Diodes SBR1U200P1 User Manual

Page 1
θ
θ
Features
Ultra Low Forward Voltage Drop
Low Leakage Current
Superior Reverse Avalanche Capability
Excellent High Temperature Stability
Patented Interlocking Clip Design for High Surge Current
Capacity
Patented Super Barrier Rectifier Technology
Soft, Fast Switching Capability
150ºC Operating Junction Temperature
Lead Free Finish, RoHS Compliant (Note 1)
“Green” Molding Compound (No Br, Sb)
NEW PRODUCT
SBR1U200P1
SURFACE MOUNT SUPER BARRIER RECTIFIER
Mechanical Data
Case: PowerDI®123
Case Material: Molded Plastic, “Green” Molding Compound.
UL Flammability Classification Rating 94V-0
Moisture Sensitivity: Level 1 per J-STD-020
Polarity Indicator: Cathode Band
Terminals: Finish - Matte Tin annealed over Copper leadframe.
Solderable per MIL-STD-202, Method 208
Marking Information: See Page 3
Ordering Information: See Page 3
Weight: 0.018 grams (approximate)
Top View
1.0A SBR
PowerDI
®
123
®
Maximum Ratings @T
= 25°C unless otherwise specified
A
Single phase, half wave, 60Hz, resistive or inductive load. For capacitance load, derate current by 20%.
Characteristic Symbol Value Unit
V
Peak Repetitive Reverse Voltage Working Peak Reverse Voltage DC Blocking Voltage
Average Rectified Output Current (See Figure 1) Non-Repetitive Peak Forward Surge Current 8.3ms
Single Half Sine-Wave Superimposed on Rated Load
V
V
I
RRM
RWM
RM
I
O
FSM
200 V
1.0 A 40 A
Thermal Characteristics
Characteristic Symbol Value Unit
Maximum Thermal Resistance Junction to Ambient (Note 2) Maximum Thermal Resistance Junction to Ambient (Note 3) Operating and Storage Temperature Range
R
JA
R
JA
, T
T
J
STG
Electrical Characteristics @T
= 25°C unless otherwise specified
A
Characteristic Symbol Min Typ Max Unit Test Condition
Forward Voltage Reverse Current (Note 4) Reverse Recovery Time
Notes: 1. EU Directive 2002/95/EC (RoHS). All applicable RoHS exemptions applied, see EU Directive 2002/95/EC Annex Notes.
2. FR-4 PCB, 2 oz. Copper, minimum recommended pad layout per http://www.diodes.com/datasheets/ap02001.pdf.
3. Polymide PCB, 2 oz. Copper, minimum recommended pad layout per http://www.diodes.com/datasheets/ap02001.pdf.
4. Short duration pulse test used to minimize self-heating effect.
V
F
I
R
t
rr
SBR1U200P1
Document number: DS32093 Rev. 2 - 2
-
-
- - 50
- - 25 ns
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0.75
0.60
0.82
0.68
217 ºC/W 138 ºC/W
-65 to +175 ºC
= 1.0A, TJ = 25ºC
I
F
V
μA
= 1.0A, TJ = 125ºC
I
F
VR = 200V, TJ = 25ºC
= 0.5A, IR = 1A,
I
F
I
= 0.25A,
RR
August 2010
© Diodes Incorporated
Page 2
P
P
OWER
PATIO
NSTAN
TANEO
US FORWARD CUR
REN
T
TANT
O
US R
R
CUR
RENT
C, TOT
CAPACITANC
F
NEW PRODUCT
1.0
0.9
1
(A)
SBR1U200P1
0.8
N (W)
0.7
0.6
0.5
0.1
0.01
T = 150°C
A
T = 125°C
A
DISSI
0.4
0.3
,
D
0.2
0.001
T = 85°C
A
T = 25°C
A
0.1
F
0
0 0.5 1.0 1.5 2.0
I , AVERAGE FORWARD CURRENT (A)
F(AV)
Fig. 1 Forward Power Dissipation
1,000
(µA)
100
SE
10
T = 150°C
A
T = 125°C
A
I, I
0.0001
1,000
) E (p
0 100 200 300 400 500 600 700 800 900
V , INSTANTANEOUS FORWARD VOLTAGE (mV)
F
Fig. 2 Typical Forward Characteristics
f=1MHz
EVE
T = 85°C
A
1
ANE
T = 25°C
A
0.1
R
I , INS
0.01 0 40 80 120 160 200
V , INSTANTANEOUS REVERSE VOLT AGE (V)
R
Fig. 3 Typical Reverse Characteristics
1.2
1.0
Note 3
100
AL
T
10
0.1 1 10 100 V , DC REVERSE VOLTAGE (V)
R
Fig. 4 Total Capacitance vs. Reverse Voltage
175
150
125
0.8
100
0.6
75
0.4
50
0.2
F(AV)
I , AVERAGE FORWARD CURRENT (A)
0
0 25 50 75 100 125 150
T , AMBIENT TEMPERATURE (°C)
A
Fig. 5 Forward Current Derating Curve
25
A
T , DERATED AMBIENT TEMPERATURE (°C)
0
0 20 40 60 80 100 120 140 160 180 200
V , DC REVERSE VOL TAGE (V)
R
Fig. 6 Operating Temperature Derating
SBR1U200P1
Document number: DS32093 Rev. 2 - 2
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August 2010
© Diodes Incorporated
Page 3
Ordering Information (Note 5)
Part Number Case Packaging
SBR1U200P1-7 PowerDI®123 3000/Tape & Reel
Notes: 5. For packaging details, go to our website at http://www.diodes.com/datasheets/ap02007.pdf.
Marking Information
NEW PRODUCT
Date Code Key
Year 2009 2010 2011 2012 2013 2014 2015
Code W X Y Z A B C
Month Jan Feb Mar Apr May Jun Jul Aug Sep Oct Nov Dec
Code 1 2 3 4 5 6 7 8 9 O N D
SCD
YM
SDC = Product Type Marking Code YM = Date Code Marking Y = Year (ex: X = 2010) M = Month (ex: 9 = September)
SBR1U200P1
Package Outline Dimensions
C
D
L
E
Suggested Pad Layout
Y2
X1
B
L1
L2
A
GX2
E
H
Dimensions Value (in mm)
Y1
PowerDI®123
Dim Min Max Typ
A 3.50 3.90 3.70 B 2.60 3.00 2.80 C 1.63 1.93 1.78 D 0.93 1.00 0.98 E 0.85 1.25 1.00 H 0.15 0.25 0.20
L 0.55 0.75 0.65 L1 1.80 2.20 2.00 L2 0.95 1.25 1.10
All Dimensions in mm
G 1.0 X1 2.2 X2 0.9 Y1 1.4 Y2 1.4
SBR1U200P1
Document number: DS32093 Rev. 2 - 2
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August 2010
© Diodes Incorporated
Page 4
DIODES INCORPORATED MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARDS TO THIS DOCUMENT, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION).
Diodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes without further notice to this document and any product described herein. Diodes Incorporated does not assume any liability arising out of the application or use of this document or any product described herein; neither does Diodes Incorporated convey any license under its patent or trademark rights, nor the rights of others. Any Customer or user of this document or products described herein in such applications shall assume all risks of such use and will agree to hold Diodes Incorporated and all the companies whose products are represented on Diodes Incorporated website, harmless against all damages.
Diodes Incorporated does not warrant or accept any liability whatsoever in respect of any products purchased through unauthorized sales channel. Should Customers purchase or use Diodes Incorporated products for any unintended or unauthorize d application, Customers shall indemnify and hold Diodes Incorporated and its representatives harmless against all claims, damages, expenses, and attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized application.
Products described herein may be covered by one or more United States, international or foreign patents pending. Product names and markings noted herein may also be covered by one or more United States, international or foreign trademarks.
NEW PRODUCT
Diodes Incorporated products are specifically not authorized for use as critical components in life support devices or systems without the express written approval of the Chief Executive Officer of Diodes Incorporated. As used herein:
A. Life support devices or systems are devices or systems which:
1. are intended to implant into the body, or
labeling can be reasonably expected to result in significant injury to the user. B. A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the
failure of the life support device or to affect its safety or effectiveness. Customers represent that they have all necessary expertise in the safety and regulatory ramifications of their life support devices or systems, and
acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any use of Diodes Incorporated products in such safety-critical, life support devices or systems, notwithstanding any devices- or systems-related information or support that may be provided by Diodes Incorporated. Further, Customers must fully indemnify Diodes Incorporated and its representatives against any damages arising out of the use of Diodes Incorporated products in such safety-critical, life support devices or systems.
Copyright © 2010, Diodes Incorporated
www.diodes.com
2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the
IMPORTANT NOTICE
LIFE SUPPORT
SBR1U200P1
SBR1U200P1
Document number: DS32093 Rev. 2 - 2
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August 2010
© Diodes Incorporated
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