Diodes FCX1051A User Manual

FCX1051A

C
E
B

SOT89 NPN medium power transistor

Summary

BV
V
R
P
Complimentary type - FCX1151A
CEO
C(cont)
CE(sat)
CE(sat)
= 2W
D
> 40V
= 3A
< 120mV @ 1A
= 57m

Description

An NPN low voltage, high gain bipolar transistor offering very low saturation voltage and excellent current handling in the SOT89 package.

Features

Very low saturation voltage
•High gain
Small outline package

Applications

Motor drive
•Strobe flash
E
MOSFET and IGBT gate driving
DC -DC converters
C

Ordering information

Device Reel size
(inches)
FCX1051ATA 7 12 1,000
Tape width
(mm)
Quantity
per reel
Pinout - top view

Device mark

051
Issue 2 - July 2007 1 www.zetex.com
© Zetex Semiconductors plc 2007
C
B
FCX1051A

Absolute maximum ratings

Parameter Symbol Value Unit
Collector-base voltage V
Collector-emitter voltage V
Emitter-base voltage V
Peak pulse current
(a)
Continuous collector current I
Power dissipation at T
= 25°C P
amb
Operating and storage temperature range T
NOTES:
(a) Measured under pulsed conditions. Pulse width=300
request for these devices. Refer to the handling instructions for soldering surface mount components. (b) Recommended P (c) Maximum power dissipation is calculated assuming that the device is mounted on FR4 substrate measuring
40x40x0.6mm and using comparable measurement methods adopted by other suppliers.
calculated using FR4 measuring 15x15x0.6mm.
tot
s. Duty cycle 2%. Spice parameter data is available upon
CBO
CEO
EBO
CM
C
tot
j;Tstg
150 V
40 V
5V
10 A
3A
(b)
1
(c)
2
W
W
-55 to +150 °C

Typical characteristics

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© Zetex Semiconductors plc 2007
FCX1051A
NOTES:
Electrical characteristics (@ T
= 25°C unless otherwise stated)
amb
Parameter Symbol Min. Typ. Max. Unit Conditions
Collector-base
V
(BR)CBO
150 V IC = 100µA
breakdown voltage
Collector-emitter
V
150 V IC = 100µA
CES
breakdown voltage
Collector-emitter
V
40 V IC = 10mA
CEO
breakdown voltage
Collector-emitter
V
150 V IC =100µA, V
CEV
breakdown voltage
Emitter-base
V
(BR)EBO
5 V IE = 100µA
breakdown voltage
Collector cut-off
CBO
0.3 10 nA VCB = 120V
current
Emitter cut-off current I
Collector emitter cut-
0.3 10 nA VEB = 4V
EBO
CES
0.3 10 nA V
CES
= 120V
off current
Collector-emitter saturation voltage
Base-emitter saturation voltage
Base-emitter turn-on voltage
Static forward current transfer ratio
Transition frequency f
V
CE(sat)
V
BE(sat)
V
BE(on)
h
FE
T
17 25 mV
85 120 mV
140 180 mV
170 250 mV
250 340 mV
880 1000 mV
840 950 mV
290 440 1200
270 450
270 360
130 220
40 55
155 MHz IC = 50mA, VCE = 10V
= 0.2A, IB = 10mA
C
= 1A, IB = 10mA
C
= 2A, IB = 20mA
C
= 3A, IB = 40mA
C
= 5A, IB = 100mA
C
= 3A, IB = 40mA
C
= 3A, VCE = 2V
C
= 10mA, VCE = 2V
C
= 1A, VCE = 2V
C
= 3A, VCE = 2V
C
= 5A, VCE = 2V
C
= 10A, VCE = 2V
C
f = 100MHz
Output capacitance C
Switching times t
obo
220 ns IC = 3A, IB = 30mA, VCC = 10V
on
t
off
27 40 pF VCB = 10V, f = 1MHz
540 ns IC = 3A, IB = 30mA, VCC = 10V
EB
= 1V
(*)
(*)
(*)
(*)
(*)
(*)
(*)
(*)
(*)
(*)
(*)
(*)
(*) Measured under pulsed conditions. Pulse width=300s. Duty cycle ⱕ2%.
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© Zetex Semiconductors plc 2007

Typical characteristics

FCX1051A
0.5
+25°C
0.4
0.3
- (V)
0.2
CE(sat)
V
0.1
0
1m
750
VCE=2V
600
+100°C
450
+25°C
300
- Typical gain
FE
h
150
-55°C
IC/IB=50
IC/IB=100
IC/IB=200
10m 100m 1 10
IC- Collector Current (A)
V
CE(sat)
v I
C
0.5
0.4
0.3
- (V)
0.2
CE(sat)
V
0.1
1.6
1.2
- (V)
0.8
BE(sat)
V
0.4
IC/IB=100
-55°C
+25°C +100°C +150°C
0
1m
10m 100m 1 10
IC- Collector Current (A)
IC/IB=100
V
-55°C
+25°C +100°C +150°C
CE(sat)
v I
C
1.0
0.8
0.6
- (V)
0.4
BE(on)
V
0.2
0
1m
10m 100m 1 10
IC - Collector Current (A)
hFEv I
0
1m
10m 100m 1 10
C
-55°C
+25°C +100°C +150°C
0
1m
10m 100m 1 10
IC - Collector Current (A)
V
BE(sat)
v I
C
IC- Collector Current (A)
V
BE(on)
v I
C
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© Zetex Semiconductors plc 2007
FCX1051A
D1
D
A
C
B1
L
E
H
E1
B
e
e1

Package outline - SOT89

DIM Millimeters Inches DIM Millimeters Inches
Min Max Min Max Min Max Min Max
A 1.40 1.60 0.550 0.630 E 2.29 2.60 0.090 0.102
B 0.44 0.56 0.017 0.022 E1 2.13 2.29 0.084 0.090
B1 0.36 0.48 0.014 0.019 e 1.50 BSC 0.059 BSC
C 0.35 0.44 0.014 0.017 e1 3.00 BSC 0.118 BSC
D 4.40 4.60 0.173 0.181 H 3.94 4.25 0.155 0.167
D1 1.52 1.83 0.064 0.072 L 0.89 1.20 0.035 0.047
Note: Controlling dimensions are in millimeters. Approximate dimensions are provided in inches
Issue 2 - July 2007 5 www.zetex.com
© Zetex Semiconductors plc 2007
FCX1051A
Definitions Product change
Zetex Semiconductors reserves the right to alter, without notice, specifications, design, price or conditions of supply of any product or service. Customers are solely responsible for obtaining the latest relevant information before placing orders.
Applications disclaimer
The circuits in this design/application note are offered as design ideas. It is the responsibility of the user to ensure that the circuit is fit for the user’s application and meets with the user’s requirements. No representation or warranty is given and no liability whatsoever is assumed by Zetex with respect to the accuracy or use of such information, or infringement of patents or other intellectual property rights arising from such use or otherwise. Zetex does not assume any legal responsibility or will not be held legally liable (whether in contract, tort (including negligence), breach of statutory duty, restriction or otherwise) for any damages, loss of profit, business, contract, opportunity or consequential loss in the use of these circuit applications, under any circumstances.
Life support
Zetex products are specifically not authorized for use as critical components in life support devices or systems without the express written approval of the Chief Executive Officer of Zetex Semiconductors plc. As used herein: A. Life support devices or systems are devices or systems which:
1. are intended to implant into the body
or
2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the labeling can be reasonably expected to result in significant injury to the user.
B. A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to
cause the failure of the life support device or to affect its safety or effectiveness.
Reproduction
The product specifications contained in this publication are issued to provide outline information only which (unless agreed by the company in writing) may not be used, applied or reproduced for any purpose or form part of any order or contract or be regarded as a representation relating to the products or services concerned.
Terms and Conditions
All products are sold subjects to Zetex’ terms and conditions of sale, and this disclaimer (save in the event of a conflict between the two when the terms of the contract shall prevail) according to region, supplied at the time of order acknowledgement. For the latest information on technology, delivery terms and conditions and prices, please contact your nearest Zetex sales office.
Quality of product
Zetex is an ISO 9001 and TS16949 certified semiconductor manufacturer. To ensure quality of service and products we strongly advise the purchase of parts directly from Zetex Semiconductors or one of our regionally authorized distributors. For a complete listing of authorized distributors please visit: www.zetex.com/salesnetwork Zetex Semiconductors does not warrant or accept any liability whatsoever in respect of any parts purchased through unauthorized sales channels. ESD (Electrostatic discharge) Semiconductor devices are susceptible to damage by ESD. Suitable precautions should be taken when handling and transporting devices. The possible damage to devices depends on the circumstances of the handling and transporting, and the nature of the device. The extent of damage can vary from immediate functional or parametric malfunction to degradation of function or performance in use over time. Devices suspected of being affected should be replaced.
Green compliance
Zetex Semiconductors is committed to environmental excellence in all aspects of its operations which includes meeting or exceeding reg­ulatory requirements with respect to the use of hazardous substances. Numerous successful programs have been implemented to reduce the use of hazardous substances and/or emissions. All Zetex components are compliant with the RoHS directive, and through this it is supporting its customers in their compliance with WEEE and ELV directives.
Product status key:
“Preview” Future device intended for production at some point. Samples may be available “Active” Product status recommended for new designs “Last time buy (LTB)” Device will be discontinued and last time buy period and delivery is in effect “Not recommended for new designs” “Obsolete” Production has been discontinued
Datasheet status key:
“Draft version” This term denotes a very early datasheet version and contains highly provisional information, which
“Provisional version” This term denotes a pre-release datasheet. It provides a clear indication of anticipated performance.
“Issue” This term denotes an issued datasheet containing finalized specifications. However, changes to
Zetex sales offices
Europe
Zetex GmbH Kustermann-park Balanstraße 59 D-81541 München Germany Telefon: (49) 89 45 49 49 0 Fax: (49) 89 45 49 49 49 europe.sales@zetex.com
© 2007 Published by Zetex Semiconductors plc
Device is still in production to support existing designs and production
may change in any manner without notice.
However, changes to the test conditions and specifications may occur, at any time and without notice.
specifications may occur, at any time and without notice.
Americas
Zetex Inc 700 Veterans Memorial Highway Hauppauge, NY 11788 USA
Telephone: (1) 631 360 2222 Fax: (1) 631 360 8222 usa.sales@zetex.com
Asia Pacific
Zetex (Asia Ltd) 3701-04 Metroplaza Tower 1 Hing Fong Road, Kwai Fong Hong Kong
Telephone: (852) 26100 611 Fax: (852) 24250 494 asia.sales@zetex.com
Corporate Headquarters
Zetex Semiconductors plc Zetex Technology Park, Chadderton Oldham, OL9 9LL United Kingdom
Telephone: (44) 161 622 4444 Fax: (44) 161 622 4446 hq@zetex.com
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© Zetex Semiconductors plc 2007
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