Diodes MMSTA14 User Manual

Features

Epitaxial Planar Die Construction
Complementary PNP Type Available
(MMSTA63/MMSTA64)
High Current Gain
Ultra-Small Surface Mount Package
Lead Free/RoHS Compliant (Note 2)
"Green" Device (Note 3 and 4)

Mechanical Data

Case: SOT-323
Case Material: Molded Plastic, "Green" Molding
Compound, Note 4. UL Flammability Classification Rating 94V-0
Moisture Sensitivity: Level 1 per J-STD-020C
Terminal Connections: See Diagram
Terminals: Solderable per MIL-STD-202, Method 208
Lead Free Plating (Matte Tin Finish annealed over Alloy
42 leadframe).
MMSTA13 Marking K2D, K3D, See Page 3
MMSTA14 Marking K3D, See Page 3
Ordering & Date Code Information: See Page 3
Weight: 0.006 grams (approximate)
BE
K
J
B
MMSTA13/MMSTA14
NPN SURFACE MOUNT DARLINGTON TRANSISTOR
A C
G H
C
C
B
M
L
ED
E
SOT-323
Dim Min Max
A 0.25 0.40 B 1.15 1.35 C 2.00 2.20 D 0.65 Nominal E 0.30 0.40 G 1.20 1.40 H 1.80 2.20 J 0.0 0.10 K 0.90 1.00 L 0.25 0.40 M 0.10 0.18 α
All Dimensi mm ons in
0° 8°
Maximum Ratings @T
Characteristic Symbol Value Unit
Collector-Base Voltage Collector-Emitter Voltage Emitter-Base Voltage Collector Current - Continuous (Note 1) Power Dissipation (Note 1) Thermal Resistance, Junction to Ambient (Note 1) Operating and Storage Temperature Range
Notes: 1. Device mounted on FR-4 PCB, 1 inch x 0.85 inch x 0.062 inch; pad layout as shown on Diodes Inc. suggested pad layout document AP02001, which can be found on our website at http://www.diodes.com/datasheets/ap02001.pdf.
2. No purposefully added lead.
3. Diodes Inc.'s "Green" policy can be found on our website at http://www.diodes.com/products/lead_free/index.php.
4. Product manufactured with Date Code 0627 (week 27, 2006) and newer are built with Green Molding Compound. Product manufactured prior to Code 0627 are built with Non-Green Molding Compound and may contain Halogens or Sb2O3 Fire Retardants.
DS30165 Rev. 9 - 2 1 of 3
= 25°C unless otherwise specified
A
V
CBO
V
CEO
V
EBO
I
C
P
R
θ
Tj, T
www.diodes.com
d
JA
STG
30 V 30 V
10 V 300 mA 200 mW 625 °C/W
-55 to +150
MMSTA13/MMSTA14
© Diodes Incorporated
°C
P, P
OWER
PATIO
N
C
O
CTO
R T
O
T
TER
D
C
CUR
R
N
T
GAIN
MIT
T
R VOLT
G
Electrical Characteristics @T
= 25°C unless otherwise specified
A
Characteristic Symbol Min Max Unit Test Condition
OFF CHARACTERISTICS (Note 5)
Collector-Emitter Breakdown Voltage Collector Cutoff Current Emitter Cutoff Current
V
(BR)CEO
I
CBO
I
EBO
30
⎯ ⎯
V 100 nA 100 nA
IC = 100μA VBE = 0V VCB = 30V, IE = 0 V
= 10V, IC = 0
EB
ON CHARACTERISTICS (Note 5)
DC Current Gain MMSTA13 MMSTA14 MMSTA13 MMSTA14
Collector-Emitter Saturation Voltage Base-Emitter Saturation Voltage
h
V
CE(SAT)
V
BE(SAT)
5,000
10,000
FE
10,000
20,000
⎯ ⎯
1.5 V
2.0 V
IC = 10mA, VCE = 5.0V IC = 10mA, V
CE
= 5.0V IC = 100mA, VCE = 5.0V IC = 100mA, V
CE
= 5.0V IC = 100mA, IB = 100μA IC = 100mA, VCE = 5.0V
SMALL SIGNAL CHARACTERISTICS
Output Capacitance Input Capacitance
Current Gain-Bandwidth Product
Note: 5. Short duration pulse test used to minimize self-heating effect.
200
150
(mW)
100
DISSI
50
D
C
obo
C
ibo
f
T
EMI
LLE
CE(SAT)
V,
8.0 Typical pF 15 Typical pF
125
1.10
1.05
1.00
0.95
0.90
0.85
0.80
0.75
0.70
0.65
0.60
SATURATION VOLT AGE (V)
0.55
0.50
I
C
I
B
= 1000
MHz
T = 25°C
A
T = 150°C
A
VCB = 10V, f = 1.0MHz, IE = 0 VEB = 0.5V, f = 1.0MHz, IC = 0 VCE = 5.0V, IC = 10mA,
f = 100MHz
T = -50°C
A
0.45
0
0
25 50
T , AMBIENT TEMPERATURE (°C)
A
75
100 125
150
Fig. 1, Max Power Dissi pation vs. Ambient Te m perature
175
200
1,000,000
100,000
E
10,000
FE
h,
1,000
100
1
Fig. 3, DC Current Gain vs. Collector Current
10 1,000
I , COLLECTOR CURRENT (mA)
C
100
DS30165 Rev. 9 - 2 2 of 3
www.diodes.com
0.40 1
10
I , COLLECTOR CURRENT (mA)
C
100
1,000
Fig. 2, Collector Emitter Saturation Voltage vs. Collector Current
1.6
V = 5V
1.5
1.4
E (V)
1.3
A
1.2
1.1
1.0
E
CE
T = -50°C
A
T = 25°C
A
0.9
0.8
0.7
T = 150°C
A
0.6
0.5
0.4
BE(ON)
V , BASE E
0.3
0.2
0.1
1
I , COLLECTOR CURRENT (mA)
C
10
100
Fig. 4, Base Emitter Voltage vs. Collector Current
MMSTA13/MMSTA14
© Diodes Incorporated
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