Diodes FCX591A User Manual

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Diodes Incorporated

FCX591A

40V PNP SILICON PLANAR MEDIUM POWER TRANSISTOR IN SOT89

Features

• BV

• Maximum Continuous Current I

• Low saturation voltage V

• Complementary NPN type: FCX491A

• Totally Lead-Free & Fully RoHS compliant (Notes 1 & 2)

• Halogen and Antimony Free. “Green” Device (Note 3)

• Qualified to AEC-Q101 Standards for High Reliability

CEO

> -40V

= -1A

C

< -500mV @ -1A

CE(sat)

Mechanical Data

• Case: SOT89

• Case material: molded plastic. “Green” molding compound.

• UL Flammability Rating 94V-0

• Moisture Sensitivity: Level 1 per J-STD-020

• Terminals: Finish - Matte Tin Plated Leads, Solderable per

MIL-STD-202, Method 208

• Weight: 0.05 grams (Approximate)

Application

• Power MOSFET & IGBT gate driving

• Low loss power switching

SOT89

Top View

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Device Symbol

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Top View

Pin Out

Ordering Information (Note 4)

Product Marking Reel size (inches) Tape width (mm) Quantity per reel

FCX591ATA P2 7 12 1,000

FCX591A-13R P2 13 12 4,000

Notes: 1. No purposely added lead. Fully EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant.

2. See http://www.diodes.com for more information about Diodes Incorporated’s definitions of Halogen and Antimony free, "Green" and Lead-Free.

4. For packaging details, go to our website at http://www.diodes.com.

3. Halogen and Antimony free "Green” products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and <1000ppm antimony compounds.

Marking Information

FCX591A

tasheet Number: DS33062 Rev. 6 - 2

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P2

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P2 = Product Type Marking Code

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FCX591A

Maximum Ratings (@T

= +25°C, unless otherwise specified.)

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Characteristic Symbol Limit Unit

Collector-Base Voltage Collector-Emitter Voltage Emitter-Base Voltage Continuous Collector Current Peak Pulse Current Peak Base Current

V

CBO

V

CEO

V

EBO

I

C

I

CM

I

B

-40 V

-7 V

-1 A

-2 A

-200 mA

Thermal Characteristics

Characteristic Symbol Value Unit

Power Dissipation (Note 5) Thermal Resistance, Junction to Ambient Air (Note 5) Thermal Resistance, Junction to Leads (Note 6) Operating and Storage Temperature Range

P R R

T

J,TSTG

θJA θJL

D

1 W

125

10.01

-65 to +150

°C/W °C/W

°C

ESD Ratings (Note 7)

Electrostatic Discharge - Human Body Model ESD HBM ≥ 8,000 V 3B Electrostatic Discharge - Machine Model ESD MM ≥ 400 V C

Notes: 5. For a device surface mounted on 15mm X 15mm FR4 PCB with high coverage of single sided 1 oz copper, in still air conditions; device measured when

operating in steady state condition.

6. Thermal resistance from junction to solder-point (on the exposed collector pad).

7. Refer to JEDEC specification JESD22-A114 and JESD22-A115.

Characteristic Symbol Value Unit JEDEC Class

FCX591A

tasheet Number: DS33062 Rev. 6 - 2

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Thermal Characteristics and Derating Information

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FCX591A

1.0

0.8

0.6

0.4

0.2

0.0 0 25 50 75 100 125 150

Max Power Dissipation (W)

Temperature (°C)

Derat in g Curve

100

Single Pulse. T

10

amb

=25°C

120 100

80

D=0.5

60 40

D=0.2

20

0

100µ 1m 10m 100m 1 10 100 1k

Thermal Resistance (°C/W)

Pulse Width (s)

Single Pulse

D=0.05

D=0.1

Transient Thermal Impedance

1

100µ 1m 10m 100m 1 10 100 1k

Max Power Dissipatio n (W)

Pulse Width (s)

Pulse Power Dissipation

FCX591A

tasheet Number: DS33062 Rev. 6 - 2

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