Features
• Epitaxial Planar Die Construction
• Complementary PNP Type Available
(MMSTA63/MMSTA64)
• Ideal for Low Power Amplification and Switching
• High Current Gain
• Ultra-Small Surface Mount Package
• Lead Free/RoHS Compliant (Note 2)
• "Green" Device (Note 3 and 4)
Mechanical Data
• Case: SOT-323
• Case Material: Molded Plastic, "Green" Molding
Compound, Note 4. UL Flammability Classification
Rating 94V-0
• Moisture Sensitivity: Level 1 per J-STD-020C
• Terminal Connections: See Diagram
• Terminals: Solderable per MIL-STD-202, Method 208
• Lead Free Plating (Matte Tin Finish annealed over Alloy
42 leadframe).
• MMSTA13 Marking K2D, K3D, See Page 3
• MMSTA14 Marking K3D, See Page 3
• Ordering & Date Code Information: See Page 3
• Weight: 0.006 grams (approximate)
BE
K
J
B
MMSTA13/MMSTA14
NPN SURFACE MOUNT DARLINGTON TRANSISTOR
A
C
G
H
C
C
B
M
L
ED
E
SOT-323
Dim Min Max
A 0.25 0.40
B 1.15 1.35
C 2.00 2.20
D 0.65 Nominal
E 0.30 0.40
G 1.20 1.40
H 1.80 2.20
J 0.0 0.10
K 0.90 1.00
L 0.25 0.40
M 0.10 0.18
α
All Dimensi mm ons in
0° 8°
Maximum Ratings @T
Characteristic Symbol Value Unit
Collector-Base Voltage
Collector-Emitter Voltage
Emitter-Base Voltage
Collector Current - Continuous (Note 1)
Power Dissipation (Note 1)
Thermal Resistance, Junction to Ambient (Note 1)
Operating and Storage Temperature Range
Notes: 1. Device mounted on FR-4 PCB, 1 inch x 0.85 inch x 0.062 inch; pad layout as shown on Diodes Inc. suggested pad layout document AP02001,
which can be found on our website at http://www.diodes.com/datasheets/ap02001.pdf.
2. No purposefully added lead.
3. Diodes Inc.'s "Green" policy can be found on our website at http://www.diodes.com/products/lead_free/index.php.
4. Product manufactured with Date Code 0627 (week 27, 2006) and newer are built with Green Molding Compound. Product manufactured prior to
Code 0627 are built with Non-Green Molding Compound and may contain Halogens or Sb2O3 Fire Retardants.
DS30165 Rev. 9 - 2 1 of 3
= 25°C unless otherwise specified
A
V
CBO
V
CEO
V
EBO
I
C
P
R
θ
Tj, T
www.diodes.com
d
JA
STG
30 V
30 V
10 V
300 mA
200 mW
625 °C/W
-55 to +150
MMSTA13/MMSTA14
© Diodes Incorporated
°C
Electrical Characteristics @T
= 25°C unless otherwise specified
A
Characteristic Symbol Min Max Unit Test Condition
OFF CHARACTERISTICS (Note 5)
Collector-Emitter Breakdown Voltage
Collector Cutoff Current
Emitter Cutoff Current
V
(BR)CEO
I
CBO
I
EBO
30
⎯
⎯
⎯
V
100 nA
100 nA
IC = 100μA VBE = 0V
VCB = 30V, IE = 0
V
= 10V, IC = 0
EB
ON CHARACTERISTICS (Note 5)
DC Current Gain MMSTA13
MMSTA14
MMSTA13
MMSTA14
Collector-Emitter Saturation Voltage
Base-Emitter Saturation Voltage
h
V
CE(SAT)
V
BE(SAT)
5,000
10,000
FE
10,000
⎯ ⎯
20,000
⎯
⎯
1.5 V
2.0 V
IC = 10mA, VCE = 5.0V
IC = 10mA, V
CE
= 5.0V
IC = 100mA, VCE = 5.0V
IC = 100mA, V
CE
= 5.0V
IC = 100mA, IB = 100μA
IC = 100mA, VCE = 5.0V
SMALL SIGNAL CHARACTERISTICS
Output Capacitance
Input Capacitance
Current Gain-Bandwidth Product
Note: 5. Short duration pulse test used to minimize self-heating effect.
200
150
(mW)
100
DISSI
50
D
C
obo
C
ibo
f
T
EMI
LLE
CE(SAT)
V,
8.0 Typical pF
15 Typical pF
125
1.10
1.05
1.00
0.95
0.90
0.85
0.80
0.75
0.70
0.65
0.60
SATURATION VOLT AGE (V)
0.55
0.50
I
C
I
B
⎯
= 1000
MHz
T = 25°C
A
T = 150°C
A
VCB = 10V, f = 1.0MHz, IE = 0
VEB = 0.5V, f = 1.0MHz, IC = 0
VCE = 5.0V, IC = 10mA,
f = 100MHz
T = -50°C
A
0.45
0
0
25 50
T , AMBIENT TEMPERATURE (°C)
A
75
100 125
150
Fig. 1, Max Power Dissi pation vs. Ambient Te m perature
175
200
1,000,000
100,000
E
10,000
FE
h,
1,000
100
1
Fig. 3, DC Current Gain vs. Collector Current
10 1,000
I , COLLECTOR CURRENT (mA)
C
100
DS30165 Rev. 9 - 2 2 of 3
www.diodes.com
0.40
1
10
I , COLLECTOR CURRENT (mA)
C
100
1,000
Fig. 2, Collector Emitter Saturation Voltage vs. Collector Current
1.6
V = 5V
1.5
1.4
E (V)
1.3
A
1.2
1.1
1.0
E
CE
T = -50°C
A
T = 25°C
A
0.9
0.8
0.7
T = 150°C
A
0.6
0.5
0.4
BE(ON)
V , BASE E
0.3
0.2
0.1
1
I , COLLECTOR CURRENT (mA)
C
10
100
Fig. 4, Base Emitter Voltage vs. Collector Current
MMSTA13/MMSTA14
© Diodes Incorporated