200 mA LOAD SWITCH FEATURING PRE-BIASED PNP TRANSISTOR AND N-MO SFET
S
D
G
C
E
B
Q2
NMOS
R3
37K
R2
470
Q1
PNP
R1
10K
1
2
3
4
56
C_Q1
E_Q1
G_Q2
D_Q2
S_Q2
B_Q1
DSNM6047_DIE
DDTB142JU_DIE
Fig. 2 Schematic and Pin Configuration
TCUDORP WEN
General Description
• LMN200B01 is best suited for applications where the load
needs to be turned on and off using control circuits like
micro-controllers, comparators, etc., particularly at a point
of load. It features a discrete pass transistor with stable
V
which does not depend on the input voltage and
CE(SAT)
can support continuous maximum current of 200 mA. It
also contains a discrete N-MOSFET that can be used as
control. This N-MOSFET also has a built-in pull down
resistor at its gate. The component can be used as a part
of a circuit or as a stand alone discrete device.
LMN200B01
WITH PULL DOWN RESISTOR
Features
Fig. 1: SOT-26
• Voltage Controlled Small Signal Switch
• N-MOSFET with Gate Pull-Down Resistor
• Surface Mount Package
• Ideally Suited for Automated Assembly Processes
• Lead Free By Design/ROHS Compliant (Note 1)
• "Green" Device (Note 2)
Mechanical Data
• Case: SOT-26
• Case Material: Molded Plastic, “Green” Molding
Compound. UL Flammability Classification Rating 94V-0
• Moisture sensitivity: Level 1 per J-STD-020C
• Terminal Connections: See Diagram
• Terminals: Finish - Matte Tin annealed over Copper
leadframe. Solderable per MIL-STD-202, Method 208
• Marking & Type Code Information: See Last Page
• Ordering Information: See Last Page
• Weight: 0.016 grams (approximate)
Sub-Components Reference Device Type R1 (NOM) R2 (NOM) R3 (NOM) Figure
DDTB142JU_DIE
DSNM6047_DIE
Q1 PNP Transistor 10K 470 2
Q2 N-MOSFET 37K 2
Maximum Ratings, Total Device
Characteristic Symbol Value Unit
Power Dissipation (Note 3)
Power Derating Factor above 125°C
Output Current
Thermal Characteristics
Characteristic Symbol Value Unit
Junction Operation and Storage Temperature Range
Thermal Resistance, Junction to Ambient Air (Note3)
(Equivalent to one heated junction of PNP transistor)
Notes: 1. No purposefully added lead.
2. Diodes Inc.'s "Green" policy can be found on our website at http://www.diodes.com/products/lead_free/index.php.
3. Device mounted on FR-4 PCB, 1 inch x 0.85 inch x 0.062 inch; pad layout as shown on Diodes Inc. suggested pad layout
document AP02001, which can be found on our website at http://www.diodes.com/datasheets/ap02001.pdf.
DS30651 Rev. 7 - 2 1 of 10 LMN200B01
@ TA = 25°C unless otherwise specified
P
d
P
der
I
out
Tj,T
stg
R
θJA
300
2.4 mW/°C
200 mA
-55 to +150 °C
417 °C/W
www.diodes.com Diodes Incorporated
mW
TCUDORP WEN
Maximum Ratings:
Sub-Component Device: Pre-Biased PNP Transistor (Q1)
Characteristic Symbol Value Unit
Collector-Base Voltage
Collector-Emitter Voltage
Supply Voltage
Input Voltage
Output Current
Sub-Component Device:
N-MOSFET with Gate Pull-Down Resistor (Q2)
Characteristic Symbol Value Unit
Drain-Source Voltage
Drain Gate Voltage (RGS ≤1MΩ) V
Gate-Source Voltage Continuous
Pulsed (tp<50 uS) +/-40
Drain Current (Page 1: Note 3) Continuous (Vgs = 10V)
Pulsed (tp <10 uS, Duty Cycle <1%) 800
Continuous Source Current
V
CBO
V
CEO
V
cc
V
in
I
C
@ TA = 25°C unless otherwise specified
V
DSS
DGR
V
GSS
I
D
I
S
@ TA = 25°C unless otherwise specified
-50 V
-50 V
-50 V
+5 to -6 V
-200 mA
60 V
60 V
+/-20
115
115 mA
V
mA
DS30651 Rev. 7 - 2 2 of 10 LMN200B01
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TCUDORP WEN
Electrical Characteristics: Pre-Biased PNP Transistor (Q1)
@ TA = 25°C unless otherwise specified
Characteristic Symbol Min Typ Max Unit Test Condition
OFF CHARACTERISTICS
Collector-Base Cut Off Current
Collector-Emitter Cut Off Current
Emitter-Base Cut Off Current
Emitter-Base Cut Off Current
Collector-Base Breakdown Voltage
Collector-Emitter Breakdown Voltage
Output Voltage
Output Current (leakage current same as I
) I
CEO
I
CBO
I
CEO
I
EBO
V
(BR)CBO
V
(BR)CEO
V
I(OFF)
V
O(OFF)
-100 nA
-500 nA
-0.5 -1 mA
-50 V
-50 V
-0.55 -0.3 V
-4.9 V
OH
-500 nA
VCB = -50V, IE = 0
V
V
IC = -10µA, IE = 0
IC = -2 mA, IB = 0
VCE = -5V, IC = -100µA
VCC = -5V, VB = -0.05V, RL = 1K
VCC = -50V, VI = 0V
ON CHARACTERISTICS
IC = -10 mA, IB = -0.5 mA
IC = -50mA, IB = -5mA
IC = -20mA, IB = -1mA
IC = -100mA, IB= -10mA
IC = -200mA, IB= -10mA
IC = -200mA, IB = -20mA
IC = -200mA, IB = -10mA
VCE = -5V, IC = -20 mA
VCE = -5V, IC = -50 mA
VCE = -5V, IC = -100 mA
VCE = -5V, IC = -200 mA
VO = -0.3V, IC = -2 mA
VCC = -5V, VB = -2.5V,
Io/I
VI = -5V
VCE = -5V, IC = -200mA
IC = -50mA, IB = -5mA
V
IC = -80mA, IB = -8mA
Collector-Emitter Saturation Voltage
Equivalent on-resistance*
DC Current Gain
Input On Voltage
Output Voltage (equivalent to V
CE(SAT)
Input Current
Base-Emitter Turn-on Voltage
Base-Emitter Saturation Voltage
or V
) V
O(on)
V
CE(SAT)
R
CE(SAT)
h
V
I(ON)
V
BE(ON)
V
BE(SAT)
-0.15 V
-0.2 V
-0.2 V
-0.25 V
-0.25 V
-0.3 V
1.5 Ω
60 150
FE
60 215
60 245
60 250
-2.45 -0.7 V
OL
I
-0.065 -0.15 V
-9.2 -13 mA
i
-1.125 -1.3 V
-3.2 -3.6
-4.55 -5.5
Input Resistor (Base), +/- 30% R2 0.47 KΩ
Pull-up Resistor (Base to Vcc supply), +/- 30% R1 10 KΩ
Resistor Ratio (Input Resistor/Pullup resistor), +/ -20% R1/R2 21
SMALL SIGNAL CHARACTERISTICS
Transition Frequency (gain bandwidth product)
Collector capacitance, (Ccbo-Output Capacitance)
f
T
C
200 MHz
20 pF
C
VCE = -10V, IE = -5mA,
f = 100MHz
VCB = -10V, IE = 0A,
f = 1MHz
= -50V, IB = 0
CE
= -5V, IC = 0
EB
-50mA /-2.5mA
I =
* Pulse Test: Pulse width, tp<300 µS, Duty Cycle, d<=0.02.
DS30651 Rev. 7 - 2 3 of 10 LMN200B01
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