Diodes RH02, RH06 User Manual

Features

Glass Passivated Die Construction

·

Low Forward Voltage Drop

·

Surge Overload Rating to 30A Peak

·

Ideally Suited for Automatic Assembly

·

Miniature Package Saves Space on PC Boards

·

Lead Free Finish, RoHS Compliant (Note 4)

·

Mechanical Data

Case: MiniDIP

·

Case Material: Molded Plastic. UL Flammability

·

Classification Rating 94V-0

Terminals: Finish ¾ Bright Tin. Plated Leads, Solderable

·

per MIL-STD-202, Method 208

Polarity: As Marked on Case

·

Marking: Type Number

·

Weight: 0.125 grams (approx.)

·

RH02 - RH06

0.5A SURFACE MOUNT GLASS PASSIVATED FAST
RECOVERY BRIDGE RECTIFIER

MiniDIP

L

B

H

J

F

G

D E

C

K

Dim Min Max

3.6 4.0

B

0.15 0.35

C

D

E

F

G

H

J

K

L

All Dimensions in mm

¾ 0.20

¾ 7.0

¾ 3.00

0.70 1.10

4.5 4.9

2.3 2.7

2.3 2.7

0.50 0.80

Maximum Ratings and Electrical Characteristics

Characteristic Symbol RH02 RH04 RH06 Unit

Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage

RMS Reverse Voltage

Average Forward Rectified Current (Note 1) TA= @ 40°C

Non-Repetitive Peak Forward Surge Current, 8.3 ms
Single half-sine-wave Superimposed on Rated Load
(JEDEC method)

Instantaneous Voltage Drop @ 0.4A (per element)

Peak Reverse Current at Rated @ TA= 25°C
DC Blocking Voltage (per element) @ T

Maximum Reverse Recovery Time (Note 3)

Typical Junction Capacitance (per element) (Note 2)

Typical Thermal Resistance, Junction to Ambient (Note 1)

Operating and Storage Temperature Range

Notes: 1. Mounted on Glass Epoxy PC Board.

2. Measured at 1.0 MHz and Applied Reverse Voltage of 4.0 V.
test conditions: IF= 0.5A, IR= 1.0A, Irr= 0.25A.

3. t

rr

4. RoHS revision 13.2.2003. Glass and High Temperature Solder Exemptions Applied, see

= 125°C

A

V

RMM

V

RWM

V

V

RMS

I

I

FSM

V

I

t

C

R

T

j,TSTG

DC

O

F

R

rr

j

qJA

@ TA= 25°C unless otherwise specified

200 400 600 V

140 280 420 V

0.5 A

30 A

1.15 V

5.0

100

150 250 ns

13.0 pF

85 K/W

-55 to +150 °C

EU Directive Annex Notes 5 and 7

.

mA

DS30137 Rev. 6 - 2 1 of 3 RH02 - RH06

www.diodes.com

ã Diodes Incorporated

10

g

g)

3

g

g)

100

g

g

)

0.8

)

g

Alumina Substrate

0.6

0.4

Glass Epoxy PC Board

0.2

Resistive or Inductive Load

0

(AV)

I , AVERAGE FORWARD RECTIFIED CURRENT (A

0 40 80 120 160

T , AMBIENT TEMPERATURE ( C)

A

. 1 Output Current DeratingCurve

Fi

1.0

0.1

F

I , INSTANTANEOUS FORWARD CURRENT (A)

0.01

0.2 0.6 1.0 1.4

0.4 0.8 1.2 1.6

°

V , INSTANTANEOUS FORWARD VOLTAGE (V)

F

.2Typical Forward Characteristics(per le

Fi

5

T=25C

°

j

f = 1.0MHz

30

20

10

10

T = 25 C

°

A

Single Half Sine-Wave
Pulse Width = 5.3ms
(JEDEC Method)

FSM

0

I , PEAK FORWARD SURGE CURRENT (A)

1.0 10

NUMBER OF CYCLES AT 60 Hz

. 3 Maximum Peak Forward Surge Current(per le

Fi

j

C , JUNCTION CAPACITANCE (pF)

1

1 10 100

V , REVERSE VOLTAGE (V)

R

.4 Typical Junction Capacitance

Fi

100

T = 125 C

°

10

j

1.0

0.1

T=25Cj°

0.01
0 20 40 60 80 100 120 140

PERCENT OF RATED PEAK REVERSE VOLTAGE (%)

Fi

.5 Typical Reverse Characteristics(per element

DS30137 Rev. 6 - 2 2 of 3 RH02 - RH06

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