Diodes SDM10M45SD User Manual

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Features

• Fast Switching Speed

• Ultra-Small Surface Mount Package

• For General Purpose Switching Applications

• High Conductance

• Lead Free/RoHS Compliant (Note 3)

• "Green" Device (Note 4 and 5)

Maximum Ratings @T

Characteristic Symbol Value Unit

Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage

RMS Reverse Voltage
Forward Continuous Current (Note 1)
Forward Surge Current @ t < 8.3ms

= 25°C unless otherwise specified

A

Top View

SDM10M45SD

SURFACE MOUNT SCHOTTKY BARRIER DIODE

Mechanical Data

• Case: SOT-26

• Case Material: Molded Plastic, "Green" Molding Compound,

Note 6. UL Flammability Classification 94V-0

• Moisture Sensitivity: Level 1 per J-STD-020D

• Terminals: Solderable per MIL-STD-202, Method 208

• Lead Free Plating (Matte Tin Finish annealed over Copper

leadframe).

• Polarity: See Diagram

• Marking Information: See Page 3

• Ordering Information: See Page 3

• Weight: 0.016 grams (approximate)

Device Schematic

V

V

V

R(RMS)

I

RRM

RWM

VR

IFM

FSM

45 V

40 V

100 mA

1.0 A

Thermal Characteristics

Characteristic Symbol Value Unit

Power Dissipation (Note 1)
Thermal Resistance Junction to Ambient Air (Note 1)
Operating and Storage Temperature Range

Electrical Characteristics @T

Characteristic Symbol Min Typ Max Unit Test Condition

Reverse Breakdown Voltage (Note 2)
Forward Voltage
Reverse Leakage Current (Note 2)
Total Capacitance

Notes: 1. Device mounted on FR-5 PCB 1.0 x 0.75 x 0.062 inch pad layout as shown on Diodes, Inc. suggested pad layout AP02001, which can be found on our
website at http://www.diodes.com/datasheets/ap02001.pdf.

SDM10M45SD

Document number: DS30386 Rev. 6 - 2

2. Short duration pulse test used to minimize self-heating effect.

3. No purposefully added lead.

4. Diodes Inc.'s "Green" policy can be found on our website at http://www.diodes.com/products/lead_free/index.php.

5. Product manufactured with Date Code 0627 (week 27, 2006) and newer are built with Green Molding Compound. Product manufactured prior to Date
Code 0627 are built with Non-Green Molding Compound and may contain Halogens or Sb2O3 Fire Retardants.

= 25°C unless otherwise specified

A

PD

R

JA

θ

TJ , T

STG

V

(BR)R

VF ⎯

IR ⎯

CT ⎯

1 of 3

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45

225 mW

-40 to +125

⎯

444

μA
pF

⎯ ⎯ ⎯ IR = 100μA

370 450 mV

0.07 1.0

6.0

°C/W

°C

IF = 10mA
VR = 10V
VR = 10V, f = 1.0MHz

July 2008

© Diodes Incorporated

T

T

O

US FORWAR

C

URRENT

C, TOT

CAPACITAN

C

F

RAGE REC

TIF

CUR

RENT

P

P

OWER

P

T

O

100

(mA)

10

D

1.0

T = 125ºC

A

T = 75ºC

A

T = 25ºC

A

T = -25ºC

A

1,000

100

10

1.0

SDM10M45SD

ANE
AN

F

0.1

I , INS

200 400

0

V , INSTANTANEOUS FORWARD VOLTAGE (V)

F

600 800

Fig. 1 Typi cal Forwar d C haracte r istics

1.0

100

T = 25C

°

j

)

f = 1MHz

0.1

0.01
0

V , INSTANTANEOUS REVERSE VOLTAGE (V)

10

R

20 30 40

Fig. 2 Typical Reverse Characteristics

100

(mA)

80

E (p

60

IED

10

40

AL

T

1.0
01510 25

5

V , DC REVERSE VOLTAGE (V)

R

30 3520

Fig. 3 Total Cap acitance vs. Revers e Voltage, Per Elem ent

250

40

20

,

O

I AVE

T = 125 C

j

°

0

0

25 50

T , AMBIENT TEMPERATURE ( C)

A

75

100

Fig. 4 Forward Current Derating Curve (Per Element)

125

°

150

200

N (mW)
I

150

A

DISSI

100

,

50

D

0

0100

T , AMBIENT TEMPERATURE ( C)

A

Fig. 5 Power Derating Curve

SDM10M45SD

Document number: DS30386 Rev. 6 - 2

200

°

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July 2008

© Diodes Incorporated