Diodes FCX591 User Manual

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f

ECB

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60V PNP MEDIUM POWER TRANSISTOR IN SOT89

Features

Mechanical Data

Diodes Incorporated

FCX591

• BV

• I

• I

• R

• h

• Complementary NPN type: FCX491

• Totally Lead-Free & Fully RoHS compliant (Notes 1 & 2)

• Halogen and Antimony Free. “Green” Device (Note 3)

• Qualified to AEC-Q101 Standards for High Reliability

> -60V

CEO

= -1A high Continuous Collector Current

C

= -2A Peak Collector Current

CM

= 295mΩ for a Low Equivalent On-Resistance

CE(SAT)

characterized up to 2A for high current gain hold up

FE

SOT89

Top View

B

Device Symbol

• Case: SOT89

• Case Material: Molded Plastic. “Green” Molding Compound

UL Flammability Rating 94V-0

• Moisture Sensitivity: Level 1 per J-STD-020

• Terminals: Finish - Matte Tin Plated Leads, Solderable per

MIL-STD-202, Method 208

• Weight: 0.05 grams (Approximate)

C

E

Top View

Pin Out

Ordering Information (Note 4)

Product Marking Reel size (inches) Tape width (mm) Quantity per reel

FCX591TA P1 7 12 1,000

Notes: 1. No purposely added lead. Fully EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant.

2. See http://www.diodes.com/quality/lead_free.html for more information about Diodes Incorporated’s definitions of Halogen- and Antimony-free, "Green"
and Lead-free.

3. Halogen- and Antimony-free "Green” products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and
<1000ppm antimony compounds.

4. For packaging details, go to our website at http://www.diodes.com/products/packages.html.

Marking Information

P1

P1 = Product Type Marking Code

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Absolute Maximum Ratings (@T

= +25°C, unless otherwise specified.)

A

Characteristic Symbol Limit Unit

Collector-Base Voltage
Collector-Emitter Voltage
Emitter-Base Voltage
Continuous Collector Current
Peak Pulse Current
Base Current

Thermal Characteristics (@T

= +25°C, unless otherwise specified.)

A

Characteristic Symbol Value Unit

(Note 5)

Power Dissipation

(Note 6) 1.5

(Note 7) 2.0

(Note 5)

Thermal Resistance, Junction to Ambient Air

(Note 6) 83

(Note 7) 60

Thermal Resistance, Junction to Lead (Note 8)

Thermal Resistance, Junction to Case (Note 9)

Operating and Storage Temperature Range

ESD Ratings (Note 10)

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FCX591

V

CBO

V

CEO

V

EBO

I

C

I

CM

I

B

P

D

R

θJA

R

θJL

R

θJC

T

J, TSTG

-80 V

-60 V

-7 V

-1 A

-2 A

-200 mA

1

W

125

°C/W

22

16

-65 to +150 °C

Characteristic Symbol Value Unit JEDEC Class

Electrostatic Discharge - Human Body Model ESD HBM 4,000 V 3A

Electrostatic Discharge - Machine Model ESD MM 400 V C

Notes: 5. For a device mounted with the exposed collector pad on 15mm x 15mm 1oz copper that is on a single-sided 1.6mm FR4 PCB; device is measured

6. Same as Note 5, except the device is mounted on 25mm x 25mm 1oz copper.

7. Same as Note 5, except the device is mounted on 50mm x 50mm 1oz copper.

8. Thermal resistance from junction to solder-point (on the exposed collector pad).

9. Thermal resistance from junction to the top of the case.

10. Refer to JEDEC specification JESD22-A114 and JESD22-A115.

under still air conditions whilst operating in a steady-state.

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Thermal Characteristics and Derating Information

1.0

0.8

0.6

0.4

0.2

0.0
0 25 50 75 100 125 150

Max Power Dissipation (W)

Temperature (°C)

120

100

Thermal Resistance (°C/W)

Derating Curve

100

Single Pulse. T

amb

=25°C

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80

D=0.5

60

40

D=0.2

20

0

100µ 1m 10m 100m 1 10 100 1k

Single Pulse

D=0.05

D=0.1

Pulse Width (s)

Transient Thermal Impedance

FCX591

10

1

100µ 1m 10m 100m 1 10 100 1k

Max Power Dissipation (W)

Pulse Width (s)

Pulse Power Dissipation

140.0

120.0

100.0

80.0

60.0

40.0

Thermal Resistance (°C/W)

0 500 1000 1500 2000 2500

T

=25°C

amb

1oz copper

2oz copper

Maximum Power (W)

Copper Area (sqmm)

3

2oz copper

2

1oz copper

1

T

=25°C

amb

0

0 500 1000 1500 2000 2500

Copper Area (sqmm)

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Electrical Characteristics (@T

= +25°C, unless otherwise specified.)

A

Characteristic Symbol Min Typ Max Unit Test Condition

Collector-Base Breakdown Voltage

Collector-Emitter Breakdown Voltage (Note 11)

Emitter-Base Breakdown Voltage

Collector Cutoff Current

Emitter Cutoff Current

Emitter Cutoff Current

BV

BV

BV

I

CBO

I

EBO

I

CES

CBO

CEO

EBO

-80 — — V

-60 — — V

-7 -8.1 — V

— <1 -100 nA

— <1 -100 nA

— <1 -100 nA

100

DC current transfer Static ratio (Note 11)

h

FE

100

80
15

Collector-Emitter Saturation Voltage (Note 11)

Base-Emitter Saturation Voltage (Note 11)

Base-Emitter Turn-on Voltage (Note 11)

Transitional Frequency f

Output capacitance

Note: 11. Measured under pulsed conditions. Pulse width ≤ 300μs. Duty cycle ≤ 2%.

V

CE(sat)

V

BE(sat)

V

BE(on)

C

T

obo

—

— -965 -1200 mV

— -830 -1000 mV

150 — — MHz

— — 10 pF

220
175
155

40

-155

-295

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—
—

300

—

-300

-600

—

mV

FCX591

IC = -100µA, IE = 0

IC = -10mA, IB = 0

IE = -100µA, IC = 0

V

= -60V

CB

VEB = -5.6V, IC = 0

V

= -60V

CES

= -1mA, VCE = -5V

I

C

= -500mA, VCE = -5V

I

C

= -1A, VCE = -5V

I

C

= -2A, VCE = -5V

I

C

= -500mA, IB = -50mA

I

C

I

= -1A, IB = -100mA

C

IC = -1A, IB = -100mA

IC = -1A, VCE = -5V

I

= -50mA, VCE = -10V

E

f = 100MHz

V

= -10V, f = 1MHz,

CB

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Typical Electrical Characteristics (@T

= +25°C, unless otherwise specified.)

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FCX591

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Package Outline Dimensions

Please see AP02002 at http://www.diodes.com/datasheets/ap02002.pdf for latest version.

D1

E

0

0

2

.

0

R

1

H

C

H

B1

8° (4X)

L

B

e

A

D

Suggested Pad Layout

Please see AP02001 at http://www.diodes.com/datasheets/ap02001.pdf for the latest version.

Y3

Y

X (3x)

X1

X2 (2x)

Y2

Dimensions Value (in mm)

X 0.900

X1 1.733

Y1

Y4

C

X2 0.416

Y 1.300
Y1 4.600
Y2 1.475
Y3 0.950
Y4 1.125

C 1.500

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FCX591

SOT89

Dim Min Max

A 1.40 1.60
B 0.44 0.62

B1 0.35 0.54

C 0.35 0.44
D 4.40 4.60

D1 1.62 1.83

E 2.29 2.60
e 1.50 Typ
H 3.94 4.25

H1 2.63 2.93

L 0.89 1.20

All Dimensions in mm

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IMPORTANT NOTICE

DIODES INCORPORATED MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARDS TO THIS DOCUMENT,
INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE
(AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION).

Diodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes
without further notice to this document and any product described herein. Diodes Incorporated does not assume any liability arising out of the
application or use of this document or any product described herein; neither does Diodes Incorporated convey any license under its patent or
trademark rights, nor the rights of others. Any Customer or user of this document or products described herein in such applications shall assume
all risks of such use and will agree to hold Diodes Incorporated and all the companies whose products are represented on Diodes Incorporated
website, harmless against all damages.

Diodes Incorporated does not warrant or accept any liability whatsoever in respect of any products purchased through unauthorized sales channel.
Should Customers purchase or use Diodes Incorporated products for any unintended or unauthorized application, Customers shall indemnify and
hold Diodes Incorporated and its representatives harmless against all claims, damages, expenses, and attorney fees arising out of, directly or
indirectly, any claim of personal injury or death associated with such unintended or unauthorized application.

Products described herein may be covered by one or more United States, international or foreign patents pending. Product names and markings
noted herein may also be covered by one or more United States, international or foreign trademarks.

This document is written in English but may be translated into multiple languages for reference. Only the English version of this document is the
final and determinative format released by Diodes Incorporated.

LIFE SUPPORT

Diodes Incorporated products are specifically not authorized for use as critical components in life support devices or systems without the express
written approval of the Chief Executive Officer of Diodes Incorporated. As used herein:

A. Life support devices or systems are devices or systems which:

1. are intended to implant into the body, or

2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the

labeling can be reasonably expected to result in significant injury to the user.

B. A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the
failure of the life support device or to affect its safety or effectiveness.

Customers represent that they have all necessary expertise in the safety and regulatory ramifications of their life support devices or systems, and
acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any
use of Diodes Incorporated products in such safety-critical, life support devices or systems, notwithstanding any devices- or systems-related
information or support that may be provided by Diodes Incorporated. Further, Customers must fully indemnify Diodes Incorporated and its
representatives against any damages arising out of the use of Diodes Incorporated products in such safety-critical, life support devices or systems.

Copyright © 2014, Diodes Incorporated

www.diodes.com

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