Page 1
g
A
Features
• Low Forward Voltage Drop
• Soft, Fast Switching Capability
• Schottky Barrier Chip
• ITO-220S Heat Sink Tab Electrically Isolated from Cathode
• UL Approval in Accordance with UL 1557, Reference No.
E94661
NEW PRODUCT
Top View
Bottom View
MBR2060CTP
20A SCHOTTKY BARRIER RECTIFIER
Mechanical Data
• Case: ITO-220S
• Case Material: Molded Plastic, UL Flammability Classification
Rating 94V-0
• Terminals: Matte Tin Finish annealed over Copper leadframe.
Solderable per MIL-STD-202, Method 208
• Weight: 1.335 grams (approximate)
4
Isolated
2
Common
1
Cathode
Anode
Package Pin Out
Confi
uration
3
Anode
Ordering Information (Note 1)
Part Number Case Packaging
MBR2060CTP ITO-220S 50 pieces/tube
Notes: 1. For packaging details, go to our website at http://www.diodes.com.
Marking Information
MBR
2060CTP
YYWW AB
MBR2060CTP = Product Type Marking Code
B = Foundry and Assembly Code
YYWW = Date Code Marking
YY = Last two digits of year (ex: 09 = 2009)
WW = Week (01 - 53)
MBR2060CTP
Document number: DS31794 Rev. 4 - 2
1 of 4
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April 2011
© Diodes Incorporated
Page 2
θ
P
P
O
R
PATIO
Maximum Ratings (Per Leg) @T
= 25°C unless otherwise specified
A
Single phase, half wave, 60Hz, resistive or inductive load.
For capacitance load, derate current by 20%.
Characteristic Symbol Value Unit
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
Average Rectified Output Current (Per Leg)
(Total)
Non-Repetitive Peak Forward Surge Current 8.3ms
Single Half Sine-Wave Superimposed on Rated Load
Isolation Voltage
From terminal to heatsink t = 1min.
NEW PRODUCT
Thermal Characteristics (Per Leg)
Characteristic Symbol Value Unit
Maximum Thermal Resistance, Junction to Case
Operating and Storage Temperature Range
MBR2060CTP
V
RRM
V
RWM
V
RM
I
O
I
FSM
V
AC
R
JC
, T
T
J
STG
60 V
10
20
A
170 A
2000 V
3
°C/W
-65 to +175 ºC
Electrical Characteristics (Per Leg) @T
= 25°C unless otherwise specified
A
Characteristic Symbol Min Typ Max Unit Test Condition
Forward Voltage Drop
Leakage Current (Note 2)
Notes: 2. Short duration pulse test used to minimize self-heating effect.
3. Device mounted on Black Aluminum Heatsink, 37mm * 50mm * 15mm.
8
7
6
N (W)
5
4
DISSI
3
WE
,
2
D
1
0
0246 8101214
I , AVERAGE FORWARD CURRENT (A)
F(AV)
Fig. 1 Forward Power Dissipation
I
V
F
I
R
-
-
-
0.60
6
4.2
0.80
0.70
100
20
V
μA
mA
= 10A, TJ = 25ºC
F
I
= 10A, TJ = 125ºC
F
V
= 60V, TJ = 25ºC
R
V
= 60V, TJ = 125ºC
R
100
10
1
0.1
0.01
F
I , INSTANT ANEOUS FORW ARD CURRENT (A)
0.001
0 200 400 600 800 1,000
V , INSTANTANEOU S FORWA RD VOLTAGE (mV)
F
Fig. 2 Typical Forward Characteristics
MBR2060CTP
Document number: DS31794 Rev. 4 - 2
2 of 4
www.diodes.com
April 2011
© Diodes Incorporated
Page 3
TANT
O
US R
R
CUR
RENT
C
TOT
CAPACIT
N
C
F
T
RAT
T TEMPERATUR
C
NEW PRODUCT
MBR2060CTP
100,000
(µA)
10,000
1,000
SE
10,000
)
E (p
A
100
EVE
1,000
10
AL
ANE
1
,
T
0.1
R
0.01
I , INS
51015202530354045505560
V , INSTANTANEOUS REVERSE VOLT AGE (V)
R
Fig. 3 Typical Reverse Characteristics
20.0
17.5
R = R
θθ
JA JC
Total Device
100
0.1 1 10 100
150
)
E (°
125
V , DC REVERSE VOLT AGE (V)
R
Fig. 4 Total Capacitance vs. Reverse Voltage
15.0
12.5
100
10.0
R = 16°C/W
θ
JA
7.5
Per Element
Note 3
5.0
2.5
F(AV)
I , AVERAGE FORWARD CURRENT(A)
0
0 255075100125 175
T , AMBIENT TEMPERATURE (°C)
A
Fig. 5 Forward Current Derating Curve
150
75
50
ED AMBIEN
25
, DE
A
0
0 6 12 18 24 30 36 42 48 54 60
V , DC REVERSE VOLTAGE (V)
R
Fig. 6 Oper at ing Temperat ure Derati ng
Package Outline Dimensions
Q
D
D1
E
+
Ø1.5
Dp 0.1 max
ØP
1.7 Ref
7 Ref
°
5 Ref
°
A
A1
+
H1
D2
5 Ref
°
E1
L
b2
L1
A2
5 Ref
e
b
5 Ref
°
°
c
e1
MBR2060CTP
Document number: DS31794 Rev. 4 - 2
3 of 4
www.diodes.com
DIM. MIN. MAX. TYP.
A1 1.17 1.39
A2 2.57 2.77 2.67
b2 1.15 1.54 1.26
D1 8.60 8.80 8.70
D2 13.68 14.08
e1 4.98 5.18 5.08
E1 6.86 8.89
H1 5.85 6.85
L1
ITO220S
A 4.52 4.62 4.57
−
b 0.72 0.95 0.84
c 0.356 0.61
−
D 14.22 16.51 15.00
−
e 2.49 2.59 2.54
E 10.01 10.21 10.11
−
−
L 13.30 13.90 13.60
6.35
−
P 3.54 4.08
Q 2.54 3.42
−
−
−
All Dimensions in mm
April 2011
© Diodes Incorporated
Page 4
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NEW PRODUCT
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written approval of the Chief Executive Officer of Diodes Incorporated. As used herein:
A. Life support devices or systems are devices or systems which:
1. are intended to implant into the body, or
labeling can be reasonably expected to result in significant injury to the user.
B. A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the
failure of the life support device or to affect its safety or effectiveness.
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Copyright © 2011, Diodes Incorporated
www.diodes.com
2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the
IMPORTANT NOTICE
LIFE SUPPORT
MBR2060CTP
MBR2060CTP
Document number: DS31794 Rev. 4 - 2
4 of 4
www.diodes.com
April 2011
© Diodes Incorporated
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