Diodes SDM10K45 User Manual

)
θ
(BR)
Features
Fast Switching Speed
Ultra-Small Surface Mount Package
For General Purpose Switching Applications
High Conductance
Lead, Halogen and Antimony Free, RoHS Compliant "Green"
Device (Notes 3 and 4)
Qualified to AEC-Q101 Standards for High Reliability
SURFACE MOUNT SCHOTTKY BARRIER DIODE
Mechanical Data
Case: SOD-323
Case Material: Molded Plastic. UL Flammability Classification
Rating 94V-0
Moisture Sensitivity: Level 1 per J-STD-020
Terminals: Matte Tin Finish annealed over Alloy 42 leadframe
(Lead Free Plating).Solderable per MIL-STD-202, Method 208
Polarity: Cathode Band
Marking Information: See Page 2
Ordering Information: See Page 2
Weight: 0.006 grams (approximate)
Top View
SDM10K45
Maximum Ratings @T
= 25°C unless otherwise specified
A
Characteristic Symbol Value Unit
V
Peak Repetitive Reverse Voltage Working Peak Reverse Voltage DC Blocking Voltage
RMS Reverse Voltage Forward Continuous Current (Note 1) Forward Surge Current @ t < 8.3ms
V
V
R(RMS
I
RRM RWM
V
I
FM
FSM
R
45 V
40 V
100 mA
1.0 A
Thermal Characteristics
Characteristic Symbol Value Unit
Power Dissipation (Note 1) Thermal Resistance Junction to Ambient Air (Note 1) Operating and Storage Temperature Range (Note 5)
P
D
R
JA
, T
T
J
STG
Electrical Characteristics @T
= 25°C unless otherwise specified
A
Characteristic Symbol Min Typ Max Unit Test Condition
Reverse Breakdown Voltage (Note 2) Forward Voltage Reverse Leakage Current (Note 2) Total Capacitance
Notes: 1. Device mounted on FR-5 PCB 1.0 x 0.75 x 0.062 inch pad layout as shown on Diodes, Inc. suggested pad layout AP02001, which can be found on our website at http://www.diodes.com/datasheets/ap02001.pdf
2. Short duration pulse test used to minimize self-heating effect.
3. No purposefully added lead. Halogen and Antimony Free.
4. Product manufactured with Data Code V9 (week 33, 2008) and newer are built with Green Molding Compound. Product manufactured prior to Date Code
V
V
F
I
R
C
T
V9 are built with Non-Green Molding Compound and may contain Halogens or Sb
SDM10K45
Document number: DS30256 Rev. 15 - 2
5. The heat generated must be less than the thermal conductivity from Junction-to-Ambient: dPD/dTJ < 1/R
1 of 4
www.diodes.com
45
R
⎯ ⎯ ⎯
370 450 mV
0.07 1.0
6.0
Fire Retardants.
2O3
200 mW 500
-40 to +150
= 100μA
I
R
°C/W
°C
IF = 10mA
μA
VR = 10V
θJA
pF
VR = 10V, f = 1.0MHz
June 2010
© Diodes Incorporated
RAG
R
C
T
F
CUR
RENT
N
T
N
TANEO
US FORWARD CUR
REN
T
C, TOT
CAPACITANC
F
SDM10K45
100
(mA)
80
60
IED I
E
40
E
100
(mA)
T = 125ºC
A
T = 75ºC
A
10
T = 25ºC
A
T = -25ºC
1.0
A
20
O,
I AVE
1000
T = 150 C
°
J
0
0
25
50 75 100 125 150
T , AMBIENT TEMPERATURE ( C)
A
°
Fig. 1 Forward Current Derating Curve
A S
F
0.1
I, I
0 200 400 600 800
V , INSTANTANEOU S FORWARD VOLTAGE ( V)
F
Fig. 2 Typical Forward Characteristics
100
1.0
100
) E (p
10
10
1.0 AL
0.1
0.01 0
V , INSTANTANEOUS REVERSE VOLTAGE (V)
10
R
20 30
Fig. 3 Typical Reverse Characteristics
40
T
1.0
Ordering Information (Note 6)
Part Number Case Packaging
SDM10K45-7-F SOD-323 3000/Tape & Reel
Notes: 6. For packaging details, go to our website at http://www.diodes.com/datasheets/ap02007.pdf.
5.0
01510 25
V , REVERSE VOLTAGE (V)
R
20 40
30
Fig. 4 Total Capacitance vs. Reverse Voltage
35
Marking Information
LG
SDM10K45
Document number: DS30256 Rev. 15 - 2
www.diodes.com
LG = Product Type Marking Code Cathode band denotes polarity
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June 2010
© Diodes Incorporated
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