Diodes SBR0220LP User Manual
Features
• Low Leakage Current
• Patented Super Barrier Rectifier Technology
cellent High Temperature Stability
• Ex
• Soft, Fast Sw
• 150ºC Operating Junction Temperature
• Lead Free Finish, RoHS Compliant (Note 1)
Green” Molding Compound (No Br, Sb)
• “
• Qualified to A
NEW PRODUCT
Maximum Ratings @T
Single phase, half wave, 60Hz, resistive or inductive load.
For capacitance load, derate current by 20%.
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
RMS Reverse Voltage
Average Rectified Output Current (See Figure 1)
Non-Repetitive Peak Forward Surge Current 8.3ms
Single Half Sine-Wave Superimposed on Rated Load
itching Capability
EC-Q101 Standards for High Reliability
= 25°C unless otherwise specified
A
Characteristic Symbol Value Unit
Mechanical Data
• Case: DFN1006-2
Top View Bottom View
• Case Material: Molded Plastic, “Green” Molding Compound.
UL F
lammability Classification Rating 94V-0
• Moisture Sensitivity
• Polarity
Indicator: Cathode Dot
• Terminals: Finish - NiPdAu over Copper leadframe. Solderable
per MIL-STD-202, Method 208
• Marking Information: See Page 3
• Ordering Information: See Page 3
• Weight: 0.001 grams (approximate)
V
RRM
V
RWM
V
RM
V
R(RMS)
I
O
I
FSM
SBR0220LP
0.2A SBR
®
SUPER BARRIER RECTIFIER
: Level 1 per J-STD-020D
20 V
14 V
0.2 A
5.0 A
Thermal Characteristics
Maximum Thermal Resistance
Thermal Resistance Junction to Soldering (Note 2)
Thermal Resistance Junction to Ambient (Note 3)
Operating and Storage Temperature Range
Electrical Characteristics @T
Characteristic Symbol Min Typ Max Unit Test Condition
Reverse Breakdown Voltage (Note 4)
Forward Voltage Drop
Leakage Current (Note 4)
Notes: 1. RoHS revision 13.2.2003. High temperature solder exemption applied, see EU Directive Annex Note 7.
2. Theoretical R
3. FR-4 PCB, 2oz. Copper, minimum recommended pad layout per http://www.
4. Short duration pulse test used to minimize self-heating effect.
SBR is a registered trademark of Diodes Incorporated.
SBR0220LP
Document number: DS31062 Rev. 5 - 2
Characteristic Symbol Value Unit
R
JS
θ
R
JA
θ
T
, T
J
STG
= 25°C unless otherwise specified
A
V
(BR)R
V
F
I
R
calculated from the top center of the die straight down to the PCB cathode tab solder junction.
θJS
20 - - V
0.38
-
0.30
0.44
0.38
-
2
0.43
0.42
0.33
0.48
0.41
50
1.3
diodes.com/datasheets/ap02001.pdf.
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17
304
ºC/W
-65 to +150 ºC
I
= 400µA
R
I
= 0.1A, TJ = 25ºC
F
I
= 0.1A, TJ = 150ºC
V
µA
mA
F
= 0.2A, TJ = 25ºC
I
F
I
= 0.2A, TJ = 150ºC
F
V
= 20V, TJ = 25ºC
R
= 20V, TJ = 150ºC
V
R
March 2008
© Diodes Incorporated
P
P
OWER
P
TIO
0.4
0.3
N (W)
A
0.2
DISSI
,
D
0.1
NEW PRODUCT
0
0 0.1 0.2 0.3 0.4 0.5 0.6
I , AVERAGE FORWARD CURRENT (A)
F(AV)
Fig. 1 Forward Power Dissipation
T =150°C
J
SBR0220LP
1,000
100
10
1
F
I , INSTANTANEOUS FORWARD CURRENT (mA)
0.1
0 0.2 0.4 0.6
V , INSTANTANE OUS FORWA RD VOLTAG E ( V)
F
Fig.2 Typical Forward Characteristics
0 5 10 15 20
Fig. 4 Total Capacitance vs. Reverse Voltage
0.25
Note 3
0.2
0.15
0.1
0.05
F(AV)
I , AVERAGE FORWARD CURRENT(A)
0
0 25 50 75 100 125 150
T , AMBIENT TEMPERA TURE (°C)
A
Fig. 5 Forward Current Derating Curve
BR is a registered trademark of Diodes Incorporated.
S
SBR0220LP
Document number: DS31062 Rev. 5 - 2
175 200
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March 2008
© Diodes Incorporated
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