Diodes DXT2010P5 User Manual

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Features
43% smaller than SOT223; 60% smaller than TO252
Maximum height just 1.1mm
Rated up to 3.2W
V
I
Low Saturation voltage
Lead, Halogen and Antimony Free, RoHS Compliant (Note 1)
“Green” Device (Note 2)
= 60V
CEO
= 6A; ICM = 20A
C
Applications
Motor driver
Regulator circuit
ADVANCE INFORMATION
Top View Bottom View Pin-out diagram
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DXT2010P5
60V NPN MEDIUM POWER TRANSISTOR
PowerDI
Mechanical Data
Case: PowerDI®5
Case Material: Molded Plastic, “Green” Molding Compound.
UL Flammability Classification Rating 94V-0
Moisture Sensitivity: Level 1 per J-STD-020
Terminals: Finish – Matte Tin annealed over Copper leadframe.
Solderable per MIL-STD-202, Method 208
Weight: 0.093 grams (approximate)
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Device Schematic
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®
5
Ordering Information (Note 3)
Part Number Case Packaging
DXT2010P5-13 PowerDI®5 5000/Tape & Reel
Notes: 1. No purposefully added lead. Halogen and Antimony Free.
3. For packaging details, go to our website at http://www.diodes.com/datasheets/ap02007.pdf.
2. Diodes Inc’s “Green” Policy can be found on our website at http://www.diodes.com
Marking Information
DXT2010
YYWWK
DXT2010P5
Document number: DS32011 Rev. 2 - 2
DXT2010 = Product Type Marking Code
= Manufacturers’ Code Marking K = Factory Designator YYWW = Date Code Marking YY = Last Two Digits of Year (ex: 09 for 2009) WW = Week code (01 to 53)
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DXT2010P5
Maximum Ratings @T
= 25°C unless otherwise specified
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Characteristic Symbol Value Unit Collector-Base Voltage Collector-Emitter Voltage Emitter-Base Voltage Continuous Collector Current Peak Pulse Current
V
CBO
V
CEO
V
EBO
I
C
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CM
150 V
60 V
7 V 6 A
20 A
Thermal Characteristics
Characteristic Symbol Value Unit
Power Dissipation @ TA = 25°C (Note 4) PD Thermal Resistance, Junction to Ambient Air (Note 4) @TA = 25°C
R
JA
Power Dissipation @ TA = 25°C (Note 5) PD Thermal Resistance, Junction to Ambient Air (Note 5) @TA = 25°C
ADVANCE INFORMATION
Power Dissipation @ TA = 25°C (Note 6) PD Thermal Resistance, Junction to Ambient Air (Note 6) @TA = 25°C Thermal Resistance, Junction to Collector Terminal Operating and Storage Temperature Range
Notes: 4. Device mounted on FR-4 PCB, single sided 2 o z. coppe r, collector pad dimensions 25mm x 25mm.
5. Device mounted on FR-4 PCB, single sided 1 oz. copper, collector pad dimensions 50mm x 50mm.
6. Device mounted on FR-4 PCB, single sided 1 oz. copper, minimum recommended pad layout.
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JT
, T
T
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STG
DXT2010P5
Document number: DS32011 Rev. 2 - 2
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3.2 W 39 °C/W
1.7 W 75 °C/W
0.74 W 169 °C/W
5.6 °C/W
-55 to +150 °C
March 2010
© Diodes Incorporated
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V
CE(sat)
Limited
10
1
DC
1s
100ms
amb
10ms
=25°C
1ms
100µs
100m
Single Pulse. T
Collector Current (A)
C
I
10m
100m 1 10 100
See note 3
VCE Collector-Emitter Voltage (V)
Safe Operating Area
3.5
3.0
2.5
2.0
1.5
1.0
0.5
0.0 0 25 50 75 100 125 150 175
Max Power Dissipation (W)
Temperature (°C)
Derating Curve
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See note 3
See note 4
See note 5
ADVANCE INFORMATION
40
See note 3
30
D=0.5
20
D=0.2
10
0
100µ 1m 10m 100m 1 10 100 1k
Thermal Resistance (° C/ W)
Pulse Width (s)
Single Pulse
D=0.05
D=0.1
Transient Thermal Im p edance
180 160 140 120 100
80 60
2 oz. weight Copper
40 20
10 100 1000 10000
Thermal Resistance (°C/W)
1 oz. weight Copper
Copper Area (sq mm)
T
(amb)
=25°C
100
10
1
100µ 1m 10m 100m 1 10 100 1k
Max Power Dissipation (W)
Pulse Power Dissipation
4
T
=25°C
(amb)
3
2 oz. weight Copper
2
1
Power Rating (W)
0
10 100 1000 10000
Copper Area (sq mm)
Single Pulse. T
See note 3
Pulse Width (s)
1 oz. weight Copper
amb
=25°C
Thermal Resistance vs. Cu Area
DXT2010P5
Document number: DS32011 Rev. 2 - 2
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Power Rating vs. Cu Area
March 2010
© Diodes Incorporated
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