Diodes DT2636-04S User Manual
Features
• IEC 61000-4-2 (ESD): Air ±20kV, Contact ±18kV
• 4 Channels of ESD Protection
• Low Channel Input Capacitance of 0.65pF Typical
• Typically Used at High Speed Ports such as USB 2.0,
IEEE1394, Serial ATA, DVI, HDMI, PCI
• Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2)
• Halogen and Antimony Free. “Green” Device (Note 3)
ADVANCED INFORMATION
SOT363
Top View
Ordering Information (Note 4)
4 CHANNEL LOW CAPACITANCE TVS DIODE ARRAY
Mechanical Data
• Case: SOT363
• Case Material: Molded Plastic, “Green” Molding Compound. UL
Flammability Classification Rating 94V-0
• Moisture Sensitivity: Level 1 per J-STD-020
• Terminals: Matte Tin Finish annealed over Alloy 42 leadframe
(Lead Free Plating). Solderable per MIL-STD-202, Method 208
• Weight: 0.006 grams (approximate)
NC
CH 1
CH 4
CH 3
65 4
12 3
CH 2
Device Pinout
GND
Pin 1 Pin 2
Device Schematic
Pin 3
DT2636-04S
Pin 5
Pin 4
Part Number Case Packaging
DT2636-04S-7 SOT363 3000/Tape & Reel
Notes: 1. No purposely added lead. Fully EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant.
2. See http://www.diodes.com/quality/lead_free.html for more information about Diodes Incorporated’s definitions of Halogen- and Antimony-free, "Green"
and Lead-free.
3. Halogen- and Antimony-free "Green” products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and
<1000ppm antimony compounds.
4. For packaging details, go to our website at http://www.diodes.com/products/packages.html.
Marking Information
Date Code Key
Year 2013 2014 2015 2016 2017 2018 2019
Code A B C D E F G
Month Jan Feb Mar Apr May Jun Jul Aug Sep Oct Nov Dec
Code 1 2 3 4 5 6 7 8 9 O N D
DT2636-04S
Document number: DS36468 Rev. 2 – 2
TG1
BD4
YM
www.diodes.com
BD4 = Product Type Marking Code
YM = Date Code Marking
Y = Year (ex: A = 2013)
M = Month (ex: 9 = September)
1 of 5
November 2013
© Diodes Incorporated
T
T
Maximum Ratings (@T
= +25°C, unless otherwise specified)
A
Characteristic Symbol Value Unit Conditions
Peak Pulse Current
Peak Pulse Current
Peak Pulse Power
ESD Protection – Contact Discharge
ESD Protection – Air Discharge
Operating Temperature
Storage Temperature
I
PP
I
PP
P
PP
V
ESD_Contact
V
ESD_Air
T
OP
T
STG
Thermal Characteristics
Characteristic Symbol Value Unit
Power Dissipation Typical (Note 5)
Thermal Resistance, Junction to Ambient Typical (Note 5)
DT2636-04S
6.5 A 8/20µs, From CH to GND
6.5 A 8/20µs, From GND to CH
60 W 8/20µs, From CH to GND
±18 kV Standard IEC 61000-4-2
±20 kV Standard IEC 61000-4-2
-55 to +85 °C
—
-55 to +150 °C —
P
D
R
θJA
200 mW
625
°C/W
Electrical Characteristics (@T
ADVANCED INFORMATION
= +25°C, unless otherwise specified)
A
Characteristic Symbol Min Typ Max Unit Test Conditions
Reverse Standoff Voltage
Channel Leakage Current (Note 6, 7)
Reverse Breakdown Voltage
Clamping Voltage, Positive Transients
Clamping Voltage, Positive Transients
Clamping Voltage, Negative Transients
Forward Voltage
Dynamic Resistance
Dynamic Resistance
Dynamic Resistance
CH to GND Capacitance
Delta CCH
Notes: 5. Device mounted on FR-4 PCB pad layout (2oz copper) as shown on Diodes, Inc. suggested pad layout AP02001, which can be found on our website
at http://www.diodes.com.
6. Short duration pulse test used to minimize self-heating effect.
7. Measured from pin 1, 2, 4 and 5 to GND.
V
RWM
I
V
V
CL1
V
CL1
V
CL2
V
R
DIFF
R
DIFF-R
R
DIFF-F
C
(CH-GND)
CHMAX-
C
CCHMIN
BR
R
F
— — 5.5 V —
— 1 10 nA
7.0 — 9.5 V
— 6.8 — V
— 9 — V
— 1.5 — V
— 0.7 — V
— 0.4 — Ω
— 0.45 —
— 0.2 —
— 0.75 — pF
— 0.65 0.9 pF
Ω
Ω
— 0.04 — pF
VR = 2.5V
IR = 1mA, from CH to GND
IPP = 1A, tp = 8/20μs
IPP = 5A, tp = 8/20μs
IPP = 1A, tp = 8/20μs
IF = 1mA, GND to CH
IPP = 1A, tp = 8/20μs, CH to GND
LP, 20A, tp = 100 ns, CH to GND
LP, 20A, tp = 100 ns, GND to CH
V
V
C
= 0V, f = 1MHz
(CH-GND)
= 2.5V, f = 1MHz
(CH-GND)
CHMAX-CCHMIN
DT2636-04S
Document number: DS36468 Rev. 2 – 2
2 of 5
www.diodes.com
November 2013
© Diodes Incorporated
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