Diodes FCX619 User Manual

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50V NPN LOW SATURATION POWER TRANSISTOR IN SOT89
Features
Mechanical Data
Diodes Incorporated
FCX619
 BV  I  I  2W Power Dissipation  Low saturation voltage V
R h
Totally Lead-Free & Fully RoHS compliant (Notes 1 & 2) Halogen and Antimony Free. “Green” Device (Note 3) Qualified to AEC-Q101 Standards for High Reliability
> 50V
CEO
= 3A high Continuous Collector Current
C
up to 6A Peak Pulse Current
CM
< 220mV @ 1A
= 87mΩ @ 2.75A for a low equivalent on-resistance
CE(sat)
characterised up to 6A for high current gain hold-up
FE
CE(sat)
SOT89
Top View
B
 Case: SOT89  Case Material: Molded Plastic, “Green” Molding Compound  UL Flammability Rating 94V-0  Moisture Sensitivity: Level 1 per J-STD-020  Terminals: Finish - Matte Tin Plated Leads, Solderable per
MIL-STD-202, Method 208
Weight: 0.052 grams (Approximate)
Applications
Load Management Functions  Motor Control  DC-DC / DC-AC Converters
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E
Device Symbol Top View
Pin-Out
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Ordering Information (Note 4)
Product Marking Reel size (inches) Tape width (mm) Quantity per reel
FCX619TA 619 7 12 1,000
FCX619-13R 619 13 12 4,000
Notes: 1. No purposely added lead. Fully EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant.
2. See http://www.diodes.com/quality/lead_free.html for more information about Diodes Incorporated’s definitions of Halogen- and Antimony-free, "Green" and Lead-free.
3. Halogen- and Antimony-free "Green” products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and <1000ppm antimony compounds.
4. For packaging details, go to our website at http”//www.diodes.com/products/packages.html
Marking Information
FCX619
tasheet Number: DS33067 Rev. 7 - 2
Da
619
www.diodes.com
619 = Product Type Marking Code
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February 2013
© Diodes Incorporated
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Maximum Ratings (@T
Collector-Base Voltage Collector-Emitter Voltage Emitter-Base Voltage Continuous Collector Current Peak Pulse Current Continuous Base Current
Thermal Characteristics (@T
Power Dissipation
Thermal Resistance, Junction to Ambient Air Thermal Resistance, Junction to Leads (Note 7)
Operating and Storage Temperature Range
Notes: 5. For a device surface mounted on 15mm x 15mm x 0.6mm FR4 PCB with high coverage of single sided 1 oz copper, in still air conditions; the device is
measured when operating in steady state condition.
6. Same as note (5), except the device is mounted on 40mm x 40mm x 1.6mm FR4 PCB.
7. Thermal resistance from junction to solder-point (on the exposed collector pad).
= +25°C, unless otherwise specified.)
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Characteristic Symbol Value Unit
V
CBO
V
CEO
V
EBO
I
C
I
CM
I
B
= +25°C, unless otherwise specified.)
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Characteristic Symbol Value Unit
(Note 5) (Note 6) 2 (Note 5) (Note 6) 62.5
P
R R
T
J,TSTG
θJA
θJL
D
Diodes Incorporated
50 V 50 V
7 V 3 A 6 A
500 mA
1
125
5.73
-55 to +150
FCX619
W
C/W C/W
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Thermal Characteristics and Derating Information
1.0
0.8
0.6
0.4
0.2
0.0 0 25 50 75 100 125 150
Max Power Dissipation (W)
Temperature (°C)
Derating Curve
100
Single Pulse. T
10
amb
=25°C
Thermal Resistance (°C/W)
120 100
80
D=0.5
60 40
D=0.2
20
0
100µ 1m 10m 100m 1 10 100 1k
Single Pulse
D=0.05
D=0.1
Pulse Width (s)
Transient Thermal Impeda nc e
1
100µ 1m 10m 100m 1 10 100 1k
Max Power Dissipat i o n (W)
Pulse Width (s)
Pulse Power Dissipation
FCX619
tasheet Number: DS33067 Rev. 7 - 2
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www.diodes.com
February 2013
© Diodes Incorporated
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