Features
Ultra-Small Leadless Surface Mount Package (0.6 x 0.3mm)
Ultra-Low Profile Package (0.3mm)
Ideally Suited for Automated Assembly Processes
Low Leakage Current, Suitable for Battery-Powered Applications
Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2)
Halogen and Antimony Free. “Green” Device (Note 3)
Qualified to AEC-Q101 Standards for High Reliability
ADVANCE INFORMATION
Top View Bottom View
Mechanical Data
Case: X3-DFN0603-2
Case Material: Molded Plastic, “Green” Molding Compound.
Moisture Sensitivity: Level 1 per J-STD-020
Terminal Connections: Cathode Bar
Terminals: Finish Matte Tin over Copper leadframe.
Weight: 0.2 mg (Approximate)
X3-DFN0603-2
GDZ3V9LP3 - GDZ8V2LP3
ULTRA-SMALL LEADLESS
SURFACE MOUNT ZENER DIODE
UL Flammability Classification Rating 94V-0
Solderable per MIL-STD-202, Method 208
1
Cathode
2
Anode
Ordering Information (Note 4)
Part Number Case Packaging
(Type Number)-7* X3-DFN0603-2 10,000/Tape & Reel
*Add “-7” to the appropriate type number in Electrical Characteristics Table. Example: 6.2V Zener = GDZ6V2LP3-7.
Notes: 1. No purposely added lead. Fully EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant.
2. See http://www.diodes.com/quality/lead_free.html for more information about Diodes Incorporated’s definitions of Halogen- and Antimony-free, "Green"
and Lead-free.
3. Halogen- and Antimony-free "Green” products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and
<1000ppm antimony compounds.
4. For packaging details, go to our website at http://www.diodes.com/products/packages.html.
Marking Information
GDZ3V9LP3 - GDZ8V2LP3
Document number: DS35065 Rev. 15 - 2
Pin 1
xx = Product Type Marking Code
(See Electrical Characteristics Table)
Line Denotes Cathode Side
1 of 4
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August 2013
© Diodes Incorporated
P
P
OWER
P
T
O
N
T
T
O
U
F
O
R
R
C
URRENT
GDZ3V9LP3 - GDZ8V2LP3
Thermal Characteristics
Characteristic Symbol Value Unit
Power Dissipation (Note 5) TA = +25°C PD
Thermal Resistance, Junction to Ambient Air (Note 5) TA = +25°C R
Operating and Storage Temperature Range
T
J, TSTG
θJA
Electrical Characteristics (@T
= +25°C, unless otherwise specified.)
A
Zener Voltage Range
Type
Number
Marking
Code
(Note 6)
VZ @ IZT I
Nom (V) Min (V) Max (V) mA µA V
GDZ3V9LP3 KJ 3.9 3.740 4.160 5 5 1.0
ADVANCE INFORMATION
GDZ4V7LP3 KL 4.7 4.420 4.900 5 2.0 1.0
GDZ5V1LP3 KM 5.1 4.840 5.370 5 0.2 2.0
GDZ5V6LP3 KN 5.6 5.310 5.920 5 1.0 2.5
GDZ6V0LP3 KW 6.0 5.676 6.324 5 1.0 2.8
GDZ6V2LP3 KO 6.2 5.860 6.530 5 1.0 3.0
GDZ6V8LP3 KT 6.8 6.470 7.140 5 0.5 3.5
GDZ7V5LP3 KQ 7.5 7.060 7.840 5 0.5 4.0
GDZ8V2LP3 KX 8.2 7.760 8.640 5 0.5 5.0
Notes: 5. Device mounted on FR-4 PCB with minimum recommended pad layout, as shown in Diodes Incorporated’s Suggested Pad Layout document, which can
be found on our website at http://www.diodes.com.
6. Short duration pulse test used to minimize self-heating effect.
0.30
1,000
(mA)
0.25
Note 5
100
(W)
0.20
I
A
DISSI
,
D
0.15
0.10
0.05
D
WA
S
ANE
AN
10
0.1
T = 150°C
T = 125°C
1
A
T = 85°C
A
250 mW
500
-55 to +150
I
ZT
A
@ VR
R
T = 50°C
A
T = 25°C
A
T = -55°C
A
C/W
C
Maximum
Reverse
Current
(Note 6)
F
0
0 25 50 75 100 125 150
T , AMBIENT TEMPERATURE (°C)
A
Figure 1 Power Derating Curve
0.01
I , INS
0.2 0.4 0.6 0.8 1.0 1.2
V , INSTANTANEOUS FORWARD VOLTAGE (V)
F
Figure 2 Typical Forward Characteristics
GDZ3V9LP3 - GDZ8V2LP3
Document number: DS35065 Rev. 15 - 2
2 of 4
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August 2013
© Diodes Incorporated
N
TAN
TANEO
US R
R
CUR
REN
T
C, TOT
CAPACITAN
C
GDZ3V9LP3 - GDZ8V2LP3
20
3V9LP3
15
10
Z
I , ZENER CURRENT (mA)
5
4V7LP3
5V1LP3
6V2LP3
6V8LP3
7V5LP3
8V2LP3
(nA)
SE
EVE
100
10
S
R
1
0
0246810
V , ZENER VOLTAGE (V)
Z
Figure 3 Typical Zener Breakdown Characteristics
20
f = 1MHz
I, I
1.5 2 2.5
V , INSTANTANEOUS REVERSE VOLTAGE (V)
R
Figure 4 Typical Reverse Characteristics - GDZ5V1LP3
ADVANCE INFORMATION
15
E (pF)
10
AL
5
T
0
01 2 3 45
V , REVERSE VOLTAGE (V)
R
Figure 5 Typical Total Capacitance
Package Outline Dimensions
Please see AP02002 at http://www.diodes.com/datasheets/ap02002.pdf for latest version.
GDZ3V9LP3 - GDZ8V2LP3
Document number: DS35065 Rev. 15 - 2
A
X3-DFN0603-2
A1 (2x)
D
e
Dim Min Max Typ
A 0.27 0.35 0.30
A1 0.00 0.03 0.02
b 0.19 0.29 0.24
D 0.595 0.645 0.62
E 0.295 0.345 0.32
e - - 0.355
E
L (2x )
b (2x)
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L 0.14 0.24 0.19
All Dimensions in mm
August 2013
© Diodes Incorporated
GDZ3V9LP3 - GDZ8V2LP3
Suggested Pad Layout
Please see AP02001 at http://www.diodes.com/datasheets/ap02001.pdf for the latest version.
DIODES INCORPORATED MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARDS TO THIS DOCUMENT,
INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE
(AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION).
ADVANCE INFORMATION
Diodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes
without further notice to this document and any product described herein. Diodes Incorporated does not assume any liability arising out of the
application or use of this document or any product described herein; neither does Diodes Incorporated convey any license under its patent or
trademark rights, nor the rights of others. Any Customer or user of this document or products described herein in such applications shall assume
all risks of such use and will agree to hold Diodes Incorporated and all the companies whose products are represented on Diodes Incorporated
website, harmless against all damages.
Diodes Incorporated does not warrant or accept any liability whatsoever in respect of any products purchased through unauthorized sales channel.
Should Customers purchase or use Diodes Incorporated products for any unintended or unauthorized application, Customers shall indemnify and
hold Diodes Incorporated and its representatives harmless against all claims, damages, expenses, and attorney fees arising out of, directly or
indirectly, any claim of personal injury or death associated with such unintended or unauthorized application.
Products described herein may be covered by one or more United States, international or foreign patents pending. Product names and markings
noted herein may also be covered by one or more United States, international or foreign trademarks.
This document is written in English but may be translated into multiple languages for reference. Only the English version of this document is the
final and determinative format released by Diodes Incorporated.
Diodes Incorporated products are specifically not authorized for use as critical components in life support devices or systems without the express
written approval of the Chief Executive Officer of Diodes Incorporated. As used herein:
A. Life support devices or systems are devices or systems which:
1. are intended to implant into the body, or
labeling can be reasonably expected to result in significant injury to the user.
B. A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the
failure of the life support device or to affect its safety or effectiveness.
Customers represent that they have all necessary expertise in the safety and regulatory ramifications of their life support devices or systems, and
acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any
use of Diodes Incorporated products in such safety-critical, life support devices or systems, notwithstanding any devices- or systems-related
information or support that may be provided by Diodes Incorporated. Further, Customers must fully indemnify Diodes Incorporated and its
representatives against any damages arising out of the use of Diodes Incorporated products in such safety-critical, life support devices or systems.
Copyright © 2013, Diodes Incorporated
www.diodes.com
2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the
Y (2x)
X (2x)
Z
C
IMPORTANT NOTICE
LIFE SUPPORT
Dimensions Value (in mm)
C 0.355
X 0.230
Y 0.300
Z 0.610
GDZ3V9LP3 - GDZ8V2LP3
Document number: DS35065 Rev. 15 - 2
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August 2013
© Diodes Incorporated
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