Diodes FCX591 User Manual

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60V PNP MEDIUM POWER TRANSISTOR IN SOT89

Features

Mechanical Data

Diodes Incorporated

FCX591

• BV

• I

• I

• R

• h

• Complementary NPN type: FCX491

• Totally Lead-Free & Fully RoHS compliant (Notes 1 & 2)

• Halogen and Antimony Free. “Green” Device (Note 3)

• Qualified to AEC-Q101 Standards for High Reliability

> -60V

CEO

= -1A high Continuous Collector Current

C

= -2A Peak Collector Current

CM

= 295mΩ for a Low Equivalent On-Resistance

CE(SAT)

characterized up to 2A for high current gain hold up

FE

SOT89

Top View

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Device Symbol

• Case: SOT89

• Case Material: Molded Plastic. “Green” Molding Compound

UL Flammability Rating 94V-0

• Moisture Sensitivity: Level 1 per J-STD-020

• Terminals: Finish - Matte Tin Plated Leads, Solderable per

MIL-STD-202, Method 208

• Weight: 0.05 grams (Approximate)

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Top View

Pin Out

Ordering Information (Note 4)

Product Marking Reel size (inches) Tape width (mm) Quantity per reel

FCX591TA P1 7 12 1,000

Notes: 1. No purposely added lead. Fully EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant.

2. See http://www.diodes.com/quality/lead_free.html for more information about Diodes Incorporated’s definitions of Halogen- and Antimony-free, "Green"
and Lead-free.

3. Halogen- and Antimony-free "Green” products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and
<1000ppm antimony compounds.

4. For packaging details, go to our website at http://www.diodes.com/products/packages.html.

Marking Information

P1

P1 = Product Type Marking Code

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Absolute Maximum Ratings (@T

= +25°C, unless otherwise specified.)

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Characteristic Symbol Limit Unit

Collector-Base Voltage
Collector-Emitter Voltage
Emitter-Base Voltage
Continuous Collector Current
Peak Pulse Current
Base Current

Thermal Characteristics (@T

= +25°C, unless otherwise specified.)

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Characteristic Symbol Value Unit

(Note 5)

Power Dissipation

(Note 6) 1.5

(Note 7) 2.0

(Note 5)

Thermal Resistance, Junction to Ambient Air

(Note 6) 83

(Note 7) 60

Thermal Resistance, Junction to Lead (Note 8)

Thermal Resistance, Junction to Case (Note 9)

Operating and Storage Temperature Range

ESD Ratings (Note 10)

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Diodes Incorporated

FCX591

V

CBO

V

CEO

V

EBO

I

C

I

CM

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B

P

D

R

θJA

R

θJL

R

θJC

T

J, TSTG

-80 V

-60 V

-7 V

-1 A

-2 A

-200 mA

1

W

125

°C/W

22

16

-65 to +150 °C

Characteristic Symbol Value Unit JEDEC Class

Electrostatic Discharge - Human Body Model ESD HBM 4,000 V 3A

Electrostatic Discharge - Machine Model ESD MM 400 V C

Notes: 5. For a device mounted with the exposed collector pad on 15mm x 15mm 1oz copper that is on a single-sided 1.6mm FR4 PCB; device is measured

6. Same as Note 5, except the device is mounted on 25mm x 25mm 1oz copper.

7. Same as Note 5, except the device is mounted on 50mm x 50mm 1oz copper.

8. Thermal resistance from junction to solder-point (on the exposed collector pad).

9. Thermal resistance from junction to the top of the case.

10. Refer to JEDEC specification JESD22-A114 and JESD22-A115.

under still air conditions whilst operating in a steady-state.

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Thermal Characteristics and Derating Information

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0.8

0.6

0.4

0.2

0.0
0 25 50 75 100 125 150

Max Power Dissipation (W)

Temperature (°C)

120

100

Thermal Resistance (°C/W)

Derating Curve

100

Single Pulse. T

amb

=25°C

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80

D=0.5

60

40

D=0.2

20

0

100µ 1m 10m 100m 1 10 100 1k

Single Pulse

D=0.05

D=0.1

Pulse Width (s)

Transient Thermal Impedance

FCX591

10

1

100µ 1m 10m 100m 1 10 100 1k

Max Power Dissipation (W)

Pulse Width (s)

Pulse Power Dissipation

140.0

120.0

100.0

80.0

60.0

40.0

Thermal Resistance (°C/W)

0 500 1000 1500 2000 2500

T

=25°C

amb

1oz copper

2oz copper

Maximum Power (W)

Copper Area (sqmm)

3

2oz copper

2

1oz copper

1

T

=25°C

amb

0

0 500 1000 1500 2000 2500

Copper Area (sqmm)

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tasheet Number: DS33061 Rev. 4 - 2

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