Diodes GBJ10005, GBJ1010 User Manual

Features

GBJ10005 - GBJ1010

10A GLASS PASSIVATED BRIDGE RECTIFIER

Glass Passivated Die Construction

·

High Case Dielectric Strength of 1500V

·

Low Reverse Leakage Current

·

Surge Overload Rating to 170A Peak

·

Ideal for Printed Circuit Board Applications

·

UL Listed Under Recognized Component Index, File Number

·

E94661

Lead Free Finish/RoHS Compliant (Note 4)

·

RMS

Mechanical Data

Case: GBJ

·

Case Material: Molded Plastic - UL Flammability

·

Classification Rating 94V-0

Moisture Sensitivity: Level 1 per J-STD-020C

·

Terminals: Plated Leads, Solderable per MIL-STD-202,

·

Method 208

Lead Free Plating (Tin Finish).

·

Polarity: Molded on Body

·

Mounting: Through Hole for #6 Screw

·

Mounting Torque: 5.0 in-lbs Maximum

·

·

Marking: Type Number

·

Weight: 6.6 grams (approximate)

e

3

GBJ

Dim Min Max

29.70 30.30

A

19.70 20.30

B

17.00 18.00

L

K

A

B

_

J

H

I

EEG

D

C

M

S

N

P

R

C

3.80 4.20

D

7.30 7.70

E

9.80 10.20

G

2.00 2.40

H

0.90 1.10

I

2.30 2.70

J

K

L

M

N

P

R

S

All Dimensions in mm

3.0 X 45°

4.40 4.80

3.40 3.80

3.10 3.40

2.50 2.90

0.60 0.80

10.80 11.20

Maximum Ratings and Electrical Characteristics

Single phase, half wave, 60Hz, resistive or inductive load.
For capacitive load, derate current by 20%.

Characteristic Symbol

Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage

RMS Reverse Voltage

Average Forward Rectified Output Current

Non-Repetitive Peak Forward Surge Current, 8.3 ms single
half-sine-wave superimposed on rated load

Forward Voltage per element @ IF= 5.0A

Peak Reverse Current @TC= 25°C
at Rated DC Blocking Voltage @ T

I2t Rating for Fusing (t < 8.3ms) (Note 1)

Typical Total Capacitance per Element (Note 2)

Typical Thermal Resistance, Junction to Case (Note 3)

Operating and Storage Temperature Range

Notes: 1. Non-repetitive, for t > 1.0ms and < 8.3ms.

2. Measured at 1.0 MHz and applied reverse voltage of 4.0V DC.

3. Thermal resistance from junction to case per element. Unit mounted on 150 x 150 x 1.6mm copper plate heat sink.

4. RoHS revision 13.2.2003. Glass and High Temperature Solder Exemptions Applied, see

@ T

= 110°C

C

= 125°C

C

V

RRM

V

RWM

V

R

V

R(RMS)

I

O

I

FSM

V

FM

I

R

2

I

t 120 A2s

C

T

R

qJC

T

j,TSTG

@ TA= 25°C unless otherwise specified

GBJ

10005

GBJ

1001

50 100 200 400 600 800 1000 V

35 70 140 280 420 560 700 V

GBJ

1002

EU Directive Annex Notes 5 and 7.

GBJ

1004

170 A

1.05 V

500

-65 to +150 °C

GBJ

1006

10 A

10

55 pF

1.4 °C/W

GBJ

1008

GBJ

1010

Unit

mA

DS21218 Rev. 7 - 2 1 of 3 GBJ10005-GBJ1010

www.diodes.com

ã Diodes Incorporated

10

g

)

180

g

g

1000

g

10

12

g

with heatsink

O

I , AVERAGE RECTIFIED CURRENT (A)

6

160

120

80

8

4

2

0

without heatsink

Resistive or

Inductive load

25 50 75 100 125 150

T , CASE TEMPERATURE ( C)

C

. 1 Forward Current DeratingCurve

Fi

°

Single half-sine-wave

T=150CJ°

F

I , INSTANTANEOUS FORWARD CURRENT (A)

1.0

T=25CJ°

0.1

0.01
0 0.4 0.8 1.2 1.6 1.8

V , INSTANTANEOUS FORWARD VOLTAGE (V)

F

.2 Typical Forward Characteristics(per element

Fi

100

10

°

T=25C

j

f = 1MHz

FSM

I , PEAK FORWARD SURGE CURRENT (A)

40

T

C , TOTAL CAPACITANCE (pF)

0

1

10

100

NUMBER OF CYCLES AT 60 Hz

Fi

. 3 Maximum Non-Repetitive Surge Current

T = 150 CJ°

100

T = 125 CJ°

T = 100 CJ°

1

1 10 100

V , REVERSE VOLTAGE (V)

R

.4 Typical Total Capacitance, Per Element

Fi

10

1.0

T=25CJ°

0.1
02040 6080

100

120

140

PERCENT OF RATED PEAK REVERSE VOLTAGE (%)

Fi

.5 Typical Reverse Characteristics

DS21218 Rev. 7 - 2 2 of 3 GBJ10005-GBJ1010

www.diodes.com

Ordering Information

(Note 5)

Device

GBJ10005-F

GBJ1001-F

GBJ1002-F

GBJ1004-F

GBJ1006-F

GBJ1008-F

GBJ1010-F

Notes: 5. For packaging details, visit our website at http://www.diodes.com/datasheets/ap2008.pdf.

Packaging Shipping

GBJ 15/Tube

GBJ 15/Tube

GBJ 15/Tube

GBJ 15/Tube

GBJ 15/Tube

GBJ 15/Tube

GBJ 15/Tube

IMPORTANT NOTICE

Diodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes without further
notice to any product herein. Diodes Incorporated does not assume any liability arising out of the application or use of any product described herein; neither
does it convey any license under its patent rights, nor the rights of others. The user of products in such applications shall assume all risks of such use and will
agree to hold Diodes Incorporated andallthecompanieswhoseproductsarerepresentedonourwebsite,harmless against all damages.

LIFE SUPPORT

Diodes Incorporated products are not authorized for use as critical componentsinlifesupportdevicesorsystemswithouttheexpressedwrittenapprovalofthe
President of Diodes Incorporated.

DS21218 Rev. 7 - 2 3 of 3 GBJ10005-GBJ1010

www.diodes.com