Features
• Epitaxial Planar Die Construction
• Complementar
y PNP Type Available (IMT4)
• Small Surface Mount Package
• Lead
• "Gree
Free/RoHS Compliant (Note 3)
n" Device, Note 4 and 5
Mechanical Data
• Case: SOT-26
• Case Material:
Compound, Note 5. UL Flammability Classification
Rating 94V-0
• Moisture Sensitivity
• Terminal Conn
• Terminals: Solderable per MI
• Lead Fr
Copper leadframe).
• Marking Informat
• Orde
ring & Date Code Information: See Page 3
• Weight: 0.016 gr
Molded Plastic, "Green" Molding
ections: See Diagram
ee Plating (Matte Tin Finish annealed over
ion: KX8, See Page 3
ams (approximate)
: Level 1 per J-STD-020C
L-STD-202, Method 208
IMX8
DUAL NPN SMALL SIGNAL SURFACE MOUNT TRANSISTOR
1
C
B
1
M
Dim Min Max Typ
SOT-26
A 0.35 0.50 0.38
B 1.50 1.70 1.60
C 2.70 3.00 2.80
D
F
⎯ ⎯
⎯ ⎯
0.95
0.55
H 2.90 3.10 3.00
J 0.013 0.10 0.05
K 1.00 1.30 1.10
L
F
1
1
L 0.35 0.55 0.40
M 0.10 0.20 0.15
0° 8°
α
All Dimens ons in mm i
⎯
B2B1E
C2E2C
K
J
B2B1E
C2E2C
A
H
D
Maximum Ratings @T
= 25°C unless otherwise specified
A
Characteristic Symbol Value Unit
Collector-Base Voltage
Collector-Emitter Voltage
Emitter-Base Voltage
Collector Current - Continuous
Power Dissipation (Note 1)
Thermal Resistance, Junction to Ambient (Note 1)
Operating and Storage Temperature Range
V
V
V
R
Tj, T
CBO
CEO
EBO
I
C
P
θ
d
JA
STG
120 V
120 V
5.0 V
50 mA
300 mW
417
-55 to +150
°C/W
°C
Electrical Characteristics @T
Characteristic Symbol Min Typ Max Unit Test Condition
OFF CHARACTERISTICS (Note 2)
Collector-Base Breakdown Voltage
Collector-Emitter Breakdown Voltage
Emitter-Base Breakdown Voltage
Collector Cutoff Current
Emitter Cutoff Current
ON CHARACTERISTICS (Note 2)
DC Current Gain
Collector-Emitter Saturation Voltage
SMALL SIGNAL CHARACTERISTICS
Current Gain-Bandwidth Product
Notes: 1. Device mounted on FR-5 PCB 1.0 x 0.75 x 0.062 inch pad layout as shown on Diodes Inc. suggested pad layout AP02001, which can be found on our
website at http://www.diodes.com/datasheets/ap02001.pdf. 200mW per element must not be exceeded.
2. Short duration pulse test used to minimize self-heating effect.
3. No purposefully added lead.
4. Diodes Inc.'s "Green" policy can be found on our website at http://www.diodes.com/products/lead_free/index.php.
5. Product manufactured with Date Code 0627 (week 27, 2006) and newer are built with Green Molding Compound. Product manufactured prior to Date
Code 0627 are built with Non-Green Molding Compound and may contain Halogens or Sb2O3 Fire Retardants.
= 25°C unless otherwise specified
A
V
(BR)CBO
V
(BR)CEO
V
(BR)EBO
I
CBO
I
EBO
h
V
CE(SAT)
FE
f
T
120
120
5.0
⎯ ⎯
⎯ ⎯
180
⎯ ⎯
⎯
140
⎯ ⎯
⎯ ⎯
⎯ ⎯
0.5
0.5
⎯
820
0.5 V
⎯
V
IC = 50μA
V
IC = 1.0mA
V
IE = 50μA
μA
VCB = 100V
μA
V
= 4.0V
EB
⎯ IC = 2.0mA, VCE = 6.0V
IC = 10mA, IB = 1.0mA
VCE = 12V, IC = 2.0mA,
MHz
f = 100MHz
DS30304 Rev. 8 - 2 1 of 3
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.diodes.com
IMX8
© Diodes Incorporated
350
300
500
T = 75C
°
A
N (mW)
600
250
400
T = 25C
°
A
200
DISSI
150
WE
100
D
50
0
0
25 50
T , AMBIENT TEMPERATURE (°C)
A
75
100 125
150
175
200
Fig. 1, Max Power Dissipation vs.
100
Ambient Temperatur e
T = 25C
A
°
(mA)
10.0
T= 75C
°
A
300
T = -25C
°
A
200
FE
h, D
100
0
1.0
I COLLECTOR CURRENT (mA)
C,
10.0
Fig. 2 Typical DC Current Gain vs. Collector Current
1.0
E
T = 150C
°
EMI
A
100
0.100
T = 25C
°
T = -25C
°
LLE
1.0
C
I,
0.1
00
0.2
V , BASE-EMITTER VOLTAGE (V)
BE(ON)
0.3
0.4 0.5
A
.9
0.80.70.60.1
Fig. 3 Typical Collector Current vs.
Base-E m itter Voltage
1,000
V = 5 Volts
CE
z)
(M
100
10
AIN BANDWID
T
f,
1
1
I , COLLECTOR CURRENT (mA)
C
10 100
Fig. 5 Typical Gain Bandwidth Product
vs. Collector Current
LLE
SATURATION VOLT AGE (V)
CE(SAT)
V,
0.010
(mA)
EN
LLE
C
I,
T = -50C
A
1
10 100 1,000
I , COLLECTOR CURRENT (mA)
C
Fig. 4 Typical Collector-Emitter Voltage
vs. Collect or Current
6
I = 16µA
B
5
4
3
2
1
0
0.5 1.51
0
V , COLLECTOR-EMITTER VOLTAGE (V)
CE
I = 1µAB4
2
I = 1µA
B
I = 1µA
0
B
I = µA
8
B
6
I = µA
B
4
I = µA
B
2.5 3.53445
2
Fig. 6 Typical Collector Current vs.
Collector-Emitter Voltage
DS30304 Rev. 8 - 2 2 of 3
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A
°
.5
IMX8
© Diodes Incorporated