Diodes MMDTA42 User Manual

Features

Epitaxial Planar Die Construction
Ideal for Medium Power Amplification and Switching
Lead Free/RoHS Compliant (Note 3)
"Green" Device, Note 4 and 5

Mechanical Data

Case: SOT-26
Case Material: Molded Plastic, "Green" Molding
Compound, Note 5. UL Flammability Classification Rating 94V-0
Moisture Sensitivity: Level 1 per J-STD-020C
Terminal Connections: See Diagram
Terminals: Finish - Matte Tin Solderable per
MIL-STD-202, Method 208
Lead Free Plating (Matte Tin Finish annealed over Copper leadframe).
Marking Information: K3M, See Page 3
Ordering & Date Code Information: See Page 3
Weight: 0.008 grams (approximate)
MMDTA42
DUAL NPN SMALL SIGNAL SURFACE MOUNT TRANSISTOR
A
H
K
J
Q1
D
Q2
Dim Min Max Typ
SOT-26
A 0.35 0.50 0.38
C
B
B 1.50 1.70 1.60 C 2.70 3.00 2.80 D F
⎯ ⎯
0.95
0.55
H 2.90 3.10 3.00
M
J 0.013 0.10 0.05 K 1.00 1.30 1.10
L
F
L 0.35 0.55 0.40 M 0.10 0.20 0.15
α
All Dimens ons in mm i
Maximum Ratings @T
Characteristic
Collector-Base Voltage Collector-Emitter Voltage Emitter-Base Voltage Collector Current (Note 1) (Note 2) Power Dissipation (Note 1) Thermal Resistance, Junction to Ambient (Note 1)
Operating and Storage Temperature Range
Notes: 1. Device mounted on FR-4 PCB, 1 inch x 0.85 inch x 0.062 inch; pad layout as shown on Diodes Inc. suggested pad layout document AP02001, which
can be found on our website at http://www.diodes.com/datasheets/ap02001.pdf.
2. When operated under collector-emitter saturation conditions within the safe operating area defined by the thermal resistance rating (R dissipation rating (P
3. No purposefully added lead.
4. Diodes Inc.'s "Green" policy can be found on our website at http://www.diodes.com/products/lead_free/index.php.
5. Product manufactured with Date Code 0627 (week 27, 2006) and newer are built with Green Molding Compound. Product manufactured prior to Date Code 0627 are built with Non-Green Molding Compound and may contain Halogens or Sb2O3 Fire Retardants.
= 25°C unless otherwise specified
A
) and power derating curve (Figure 1).
d
Symbol Value Unit
V V V
R
Tj, T
CBO CEO EBO
IC Pd
JA
θ
STG
300 V 300 V
6.0 V 500 mA 300 mW 417 °C/W
-55 to +150
°C
), power
θJA
DS30438 Rev. 5 - 2 1 of 3
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MMDTA42
P, P
OWER
PATIO
C
O
CTO
R T
O
T
TER
C C
URR
T
G
T
TER VO
T
G
Electrical Characteristics @T
= 25°C unless otherwise specified
A
Characteristic
OFF CHARACTERISTICS (Note 6)
Collector-Base Breakdown Voltage Collector-Emitter Breakdown Voltage Emitter-Base Breakdown Voltage Collector Cutoff Current Collector Cutoff Current
ON CHARACTERISTICS (Note 6)
DC Current Gain
Collector-Emitter Saturation Voltage Base-Emitter Saturation Voltage
SMALL SIGNAL CHARACTERISTICS
Output Capacitance Current Gain-Bandwidth Product
Notes: 6. Short duration pulse test used to minimize self-heating effect.
350
300
N (mW)
250
200
DISSI
150
100
D
50
0
0
25 50
T , AMBIENT TEMPERATURE (°C)
A
75 100 125
150
Fig. 1, Max Power Dissipation vs.
Ambient Temperature
10,000
V = 5V
CE
1,000
T = 150°C
AIN
A
EN
100
T = -50°C
FE
h, D
A
10
T = 25°C
A
1
1
10 1,000
I , COLLECTOR CURRENT (mA)
C
100
Fig. 3, DC Current Gain vs. Collector Current
175
Symbol Min Max Unit Test Condition
V V V
(BR)CBO (BR)CEO (BR)EBO
I
CBO
I
EBO
hFE
V
CE(SAT)
V
BE(SAT)
Ccb
fT
300 300
6.0
25 40 40
50
⎯ ⎯ ⎯
100 nA 100 nA
0.5 V
0.9 V
3.0 pF
V
IC = 100μA, IE = 0
V
IC = 1.0mA, IB = 0
V
IE = 100μA, IC = 0 VCB = 200V, IE = 0 V
= 6.0V, IC = 0
CE
IC = 1.0mA, VCE = 10V IC = 10mA, VCE = 10V IC = 30mA, V IC = 20mA, IB = 2.0mA IC = 20mA, IB = 2.0mA
VCB = 20V, f = 1.0MHz, IE = 0 VCE = 20V, IC = 10mA,
MHz
f = 100MHz
CE
2.0
I
C
1.8
1.6
1.4
EMI
= 10
I
B
T = 150°C
A
1.2
LLE
1.0
0.8
T = 25°C
A
0.6
SATURATION VOLTAGE (V)
0.4
CE(SAT)
V,
0.2
200
0
110
I , COLLECTOR CURRENT (mA)
C
100
Fig. 2, Collector Emitter Saturation Voltage
vs. Collector Current
1.0
V = 5V
CE
0.9
E (V)
0.8
A L
0.7
T = -50°C
A
0.6
0.5
T = 25°C
A
0.4
0.3
BE(ON)
V , BASE EMI
0.2
T = 150°C
A
0.1
0.1 Fig. 4, Bas e Emitter Voltage vs. Coll ector Current
110
I , COLLECTOR CURRENT (mA)
C
= 10V
T = -50°C
A
1,000
100
DS30438 Rev. 5 - 2 2 of 3
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MMDTA42
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