L30BLP

500

f = 1MHz

400

E (pF)

300

200

AL

T

100

0

0 5 10 15 20 25 30

V , DC REVERSE VOLTAGE (V)

Figure 4 Total Capacitance vs. Reverse Voltage

R

0.8

0.6

E F

0.4

0.2

F(AV)

I, AVE

0.0
0 25 50 75 100 125 150

T , AMBIENT TEMPERATURE (°C)

A

Figure 5 Forward Current Derating Curve

SDM1L30BLP

Document number: DS35906 Rev. 6 - 2

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Package Outline Dimensions

Please see AP02002 at http://www.diodes.com/datasheets/ap02002.pdf for latest version.

A

A

D
e

1

Pin #1 ID

E

4

1

A

L

b

3

Seating Plane

L

1

Suggested Pad Layout

Please see AP02001 at http://www.diodes.com/datasheets/ap02001.pdf for the latest version.

Y1

Z

C

Dimensions Value (in mm)

X (4x)

Y (4x)

SDM1L30BLP

Document number: DS35906 Rev. 6 - 2

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SDM1L30BLP

V-DFN5060-4

Dim Min Max Typ

A 0.75 0.85 0.80
A1 0 0.05 0.02
A3 - - 0.203

b 0.65 0.75 0.70

D 4.95 5.05 5.00

e - - 4.00

E 5.95 6.05 6.00

L 0.65 0.75 0.70

L1 0.05 0.15 0.10

All Dimensions in mm

C 4.00
X 0.75
Y 0.95

Y1 6.20

Z 4.75

November 2013

© Diodes Incorporated

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DIODES INCORPORATED MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARDS TO THIS DOCUMENT,
INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE
(AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION).

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without further notice to this document and any product described herein. Diodes Incorporated does not assume any liability arising out of the
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website, harmless against all damages.

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This document is written in English but may be translated into multiple languages for reference. Only the English version of this document is the
final and determinative format released by Diodes Incorporated.

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Diodes Incorporated products are specifically not authorized for use as critical components in life support devices or systems without the express
written approval of the Chief Executive Officer of Diodes Incorporated. As used herein:

A. Life support devices or systems are devices or systems which:

1. are intended to implant into the body, or

2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the

labeling can be reasonably expected to result in significant injury to the user.

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Customers represent that they have all necessary expertise in the safety and regulatory ramifications of their life support devices or systems, and
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representatives against any damages arising out of the use of Diodes Incorporated products in such safety-critical, life support devices or systems.

Copyright © 2013, Diodes Incorporated

www.diodes.com

SDM1L30BLP

SDM1L30BLP

Document number: DS35906 Rev. 6 - 2

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