Diodes ES2G User Manual

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r

Features

• Glass Passivated Die Construction

• Super-Fast Recovery Time For High Efficiency

• Surge Overload Rating to 50A Peak

• Ideally Suited for Automated Assembly

• Lead Free Finish/RoHS Compliant (Note 1)

• Green Molding Compound (No Halogen and Antimony)

(Note 2)

Maximum Ratings @T

= 25°C unless otherwise specified

A

Single phase, half wave, 60Hz, resistive or inductive load.
For capacitance load, derate current by 20%.

Characteristic Symbol Value Unit

Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage (Note 6)

RMS Reverse Voltage
Average Rectified Output Current @ TT = 110°C IO

Non-Repetitive Peak Forward Surge Current8.3ms
Single Half Sine-Wave Superimposed on Rated Load

Top View Bottom View

V
V

V

R(RMS

I



Green

2.0A SURFACE MOUNT SUPER-FAST RECTIFIER

Mechanical Data

• Case: SMB

• Case Material: Molded Plastic. UL Flammability Classification

Rating 94V-0

• Moisture Sensitivity: Level 1 per J-STD-020

• Terminals: Lead Free Plating (Matte Tin Finish). Solderable per

MIL-STD-202, Method 208

• Polarity: Cathode Band or Cathode Notch

• Marking Information: See Page 3

• Ordering Information: See Page 3

• Weight: 0.093 grams (approximate)

RRM
RWM

VR

FSM

400 V

280 V

2.0 A
50 A

ES2G

Thermal Characteristics

Characteristic Symbol Value Unit

Typical Thermal Resistance, Junction to Terminal (Note 3)
Operating and Storage Temperature Range

R

T

J, TSTG

JT

Electrical Characteristics @T

= 25°C unless otherwise specified

A

Characteristic Symbol Value Unit

Forward Voltage @ IF = 2.0A VFM
Peak Reverse Current @ TA = 25°C
at Rated DC Blocking Voltage (Note 6) @ TA = 125°C
Reverse Recovery Time (Note 5)
Typical Capacitance (Note 4)

Notes: 1. EU Directive 2002/95/EC (RoHS). All applicable RoHS exemptions applied, see EU Directive 2002/95/EC Annex Notes.

2. Product manufactured with Data Code 0924 (week 24, 2009) and newer are built with Green Molding Compound.

3. Unit mounted on PC board with 5.0 mm

4. Measured at 1.0MHz and applied reverse voltage of 4.0V DC.

5. Measured with I

6. Short duration pulse test used to minimize self-heating effect

= 0.5A, IR = 1.0A, Irr = 0.25A. See Figure 5.

F

2

(0.013 mm thick) copper pads as heat sink.

IRM

t

r

CT

ES2G

Document number: DS30212 Rev. 8 - 2

1 of 4

www.diodes.com

20

-55 to +150

1.25 V

5.0

350

35 ns
25 pF

September 2010

© Diodes Incorporated

°C/W

°C

μA

RAGE FORWARD CUR

REN

T

P

FORWAR

URGE CUR

RENT

0.75

(A)

2.0

10

ES2G

1.6

1.2

0.8

0.4

O

I, AVE

0

25 50 75 100 125 150 175

T , TERMINAL TEMPERATURE ( C)

T

Fig. 1 Forward Current Derating Curve

60

(A)

Single Half-Sine-Wave

50

40

30

D S

1.0

0.1

F

I , INSTANTANEOUS FORWARD CURRENT (A)

0.01
0 0.4 0.8 1.2 1.6

°

V , INSTANTANEOUS FORWARD VOLTAGE (V)

F

Fig. 2 Typical Forward Character istics

1,000

100

10

20

EAK

10

FSM

I,

0

110100

NUMBER OF CYCLES AT 60Hz

Fig. 3 Surge Current Derating Curve

1.0

0.1

0

80

V , INSTANTA NEOUS REVERSE VOLTAGE (V)

R

160 240

Fig. 4 Typical Reverse Characteristics

320

400

Set time base for 50/100 ns/cm

ES2G

Document number: DS30212 Rev. 8 - 2

2 of 4

www.diodes.com

September 2010

© Diodes Incorporated