Diodes GBJ20005, GBJ2010 User Manual

Features

Glass Passivated Die Construction

·

High Case Dielectric Strength of 1500V

·

Low Reverse Leakage Current

·

Surge Overload Rating to 240A Peak

·

Ideal for Printed Circuit Board Applications

·

UL Listed Under Recognized Component

·

Index, File Number E94661

Lead Free Finish/RoHS Compliant (Note 4)

·

RMS

Mechanical Data

Case: GBJ

·

Case Material: Molded Plastic. UL Flammability

·

Classification Rating 94V-0

Moisture Sensitivity: Level 1 per J-STD-020C

·

Terminals: Plated Leads, Solderable per MIL-STD-202,

·

Method 208

Lead Free Plating (Tin Finish).

·

Polarity: Molded on Body

·

Mounting: Through Hole for #6 Screw

·

Mounting Torque: 5.0 in-lbs Maximum

·

Marking: Type Number

·

·

Weight: 6.6 grams (approximate)

e

3

GBJ20005 - GBJ2010

20A GLASS PASSIVATED BRIDGE RECTIFIER

GBJ

Dim Min Max

29.70 30.30

A

19.70 20.30

B

17.00 18.00

L

K

A

B

_

S

J

H

D

C

I

M

P

R

EEG

C

D

E

G

H

N

I

J

K

L

M

N

P

R

S

All Dimensions in mm

3.80 4.20

7.30 7.70

9.80 10.20

2.00 2.40

0.90 1.10

2.30 2.70

3.0 X 45°

4.40 4.80

3.40 3.80

3.10 3.40

2.50 2.90

0.60 0.80

10.80 11.20

Maximum Ratings and Electrical Characteristics

Single phase, 60Hz, resistive or inductive load.
For capacitive load, derate current by 20%.

Characteristic Symbol

Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage

RMS Reverse Voltage

Average Forward Rectified Output Current @ TC= 110°C

Non-Repetitive Peak Forward Surge Current, 8.3 ms single
half-sine-wave superimposed on rated load

Forward Voltage per element @ IF= 10A

Peak Reverse Current @ TA= 25°C
at Rated DC Blocking Voltage @ T

I2t Rating for Fusing (t < 8.3 ms) (Note 1)

Typical Total Capacitance per Element (Note 2)

Typical Thermal Resistance Junction to Case (Note 3)

Operating and Storage Temperature Range

Notes: 1. Non-repetitive, for t > 1ms and < 8.3 ms.

2. Measured at 1.0 MHz and applied reverse voltage of 4.0V DC.

3. Unit mounted on 300 x 300 x 1.6mm Cu plate heat sink.

4. RoHS revision 13.2.2003. Glass and High Temperature Solder Exemptions Applied, see

= 125°C

C

V
V

V

V

R(RMS)

I

FSM

V

C

R

T

j,TSTG

GBJ

20005

RRM
RWM

R

I

O

FM

I

R

2

I

t 240 A2s

T

qJC

@ TA= 25°C unless otherwise specified

GBJ

2001

50 100 200 400 600 800 1000 V

35 70 140 280 420 560 700 V

GBJ

2002

EU Directive Annex Notes 5 and 7.

GBJ

2004

1.05 V

-55 to +150 °C

GBJ
2006

20 A

240 A

10

500

60 pF

0.8 °C/W

GBJ
2008

GBJ

2010

Unit

µA

DS21220 Rev. 8 - 2 1 of 3 GBJ20005-GBJ2010

www.diodes.com

ã Diodes Incorporated

g

)

100

g

250

100

g

1000

g

g

2

5

I , AVERAGE RECTIFIED CURRENT (A)

20

With heatsink

10

15

1.0

10

Resistive or

Inductive load

25

Without heatsink

50

T , CASE TEMPERATURE (°C)

Fi

. 1 Forward Current DeratingCurve

75

C

100

Single half-sine-wave

125 150

T=25°C

j

5

O

0

F

I , INSTANTANEOUS FORWARD CURRENT (A)

0.1

0.01

T=25°C

j

0

0.4 0.8 1.2 1.6

V , INSTANTANEOUS FORWARD VOLTAGE (V)

F

.2 Typical Forward Characteristics(per element

Fi

T=25°C

j

f=1MHz

2.0

200

150

10

100

T

C , TOTAL CAPACITANCE (pF)

1

I , PEAK FORWARD SURGE CURRENT (A)

FSM

50

0

1

10

100

1 10 100

V , REVERSE VOLTAGE (V)

NUMBER OF CYCLES AT 60 Hz

Fi

. 3 Maximum Non-Repetitive Surge Current

T = 125°C

j

Fi

R

.4 Typical Total Capacitance, Per Element

100

T = 100°C

j

10

T=50°C

j

1.0

T=25°C

j

0.1
0

20 40

60

80

100

PERCENT OF RATED PEAK REVERSE VOLTAGE (%)

Fi

.5 Typical Reverse Characteristics

DS21220 Rev. 8 - 2 2 of 3 GBJ20005-GBJ2010

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