Diodes GBJ20005, GBJ2010 User Manual

Features

Glass Passivated Die Construction

·

High Case Dielectric Strength of 1500V

·

Low Reverse Leakage Current

·

Surge Overload Rating to 240A Peak

·

Ideal for Printed Circuit Board Applications

·

UL Listed Under Recognized Component

·

Index, File Number E94661

Lead Free Finish/RoHS Compliant (Note 4)

·

RMS

Mechanical Data

Case: GBJ

·

Case Material: Molded Plastic. UL Flammability

·

Classification Rating 94V-0

Moisture Sensitivity: Level 1 per J-STD-020C

·

Terminals: Plated Leads, Solderable per MIL-STD-202,

·

Method 208

Lead Free Plating (Tin Finish).

·

Polarity: Molded on Body

·

Mounting: Through Hole for #6 Screw

·

Mounting Torque: 5.0 in-lbs Maximum

·

Marking: Type Number

·

·

Weight: 6.6 grams (approximate)

e

3

GBJ20005 - GBJ2010

20A GLASS PASSIVATED BRIDGE RECTIFIER

GBJ

Dim Min Max

29.70 30.30

A

19.70 20.30

B

17.00 18.00

L

K

A

B

_

S

J

H

D

C

I

M

P

R

EEG

C

D

E

G

H

N

I

J

K

L

M

N

P

R

S

All Dimensions in mm

3.80 4.20

7.30 7.70

9.80 10.20

2.00 2.40

0.90 1.10

2.30 2.70

3.0 X 45°

4.40 4.80

3.40 3.80

3.10 3.40

2.50 2.90

0.60 0.80

10.80 11.20

Maximum Ratings and Electrical Characteristics

Single phase, 60Hz, resistive or inductive load.
For capacitive load, derate current by 20%.

Characteristic Symbol

Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage

RMS Reverse Voltage

Average Forward Rectified Output Current @ TC= 110°C

Non-Repetitive Peak Forward Surge Current, 8.3 ms single
half-sine-wave superimposed on rated load

Forward Voltage per element @ IF= 10A

Peak Reverse Current @ TA= 25°C
at Rated DC Blocking Voltage @ T

I2t Rating for Fusing (t < 8.3 ms) (Note 1)

Typical Total Capacitance per Element (Note 2)

Typical Thermal Resistance Junction to Case (Note 3)

Operating and Storage Temperature Range

Notes: 1. Non-repetitive, for t > 1ms and < 8.3 ms.

2. Measured at 1.0 MHz and applied reverse voltage of 4.0V DC.

3. Unit mounted on 300 x 300 x 1.6mm Cu plate heat sink.

4. RoHS revision 13.2.2003. Glass and High Temperature Solder Exemptions Applied, see

= 125°C

C

V
V

V

V

R(RMS)

I

FSM

V

C

R

T

j,TSTG

GBJ

20005

RRM
RWM

R

I

O

FM

I

R

2

I

t 240 A2s

T

qJC

@ TA= 25°C unless otherwise specified

GBJ

2001

50 100 200 400 600 800 1000 V

35 70 140 280 420 560 700 V

GBJ

2002

EU Directive Annex Notes 5 and 7.

GBJ

2004

1.05 V

-55 to +150 °C

GBJ
2006

20 A

240 A

10

500

60 pF

0.8 °C/W

GBJ
2008

GBJ

2010

Unit

µA

DS21220 Rev. 8 - 2 1 of 3 GBJ20005-GBJ2010

www.diodes.com

ã Diodes Incorporated

g

)

100

g

250

100

g

1000

g

g

2

5

I , AVERAGE RECTIFIED CURRENT (A)

20

With heatsink

10

15

1.0

10

Resistive or

Inductive load

25

Without heatsink

50

T , CASE TEMPERATURE (°C)

Fi

. 1 Forward Current DeratingCurve

75

C

100

Single half-sine-wave

125 150

T=25°C

j

5

O

0

F

I , INSTANTANEOUS FORWARD CURRENT (A)

0.1

0.01

T=25°C

j

0

0.4 0.8 1.2 1.6

V , INSTANTANEOUS FORWARD VOLTAGE (V)

F

.2 Typical Forward Characteristics(per element

Fi

T=25°C

j

f=1MHz

2.0

200

150

10

100

T

C , TOTAL CAPACITANCE (pF)

1

I , PEAK FORWARD SURGE CURRENT (A)

FSM

50

0

1

10

100

1 10 100

V , REVERSE VOLTAGE (V)

NUMBER OF CYCLES AT 60 Hz

Fi

. 3 Maximum Non-Repetitive Surge Current

T = 125°C

j

Fi

R

.4 Typical Total Capacitance, Per Element

100

T = 100°C

j

10

T=50°C

j

1.0

T=25°C

j

0.1
0

20 40

60

80

100

PERCENT OF RATED PEAK REVERSE VOLTAGE (%)

Fi

.5 Typical Reverse Characteristics

DS21220 Rev. 8 - 2 2 of 3 GBJ20005-GBJ2010

www.diodes.com

Ordering Information

(Note 5)

Device

GBJ20005-F

GBJ2001-F

GBJ2002-F

GBJ2004-F

GBJ2006-F

GBJ2008-F

GBJ2010-F

Notes: 5. For packaging details, visit our website at http://www.diodes.com/datasheets/ap2008.pdf.

Packaging Shipping

GBJ 15/Tube

GBJ 15/Tube

GBJ 15/Tube

GBJ 15/Tube

GBJ 15/Tube

GBJ 15/Tube

GBJ 15/Tube

IMPORTANT NOTICE

Diodes Incorporatedand its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes without further
notice to any product herein. Diodes Incorporated does not assume any liability arising out of the application or use of any product described herein; neither
does it convey any license under its patent rights, nor the rights of others. The user of products in such applications shall assume all risks of such use and will
agree to hold Diodes Incorporated and allthe companies whose products are represented onour website, harmlessagainst all damages.

LIFE SUPPORT

Diodes Incorporated products are not authorized for use as criticalcomponents in lifesupport devices or systems without the expressedwritten approval ofthe
President of Diodes Incorporated.

DS21220 Rev. 8 - 2 3 of 3 GBJ20005-GBJ2010

www.diodes.com