
Features
• Epitaxial Planar Die Construction
• Ideal for Medium Power Amplification and Switching
• Lead Free/RoHS Compliant (Note 3)
• "Green" Device, Note 4 and 5
Mechanical Data
• Case: SOT-26
• Case Material: Molded Plastic, "Green" Molding
Compound, Note 5. UL Flammability Classification
Rating 94V-0
• Moisture Sensitivity: Level 1 per J-STD-020C
• Terminal Connections: See Diagram
• Terminals: Finish - Matte Tin Solderable per
MIL-STD-202, Method 208
• Lead Free Plating (Matte Tin Finish annealed over
Copper leadframe).
• Marking Information: K3M, See Page 3
• Ordering & Date Code Information: See Page 3
• Weight: 0.008 grams (approximate)
MMDTA42
DUAL NPN SMALL SIGNAL SURFACE MOUNT TRANSISTOR
A
H
K
J
Q1
D
Q2
Dim Min Max Typ
SOT-26
A 0.35 0.50 0.38
C
B
B 1.50 1.70 1.60
C 2.70 3.00 2.80
D
F
⎯ ⎯
⎯ ⎯
0.95
0.55
H 2.90 3.10 3.00
M
J 0.013 0.10 0.05
K 1.00 1.30 1.10
L
F
L 0.35 0.55 0.40
M 0.10 0.20 0.15
0° 8°
α
All Dimens ons in mm i
⎯
Maximum Ratings @T
Characteristic
Collector-Base Voltage
Collector-Emitter Voltage
Emitter-Base Voltage
Collector Current (Note 1) (Note 2)
Power Dissipation (Note 1)
Thermal Resistance, Junction to Ambient (Note 1)
Operating and Storage Temperature Range
Notes: 1. Device mounted on FR-4 PCB, 1 inch x 0.85 inch x 0.062 inch; pad layout as shown on Diodes Inc. suggested pad layout document AP02001, which
can be found on our website at http://www.diodes.com/datasheets/ap02001.pdf.
2. When operated under collector-emitter saturation conditions within the safe operating area defined by the thermal resistance rating (R
dissipation rating (P
3. No purposefully added lead.
4. Diodes Inc.'s "Green" policy can be found on our website at http://www.diodes.com/products/lead_free/index.php.
5. Product manufactured with Date Code 0627 (week 27, 2006) and newer are built with Green Molding Compound. Product manufactured prior to Date
Code 0627 are built with Non-Green Molding Compound and may contain Halogens or Sb2O3 Fire Retardants.
= 25°C unless otherwise specified
A
) and power derating curve (Figure 1).
d
Symbol Value Unit
V
V
V
R
Tj, T
CBO
CEO
EBO
IC
Pd
JA
θ
STG
300 V
300 V
6.0 V
500 mA
300 mW
417 °C/W
-55 to +150
°C
), power
θJA
DS30438 Rev. 5 - 2 1 of 3
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MMDTA42
© Diodes Incorporated

Electrical Characteristics @T
= 25°C unless otherwise specified
A
Characteristic
OFF CHARACTERISTICS (Note 6)
Collector-Base Breakdown Voltage
Collector-Emitter Breakdown Voltage
Emitter-Base Breakdown Voltage
Collector Cutoff Current
Collector Cutoff Current
ON CHARACTERISTICS (Note 6)
DC Current Gain
Collector-Emitter Saturation Voltage
Base-Emitter Saturation Voltage
SMALL SIGNAL CHARACTERISTICS
Output Capacitance
Current Gain-Bandwidth Product
Notes: 6. Short duration pulse test used to minimize self-heating effect.
350
300
N (mW)
250
200
DISSI
150
100
D
50
0
0
25 50
T , AMBIENT TEMPERATURE (°C)
A
75 100 125
150
Fig. 1, Max Power Dissipation vs.
Ambient Temperature
10,000
V = 5V
CE
1,000
T = 150°C
AIN
A
EN
100
T = -50°C
FE
h, D
A
10
T = 25°C
A
1
1
10 1,000
I , COLLECTOR CURRENT (mA)
C
100
Fig. 3, DC Current Gain vs. Collector Current
175
Symbol Min Max Unit Test Condition
V
V
V
(BR)CBO
(BR)CEO
(BR)EBO
I
CBO
I
EBO
⎯
⎯
hFE
V
CE(SAT)
V
BE(SAT)
⎯
⎯
Ccb ⎯
fT
300
300
6.0
25
40
40
50
⎯
⎯
⎯
100 nA
100 nA
⎯ ⎯
0.5 V
0.9 V
3.0 pF
⎯
V
IC = 100μA, IE = 0
V
IC = 1.0mA, IB = 0
V
IE = 100μA, IC = 0
VCB = 200V, IE = 0
V
= 6.0V, IC = 0
CE
IC = 1.0mA, VCE = 10V
IC = 10mA, VCE = 10V
IC = 30mA, V
IC = 20mA, IB = 2.0mA
IC = 20mA, IB = 2.0mA
VCB = 20V, f = 1.0MHz, IE = 0
VCE = 20V, IC = 10mA,
MHz
f = 100MHz
CE
2.0
I
C
1.8
1.6
1.4
EMI
= 10
I
B
T = 150°C
A
1.2
LLE
1.0
0.8
T = 25°C
A
0.6
SATURATION VOLTAGE (V)
0.4
CE(SAT)
V,
0.2
200
0
110
I , COLLECTOR CURRENT (mA)
C
100
Fig. 2, Collector Emitter Saturation Voltage
vs. Collector Current
1.0
V = 5V
CE
0.9
E (V)
0.8
A
L
0.7
T = -50°C
A
0.6
0.5
T = 25°C
A
0.4
0.3
BE(ON)
V , BASE EMI
0.2
T = 150°C
A
0.1
0.1
Fig. 4, Bas e Emitter Voltage vs. Coll ector Current
110
I , COLLECTOR CURRENT (mA)
C
= 10V
T = -50°C
A
1,000
100
DS30438 Rev. 5 - 2 2 of 3
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MMDTA42
© Diodes Incorporated

100
z)
(M
10
AIN BANDWID
T
f,
1
1
I , COLLECTOR CURRENT (mA)
C
Fig. 5, Gain Bandwidth Product vs.
Collector Current
10
Ordering Information (Note 5 & 7 )
Device
MMDTA42-7-F SOT-26 3000/Tape & Reel
Notes: 7. For packaging details, go to our website at http://www.diodes.com/datasheets/ap02007.pdf.
Packaging Shipping
Marking Information
Date Code Key
Year 2004 2005 2006 2007 2008 2009 2010 2011 2012
Code R S T U V W X Y Z
Month Jan Feb Mar Apr May Jun Jul Aug Sep Oct Nov Dec
Code 1 2 3 4 5 6 7 8 9 O N D
Diodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes
without further notice to any product herein. Diodes Incorporated does not assume any liability arising out of the application or use of any product
described herein; neither does it convey any license under its patent rights, nor the rights of others. The user of products in such applications shall
assume all risks of such use and will agree to hold Diodes Incorporated and all the companies whose products are represented on our website,
harmless against all damages.
Diodes Incorporated products are not authorized for use as critical components in life support devices or systems without the expressed written
approval of the President of Diodes Incorporated.
K3M YM
K3M = Product Type Marking Code
YM = Date Code Marking
K3M YM
Y = Year ex: P = 2003
M = Month ex: 9 = Se
IMPORTANT NOTICE
LIFE SUPPORT
tembe
DS30438 Rev. 5 - 2 3 of 3
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MMDTA42
© Diodes Incorporated