Diodes DT1240-04LP User Manual

Features & Applications
Clamping Voltage: 9V at 10A 100ns, TLP
9.4V at 5.5A 8μs/20μs
IEC 61000-4-2 (ESD): Air — ±16kV, Contact — ±14kV  IEC 61000-4-5 (Lightning): ±5.5A (8/20µs)  4 Channels of ESD protection  Low Channel Input Capacitance of 0.55pF Typical
TLP Dynamic Resistance: 0.25 Typically Used for High Speed Ports such as USB 2.0, USB 3.0  DVI, HDMI, Ethernet Port, IEEE, MDDI, PCI Express, SATA/
eSATA
Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2) Halogen and Antimony Free. “Green” Device (Note 3)
ADVANCE INFORMATIO ADVANCED INFORMATION
Pin # Description
1, 2, 4, 5 I/O
6, 7, 9, 10 No Connection
3, 8 Vss
10 9 8 7 6
12345
Pin Description (Top View) Device Schematic
4 CHANNEL LOW CAPACITANCE TVS DIODE ARRAY
Mechanical Data
Case: U-DFN2510-10  Case Material: Molded Plastic, “Green” Molding Compound.  UL Flammability Classification Rating 94V-0  Moisture Sensitivity: Level 1 per J-STD-020  Terminals: NiPdAu over Copper leadframe (Lead Free Plating).  Solderable per MIL-STD-202, Method 208  Weight: 0.038 grams (approximate)
Pin 1 Pin 2
3,8
Pin 4
e4
Pin 5
Ordering Information (Note 4)
Product Compliance Marking Reel Size (inches) Tape Width (mm) Quantity per Reel
DT1240-04LP-7 Standard BC7 7 8 3,000/Tape & Reel
Notes: 1. No purposely added lead. Fully EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant.
2. See http://www.diodes.com/quality/lead_free.html for more information about Diodes Incorporated’s definitions of Halogen- and Antimony-free, "Green" and Lead-free.
3. Halogen- and Antimony-free "Green” products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and <1000ppm antimony compounds.
4. For packaging details, go to our website at http://www.diodes.com/products/packages.html.
Marking Information
Date Code Key
Year 2013 2014 2015 2016 2017 2018
Code A B C D E F
Month Jan Feb Mar Apr May Jun Jul Aug Sep Oct Nov Dec
Code 1 2 3 4 5 6 7 8 9 O N D
TF2 YM
BC7
DT1240-04LP
Document number: DS36312 Rev. 2 - 2
BC7 = Product Type Marking Code YM = Date Code Marking Y = Year (ex: A = 2013) M = Month (ex: 9 = September)
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yp
X
X
P
P
U
R
G
O
R
O
O
G
R
G
G
R VO
G
Maximum Ratings (@T
Characteristic Symbol Value Unit Conditions
Peak Pulse Current, per IEC 61000-4-5 Peak Pulse Power, per IEC 61000-4-5 Operating Voltage (DC)
ESD Protection – Contact Discharge, per IEC 61000-4-2 ESD Protection – Air Discharge, per IEC 61000-4-2
Operating Temperature Storage Temperature
Thermal Characteristics
Characteristic Symbol Value Unit
Power Dissipation Typical (Note 5) Thermal Resistance, Junction to Ambient Typical (Note 5)
Electrical Characteristics (@T
ADVANCE INFORMATIO ADVANCED INFORMATION
Reverse Working Voltage Reverse Current Reverse Breakdown Voltage Forward Clamping Voltage Holding Voltage Reverse Clamping Voltage (Note 6) Trigger Voltage ESD Clamping Voltage Dynamic Reverse Resistance Dynamic Forward Resistance Channel Input Capacitance (Note7) Delta C
Notes: 5. Device mounted on FR-4 PCB pad layout (2oz copper) as shown on Diodes, Inc. suggested pad layout AP02001, which can be found on our website at
DT1240-04LP
Document number: DS36312 Rev. 2 - 2
Characteristic Symbol Min T
C
I/O
http://www.diodes.com.
6. Clamping voltage value is based on an 8x20µs peak pulse current (I
7. C
I/O1=CPIN1+CPIN10
, C
I/O2=CPIN2+CPIN9
100
F
75
IN %
ATIN
50
LSE DE
25
PEAK POWER OR CURRENT
EAK
0
0 25 50 75 100 125 150 175 200
T , AMBIENT TEMPERATURE (°C)
A
Figure 1 Pulse Derating Curve
= +25°C, unless otherwise specified.)
A
I
PP
P
PP
V
DC
ESD_Air
T
OP
T
STG
9.4 — 9.5 V
0.25
0.04 — pF
) waveform.
pp
V
ESD_Contact
V
= +25°C, unless otherwise specified.)
A
V
RWM
I
R
V
BR
V
F
V
H
V
C
V
TRIG
V
ESD
R
DIF-R
R
DIF-F
C
I/O
-C
I/OMA
I/OMIN
, C
I/O3=CPIN4+CPIN7
5.5 V — 0.5 μA
6 —
-1.0 -0.85 — V
5.5 — —
9 — V — — 0.25 — 0.55 0.65 pF —
, C
I/O4=CPIN5+CPIN6
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5.5 A 60 W
6 V ±14 kV ±16 kV
I/O to VSS, 8/20µs I/O to VSS, 8/20µs I/O to VSS I/O to VSS I/O to VSS
-55 to +85 °C
-55 to +150 °C
P
D
R
JA
350 mW 360 °C/W
Max Unit Test Conditions
IR=1mA, , I/O to VSS VR = 5V, I/O to VSS
11
V
IR = 1mA, I/O to VSS I
= -15mA, I/O to VSS
F
V — V
I
= 5.5A, I/O to VSS, 8/20µs
PP
TLP, 10A, tp = 100 ns, I/O to V
TLP, 10A, tp = 100 ns, I/O to V TLP, 10A, tp = 100 ns, V V
= 2.5V, VSS = 0V, f = 1MHz
I/O
C
-C
I/OMA
9.5
E,
V
LTA
9.0
E
8.5
TRIG
I
8.0
E, T
7.5
LTA
HOLDING VOLTAGE (V)
7.0
WN V
6.5
EAKD B
6.0
-60 -40 -20 0 20 40 60 80 100 120 140 160
BV
V
H
AMBIENT TEMPERATURE (
T, °C)
A
Figure 2 BV, Trigger Voltage, Holding Voltage
vs. Ambien t T empe rature
SS
I/OMIN
September 2013
© Diodes Incorporated
SS SS
to I/O
CLAM
PIN
G VO
TAG
F
O
R
R
OLTAG
)
G VO
G
R
R
C
PUT CAPACITANC
C
U
R
RENT F
R
O
O
11.0
10.0
9.0
E
L
8.0
IEC61000 - 4- 5
(Lighting)
7.0
C
6.0
V, (V)
5.0 2345 67
CURRENT FROM I/O TO V (A)
Figur e 3 Cl amping Voltage Charac t erist ic
12
ADVANCE INFORMATIO ADVANCED INFORMATION
10
Voltage
ENT (V, A)
8
E CU
6
LTA
4.0
3.5
3.0
E (V
2.5
D V
2.0
WA
1.5
F
1.0
V,
0.5
0.0 1234567
SS
Figure 4 Forward Voltage Characteristic
1.0
0.9
0.8
E
0.7
0.6
0.5
0.4
IEC61000 - 4- 5
(Lighting)
CURRENT FROM TO V (A)
f=1MHz
I/O
SS
4
Ampere
2
CLAMPIN
0
-40-30-20-10 01020304050607080
Figure 5
t, TIME ( s)
Waveform of Clamping Voltage,
0.3
IN
(pF)
I/O
0.2
0.1
0.0
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0
INPUT VOLTAGE
V (V)
I/O
Figure 6 Input Capacitance vs. Input Voltage
Current vs.Time (8/20us, I/O to Vss)
10
9
SS
8
to V (A)
7
M I/
6 5 4 3 2
1
0
0246810
VOLTAGE FROM I/O to V (V)
Figure 7 Current vs. Volt age
DT1240-04LP
Document number: DS36312 Rev. 2 - 2
SS
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Package Outline Dimensions
Please see AP02002 at http://www.diodes.com/datasheets/ap02002.pdf for latest version.
A
A
1
D
b
1
A
3
Seating Plane
E
Z
e
R
0
.
1
2
5
R
0
.
0
7
5
L
b
ADVANCE INFORMATIO ADVANCED INFORMATION
Suggested Pad Layout
Please see AP02001 at http://www.diodes.com/datasheets/ap02001.pdf for the latest version.
Y
3
X
2
X
1
Y
1
Y
2
X
Y
C
U-DFN2510-10
Dim Min Max Typ
A 0.545 0.605 0.575 A1 0 0.05 0.03 A3 - - 0.13
b 0.15 0.25 0.20 b1 035 0.45 0.40
D 2.450 2.575 2.500
e - - 0.50
E 0.950 1.075 1.000
L 0.325 0.425 0.375
Z - - 0.150
All Dimensions in mm
Dimensions
Value
(in mm)
C 0.500
X 0.250 X1 0.450 X2 2.250
Y 0.625 Y1 0.575 Y2 0.700 Y3 1.400
DT1240-04LP
Document number: DS36312 Rev. 2 - 2
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DIODES INCORPORATED MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARDS TO THIS DOCUMENT, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION).
Diodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes without further notice to this document and any product described herein. Diodes Incorporated does not assume any liability arising out of the application or use of this document or any product described herein; neither does Diodes Incorporated convey any license under its patent or trademark rights, nor the rights of others. Any Customer or user of this document o r products described herein in such applica tions shall assume all risks of such use and will agree to hold Diodes Incorporated and all the companies whose products are represented on Diodes Incorporated website, harmless against all damages.
Diodes Incorporated does not warrant or accept any liability whatsoever in respect of any products purchased through unauthorized sales channel. Should Customers purchase or use Diodes Incorporated products for any unintended or unauthorize d application, Customers shall indemnify and hold Diodes Incorporated and its representatives harmless against all claims, damages, expenses, and attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized application.
Products described herein may be covered by one or more United States, international or foreign patents pending. Product names and markings noted herein may also be covered by one or more United States, international or foreign trademarks.
This document is written in English but may be translated into multiple languages for reference. Onl y the English version of this document is the final and determinative format released by Diodes Incorporated.
Diodes Incorporated products are specifically not authorized for use as critical components in life support devices or systems without the express
ADVANCE INFORMATIO ADVANCED INFORMATION
written approval of the Chief Executive Officer of Diodes Incorporated. As used herein: A. Life support devices or systems are devices or systems which:
1. are intended to implant into the body, or
labeling can be reasonably expected to result in significant injury to the user. B. A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the
failure of the life support device or to affect its safety or effectiveness. Customers represent that they have all necessary expertise in the safety and regulatory ramifications of their life support devices or systems, and
acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any use of Diodes Incorporated products in such safety-critical, life support devices or systems, notwithstanding any devices- or systems-related information or support that may be provided by Diodes Incorporated. Further, Customers must fully indemnify Diodes Incorporated and its representatives against any damages arising out of the use of Diodes Incorporated products in such safety-critical, life support devices or systems.
Copyright © 2013, Diodes Incorporated
www.diodes.com
2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the
IMPORTANT NOTICE
LIFE SUPPORT
DT1240-04LP
Document number: DS36312 Rev. 2 - 2
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