Page 1
Features
Epitaxial Planar Die Construction
Ideal for Medium Power Amplification and Switching
Ultra-Small Surface Mount Package
Totally Lead-Free & Fully RoHS compliant (Notes 1 & 2)
Halogen and Antimony Free. “Green” Device (Note 3)
Qualified to AEC-Q101 Standards for High Reliability
SOT363
Top View
MMDT3904
40V DUAL NPN SMALL SIGNAL TRANSISTOR IN SOT363
Mechanical Data
Case: SOT363
Case Material: Molded Plastic, “Green” Molding Compound,
UL Flammability Classification Rating 94V-0
Moisture Sensitivity: Level 1 per J-STD-020
Terminals: Finish – Matte Tin Finish. Solderable per MIL-STD-
202, Method 208
Weight: 0.006 grams (approximate)
Device Schematic
Top View
e3
Ordering Information (Note 4)
Product Marking Reel size (inches) Tape width (mm) Quantity per reel
MMDT3904-7-F K6N 7 8 3,000
Notes: 1. No purposely added lead. Fully EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant.
2. See http://www.diodes.com/quality/lead_free.html for more information about Diodes Incorporated’s definitions of Halogen- and Antimony-free, "Green"
and Lead-free.
3. Halogen- and Antimony-free "Green” products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and
<1000ppm antimony compounds.
4. For packaging details, go to our website at http”//www.diodes.com/products/packages.html.
Marking Information
Date Code Key
Year 2010 2011 2012 2013 2014 2015 2016 2017
Code X Y Z A B C D E
Month Jan Feb Mar Apr May Jun Jul
Code 1 2 3 4 5 6 7
K6N = Product Type Marking Code
YM = Date Code Marking
Y = Year (ex: X = 2010)
M = Month (ex: 9 = September)
Aug Sep Oct Nov Dec
8 9 O N D
MMDT3904
Document number: DS30088 Rev. 15 - 2
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© Diodes Incorporated
Page 2
)
)
r
MMDT3904
Maximum Ratings (@T
= +25°C, unless otherwise specified.)
A
Characteristic Symbol Value Unit
Collector-Base Voltage
Collector-Emitter Voltage
Emitter-Base Voltage
Continuous Collector Current
V
CBO
V
CEO
V
EBO
I
C
60 V
40 V
6.0 V
200 mA
Thermal Characteristics
Characteristic Symbol Value Unit
Power Dissipation (Note 5)
Thermal Resistance, Junction to Ambient (Note 5)
Operating and Storage and Temperature Range
P
D
R
θJA
T
, T
J
STG
Electrical Characteristics (@T
= +25°C, unless otherwise specified.)
A
Characteristic Symbol Min Max Unit Test Condition
OFF CHARACTERISTICS
Collector-Base Breakdown Voltage
Collector-Emitter Breakdown Voltage (Note 6)
Emitter-Base Breakdown Voltage
Collector-Base Cutoff Current
Collector-Emitter Cutoff Current
Emitter-Base Cutoff Current
BV
BV
BV
I
CBO
I
CEV
I
EBO
CBO
CEO
EBO
60
40
6.0
50 nA
50
50
50 nA
ON CHARACTERISTICS (Note 6)
300
0.20
0.30
0.85
0.95
DC Current Gain
Collector-Emitter Saturation Voltage
Base-Emitter Saturation Voltage
V
CE(sat)
V
BE(sat)
40
70
h
FE
100
60
30
0.65
SMALL SIGNAL CHARACTERISTICS
Output Capacitance
Input Capacitance
Input Impedance
Voltage Feedback Ratio
Small Signal Current Gain
Output Admittance
Current Gain-Bandwidth Product
C
obo
C
ibo
h
h
h
h
oe
f
T
Noise Figure NF
ie
re
fe
0.5 8.0 x 10
100 400
1.0 40 µS
300
1.0 10
4.0 pF
8.0 pF
5.0 dB
SWITCHING CHARACTERISTICS
Delay Time
Rise Time
Storage Time
Fall Time
Notes: 5. For the device mounted on minimum recommended pad layout FR4 PCB with high coverage of single sided 1oz copper, in still air conditions; the device
is measured when operating in a steady-state condition.
6. Short duration pulse test used to minimize self-heating effect.
t
d
t
t
s
t
f
35 ns
35 ns
200 ns
50 ns
MMDT3904
Document number: DS30088 Rev. 15 - 2
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200 mW
625
-55 to +150
V
IC = 100µA, IE = 0
V
IC = 10.0mA, IB = 0
V
IE = 100µA, IC = 0
V
CB
V
V
V
CE
V
CE
V
EB
= 100µA, V
I
C
I
= 1.0mA, VCE = 1.0V
C
= 10mA, VCE = 1.0V
I
C
I
= 50mA, V
C
= 100mA, VCE = 1.0V
I
C
= 10mA, IB = 1.0mA
I
C
I
= 50mA, IB = 5.0mA
C
= 10mA, IB = 1.0mA
I
C
I
= 50mA, IB = 5.0mA
C
nA
= 50V
= 40V, V
= 40V, V
= 5V
BE(OFF
BE(ON
CE
CE
= 1.0V
C/W
C
= 3.0V
= 0.25V
= 1.0V
VCB = 5.0V, f = 1.0MHz, IE = 0
VEB = 0.5V, f = 1.0MHz, IC = 0
k
-4
= 10V, IC = 1.0mA,
V
CE
f = 1.0kHz
= 20V, IC = 10mA,
V
MHz
CE
f = 100MHz
V
= 5.0V, IC = 100A,
CE
R
= 1.0k f = 1.0kHz
S
V
= 3.0V, IC = 10mA,
CC
= - 0.5V, IB1 = 1.0mA
V
BE(off)
V
= 3.0V, IC = 10mA,
CC
I
= IB2 = 1.0mA
B1
April 2013
© Diodes Incorporated
Page 3
P, P
O
R
PATIO
5
C
PUT CAPACITANC
F
C CUR
REN
T GAIN
C
O
CTO
R
T
TER
T
TER
MMDT3904
200
150
N (mW)
1
)
E (p
10
100
DISSI
WE
D
1,000
50
0
0
25 50
T , AMBIENT TEMPERATURE (°C)
A
75
100 125
Fig. 1, Power Dissi pation vs.
Ambient Temperature (Total Device)
150
175
200
5
, IN
IBO
OBO
C , OUTPUT CAPACITANCE (pF)
0
0.1
V , COLLECTOR-BASE VOLTAGE (V)
CB
1
10
100
Fig. 2, Input and Output Capacitance vs.
Collector-Base Voltage
1
100
FE
h, D
(V)
10
10
1
0.1
1
1
I , COLLECTOR CURRENT (mA)
C
10
100
Fig. 3, Typical DC Current Gain
vs. Collector Current
1,000
(V)
-EMI
0.1
LLE
CE(SAT)
V,
SATURATION VOLTAGE
0.01
0.1 1 10 100 1,000
I , COLLECTOR CURRENT (mA)
C
Fig. 4, Typical Collector-Emitter
Saturation Voltage vs. Collector Current
SATURATION VOLTAGE
BE(SAT)
V , BASE-EMI
0.1
0.1 1 10
I , COLLECTOR CURRENT (mA)
C
100
1,000
Fig. 5, Typical B ase-Emitter Saturation Voltage
vs. Collector Current
MMDT3904
Document number: DS30088 Rev. 15 - 2
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Page 4
Package Outline Dimensions
Please see AP02002 at http://www.diodes.com/datasheets/ap02002.pdf for latest version.
K
J
A
Dim Min Max Typ
B C
H
M
D
L
F
A 0.10 0.30 0.25
B 1.15 1.35 1.30
C 2.00 2.20 2.10
D 0.65 Typ
F 0.40 0.45 0.425
H 1.80 2.20 2.15
J 0 0.10 0.05
K 0.90 1.00 1.00
L 0.25 0.40 0.30
M 0.10 0.22 0.11
0° 8° -
All Dimensions in mm
Suggested Pad Layout
Please see AP02001 at http://www.diodes.com/datasheets/ap02001.pdf for the latest version.
G
Z
Y
X
C2
C2
C1
Dimensions Value (in mm)
Z 2.5
G 1.3
X 0.42
Y 0.6
C1 1.9
C2 0.65
MMDT3904
SOT363
MMDT3904
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Page 5
IMPORTANT NOTICE
DIODES INCORPORATED MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARDS TO THIS DOCUMENT,
INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE
(AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION).
Diodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes
without further notice to this document and any product described herein. Diodes Incorporated does not assume any liability arising out of the
application or use of this document or any product described herein; neither does Diodes Incorporated convey any license under its patent or
trademark rights, nor the rights of others. Any Customer or user of this document or products described herein in such applications shall assume
all risks of such use and will agree to hold Diodes Incorporated and all the companies whose products are represented on Diodes Incorporated
website, harmless against all damages.
Diodes Incorporated does not warrant or accept any liability whatsoever in respect of any products purchased through unauthorized sales channel.
Should Customers purchase or use Diodes Incorporated products for any unintended or unauthorized application, Customers shall indemnify and
hold Diodes Incorporated and its representatives harmless against all claims, damages, expenses, and attorney fees arising out of, directly or
indirectly, any claim of personal injury or death associated with such unintended or unauthorized application.
Products described herein may be covered by one or more United States, international or foreign patents pending. Product names and markings
noted herein may also be covered by one or more United States, international or foreign trademarks.
This document is written in English but may be translated into multiple languages for reference. Only the English version of this document is the
final and determinative format released by Diodes Incorporated.
LIFE SUPPORT
Diodes Incorporated products are specifically not authorized for use as critical components in life support devices or systems without the express
written approval of the Chief Executive Officer of Diodes Incorporated. As used herein:
A. Life support devices or systems are devices or systems which:
1. are intended to implant into the body, or
2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the
labeling can be reasonably expected to result in significant injury to the user.
B. A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the
failure of the life support device or to affect its safety or effectiveness.
Customers represent that they have all necessary expertise in the safety and regulatory ramifications of their life support devices or systems, and
acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any
use of Diodes Incorporated products in such safety-critical, life support devices or systems, notwithstanding any devices- or systems-related
information or support that may be provided by Diodes Incorporated. Further, Customers must fully indemnify Diodes Incorporated and its
representatives against any damages arising out of the use of Diodes Incorporated products in such safety-critical, life support devices or systems.
Copyright © 2013, Diodes Incorporated
www.diodes.com
MMDT3904
MMDT3904
Document number: DS30088 Rev. 15 - 2
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