Features
• Glass Passivated Die Construction
• Super-Fast Recovery Time For High Efficiency
• Surge Overload Rating to 100A Peak
• Ideally Suited for Automated Assembly
• Lead Free Finish/RoHS Compliant (Note 1)
• Green Molding Compound (No Halogen and Antimony)
(Note 2)
Top View
Green
ES3A/AB - ES3D/DB
3.0A SURFACE MOUNT SUPER-FAST RECTIFIER
Mechanical Data
• Case: SMB/SMC
• Case Material: Molded Plastic. UL Flammability Classification
Rating 94V-0
• Moisture Sensitivity: Level 1 per J-STD-020
• Terminals: Lead Free Plating (Matte Tin Finish). Solderable per
MIL-STD-202, Method 208
• Polarity: Cathode Band or Cathode Notch
• SMB Weight: 0.093 grams (approximate)
• SMC Weight: 0.21 grams (approximate)
Bottom View
Ordering Information (Note 3)
Part Number Case Packaging
ES3x-13-F SMC 3000/Tape & Reel
ES3xB-13-F SMB 3000/Tape & Reel
* x = Device type, e.g. ES3A-13-F (SMC package); ES3AB-13-F (SMB package).
Notes: 1. EU Directive 2002/95/EC (RoHS). All applicable RoHS exemptions applied, see EU Directive 2002/95/EC Annex Notes.
2. Product manufactured with Data Code 0924 (week 24, 2009) and newer are built with Green Molding Compound.
3. For packaging details, go to our website at http://www.diodes.com.
Marking Information
ES3A/AB - ES3D/DB
Document number: DS14003 Rev. 15 - 2
YWW
ES3x(B)
ES3x = Product type marking code, ex: ES3A (SMC package)
ES3xB = Product type marking code, ex: ES3AB (SMB package)
= Manufacturers’ code marking
YWW = Date code marking
Y = Last digit of year (ex: 2 for 2002)
WW = Week code (01 to 53)
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)
RAG
R
C
T
F
C
URRENT
NSTAN
T
N
O
US F
O
R
RD C
URREN
T
Maximum Ratings @T
= 25°C unless otherwise specified
A
Single phase, half wave, 60Hz, resistive or inductive load.
For capacitance load, derate current by 20%.
Characteristic Symbol ES3A/AB ES3B/BB ES3C/CB ES3D/DB Unit
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
V
V
DC Blocking Voltage (Note 4)
RMS Reverse Voltage
V
R(RMS
Average Rectified Output Current @ TT = 100°CIO
Non-Repetitive Peak Forward Surge Current 8.3ms
Single Half Sine-Wave Superimposed on Rated Load
I
Thermal Characteristics
Characteristic Symbol Value Unit
Typical Thermal Resistance, Junction to Terminal
Typical Thermal Resistance, Junction to Ambient (Note 5)
Operating and Storage Temperature Range
R
R
T
J, TSTG
RRM
RWM
V
R
FSM
JT
θ
JA
θ
ES3A/AB - ES3D/DB
50 100 150 200 V
35 70 105 140 V
3.0 A
100 A
10
50
-55 to +150
°C/W
°C
°C
Electrical Characteristics @T
= 25°C unless otherwise specified
A
Characteristic Symbol Value Unit
Maximum Forward Voltage @ IF = 3.0A VFM
Peak Reverse Current @ TA = 25°C
at Rated DC Blocking Voltage (Note 4) @ TA = 125°C
Maximum Reverse Recovery Time (Note 6)
Typical Total Capacitance (Note 7)
Notes: 4. Short duration pulse test used to minimize self-heating effect.
5. Unit mounted on PC board with 5.0 mm
6. Measured with I
7. Measured at 1.0MHz and applied reverse voltage of 4.0V DC.
= 0.5A, IR = 1.0A, Irr = 0.25A. See Figure 5.
F
2
(0.013 mm thick) copper pads as heat sink.
IRM
trr
CT
4
Note 3
(A)
3
IED
2
I
E
E
1
(A)
WA
E
A
10
1.0
0.1
0.9 V
10
500
25 ns
45 pF
μA
O
I, AVE
0
25 75
50 125 150 175
T , TERMINAL TEMPERATURE ( C)
T
Fig. 1 Forward Current Derating Curve
100
°
F
I, I
0.01
0 0.4 0.8 1.2 1.6
V , INSTANT ANEO US FORWARD VOLTAGE (V)
F
Fig. 2 Typi cal Forward C haracter istics
ES3A/AB - ES3D/DB
Document number: DS14003 Rev. 15 - 2
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P
FORWAR
URGE CUR
REN
T
NSTAN
T
N
O
US R
R
CUR
REN
T
ES3A/AB - ES3D/DB
120
(A)
100
80
60
D S
40
EAK
20
FSM
I,
0
110100
NUMBER OF CYCLES AT 60Hz
Fig. 3 Surge Current Derating Curve
Single Half-Sine-Wave
1,000
(µA)
T = 125C
°
100
SE
EVE
10
E
A
R
1.0
I, I
04080120
PERCENT OF RATED PEAK REVERSE VOLTAGE (%)
Fig. 4 Typical Reverse Characteristics
J
T = 25C
°
J
Fig. 5 Reverse Recovery Time Characteristic and Test Circuit
Package Outline Dimensions
A
J
ES3A/AB - ES3D/DB
Document number: DS14003 Rev. 15 - 2
B
SMB
Dim Min Max
C
A 3.30 3.94
B 4.06 4.57
C 1.96 2.21
D 0.15 0.31
D
E 5.00 5.59
G 0.05 0.20
H 0.76 1.52
J 2.00 2.50
G
H
All Dimensions in mm
All Dimensions in mm
SMC
Dim Min Max
A 5.59 6.22
B 6.60 7.11
C 2.75 3.18
D 0.15 0.31
E 7.75 8.13
G 0.10 0.20
H 0.76 1.52
J 2.00 2.50
E
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© Diodes Incorporated
ES3A/AB - ES3D/DB
Suggested Pad Layout
DIODES INCORPORATED MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARDS TO THIS DOCUMENT,
INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE
(AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION).
Diodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes
without further notice to this document and any product described herein. Diodes Incorporated does not assume any liability arising out of the
application or use of this document or any product described herein; neither does Diodes Incorporated convey any license under its patent or
trademark rights, nor the rights of others. Any Customer or user of this document or products described herein in such applications shall assume
all risks of such use and will agree to hold Diodes Incorporated and all the companies whose products are represented on Diodes Incorporated
website, harmless against all damages.
Diodes Incorporated does not warrant or accept any liability whatsoever in respect of any products purchased through unauthorized sales channel.
Should Customers purchase or use Diodes Incorporated products for any unintended or unauthorize d application, Customers shall indemnify and
hold Diodes Incorporated and its representatives harmless against all claims, damages, expenses, and attorney fees arising out of, directly or
indirectly, any claim of personal injury or death associated with such unintended or unauthorized application.
Products described herein may be covered by one or more United States, international or foreign patents pending. Product names and markings
noted herein may also be covered by one or more United States, international or foreign trademarks.
Diodes Incorporated products are specifically not authorized for use as critical components in life support devices or systems without the express
written approval of the Chief Executive Officer of Diodes Incorporated. As used herein:
A. Life support devices or systems are devices or systems which:
1. are intended to implant into the body, or
2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the
labeling can be reasonably expected to result in significant injury to the user.
B. A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the
failure of the life support device or to affect its safety or effectiveness.
Customers represent that they have all necessary expertise in the safety and regulatory ramifications of their life support devices or systems, and
acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any
use of Diodes Incorporated products in such safety-critical, life support devices or systems, notwithstanding any devices- or systems-related
information or support that may be provided by Diodes Incorporated. Further, Customers must fully indemnify Diodes Incorporated and its
representatives against any damages arising out of the use of Diodes Incorporated products in such safety-critical, life support devices or systems.
Copyright © 2010, Diodes Incorporated
www.diodes.com
SMB
Dimensions
Z 6.7
G 1.8
X 2.3
Y 2.5
C 4.3
IMPORTANT NOTICE
LIFE SUPPORT
Value (in mm)
SMC
Dimensions
Z 9.3
G 4.4
X 3.3
Y 2.5
C 6.8
Value (in mm)
ES3A/AB - ES3D/DB
Document number: DS14003 Rev. 15 - 2
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