Diodes DMP2066LDM User Manual

Page 1
Features
Low R
40 mΩ @V
70 mΩ @V
Low Input/Output Leakage
Lead Free By Design/RoHS Compliant (Note 1)
"Green" Device (Note 2)
Qualified to AEC-Q101 Standards for High Reliability
DS(ON)
:
= -4.5V
GS
= -2.5V
GS
SOT26
Top View
DMP2066LDM
P-CHANNEL ENHANCEMENT MODE MOSFET
Mechanical Data
Case: SOT26
Case Material – Molded Plastic. UL Flammability Rating 94V-0
Moisture Sensitivity: Level 1 per J-STD-020
Terminals: Finish - Matte Tin Solderable per MIL-STD-202,
Method 208
Terminal Connections: See Diagram
Weight: 0.008 grams (approximate)
D
D
D
Top View
Internal Schematic
S
D
G
Ordering Information (Note 3)
Part Number Case Packaging
DMP2066LDM-7 SOT26 3000/Tape & Reel
DMP2066LDMQ-7 SOT26 3000/Tape & Reel
Notes: 1. No purposefully added lead.
2. Diodes Inc's "Green" policy can be found on our website at http://www.diodes.com.
3. For packaging details, go to our website at http://www.diodes.com.
Marking Information
Date Code Key
Year 2008 2009 2010 2011 2012 2013 2014 2015
Code V W X Y Z A B C
Month Jan Feb Mar Apr May Jun Jul Aug Sep Oct Nov Dec
Code 1 2 3 4 5 6 7 8 9 O N D
DMP2066LDM
Document number: DS31464 Rev. 4 - 2
DMC
DMC = Product Type Marking Code YM = Date Code Marking
YM
Y = Year (ex: V = 2008) M = Month (ex: 9 = September)
1 of 5
www.diodes.com
December 2011
© Diodes Incorporated
Page 2
θ
)
)
)
r
)
Maximum Ratings @T
= 25°C unless otherwise specified
A
Characteristic Symbol Value Unit
Drain-Source Voltage Gate-Source Voltage Drain Current (Note 4) Continuous TA = 25°C T
= 70°C
A
Pulsed Drain Current (Note 5) Body-Diode Continuous Current (Note 4)
V
DSS
V
GSS
I
D
I
DM
I
S
Thermal Characteristics
Total Power Dissipation (Note 4) Thermal Resistance, Junction to Ambient (Note 4); Steady-State Operating and Storage Temperature Range
Characteristic Symbol Value Unit
P
D
R
JA
T
, T
J
STG
DMP2066LDM
-20 V
±12
-4.6
-3.7
-18 A
2.0 A
1.25 W 100
-55 to +150
V A
°C/W
°C
Electrical Characteristics @T
= 25°C unless otherwise specified
A
Characteristic Symbol Min Typ Max Unit Test Condition
STATIC PARAMETERS
Drain-Source Breakdown Voltage Zero Gate Voltage Drain Current TJ = 25°C I Gate-Body Leakage Current Gate Threshold Voltage On State Drain Current (Note 6)
Static Drain-Source On-Resistance (Note 6)
R
Forward Transconductance (Note 6) Diode Forward Voltage (Note 6) Maximum Body-Diode Continuous Current (Note 4)
BV
DSS
DSS
I
GSS
V
GS(th
I
D (ON
DS (ON)
g
FS
V
SD
I
S
-20
-0.6 -0.96 -1.2 V
-15
⎯ ⎯
-0.5 -0.72 -1.4 V
-1
±100
29 55
9
40 70
1.7 A
V
ID = -250μA, VGS = 0V μA nA
A
mΩ
S
= -20V, VGS = 0V
V
DS
V
= 0V, VGS = ±12V
DS
V
= VGS, ID = -250μA
DS
V
= -4.5V, VDS = -5V
GS
= -4.5V, ID = -4.6A
V
GS
= -2.5V, ID = -3.8A
V
GS
V
= -10V, ID = -4.6A
DS
IS = -2.1A, V
GS
= 0V
DYNAMIC PARAMETERS (Note 7)
Input Capacitance Output Capacitance Reverse Transfer Capacitance
Gate Resistance
C
iss
C
oss
C
rss
R
G
820 200 160
2.5
⎯ ⎯ ⎯
Ω
pF pF pF
V
= -15V, VGS = 0V
DS
f = 1.0MHz
= 0V, VGS = 0V
V
DS
f = 1.0MHz
SWITCHING CHARACTERISTICS
Total Gate Charge Gate-Source Charge Gate-Drain Charge Turn-On Delay Time Rise Time Turn-Off Delay Time Fall Time
Notes: 4. Device mounted on 1"x1", FR-4 PC board with 2 oz. Copper and test pulse width t 10s.
5. Repetitive Rating, pulse width limited by junction temperature.
6. Test pulse width t = 300μs.
7. Guaranteed by design. Not subject to production testing.
DMP2066LDM
Document number: DS31464 Rev. 4 - 2
Q
G
Q
GS
Q
GD
t
d(on
t
t
d(off
t
f
www.diodes.com
2 of 5
10.1
1.5
4.3
4.4
9.9
28.0
23.4
nC
ns
V
= -10V, VGS = -4.5V,
DS
I
= -4.5A
D
V
= -10V, VGS = -4.5V,
DS
I
= -1A, RG = 6.0Ω
D
December 2011
© Diodes Incorporated
Page 3
RAIN C
U
R
REN
T
RAIN CUR
REN
T
R
RAIN-SOUR
CE O
N-R
TAN
C
R
RAIN
OUR
C
GAT
THR
H
O
O
T
G
30
V = 10V
GS
V = 4.5V
GS
24
(A)
18
12
D
I, D
6
V = 1.5V
GS
0
0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 5
V , DRAIN-SOURCE VOLT AGE (V)
DS
Fig. 1 Typical Output Characteristic
1
Ω
V = 3.0V
GS
V = 2.5V
GS
V = 2.0V
GS
20
V = 5.0V
DS
16
(A)
12
8
D
I, D
4
0
T = 150°C
A
T = 125°C
A
T = 25°C
T = -55°C
A
0 0.5 1 1.5 2 2.5 3 3.5 4
V , GATE-SOURCE VOLTAGE (V)
GS
Fig. 2 T ypical Transfer Characteristic
0.08
Ω
E ( )
V = 4.5V
GS
DMP2066LDM
T = 85°C
A
A
E
-S
, D
0.1
V = 2.5V
GS
V = 4.5V
GS
V = 10V
GS
DS(ON)
R , DRAIN-SOURCE ON-RESISTANCE ( )
0.01 0 6 12 18 24 30
I , DRAIN-SOURCE CURRENT (A)
D
Fig. 3 T ypical On-Resistance
vs. Drain Current and Gate Voltage
1.6
1.4
V = 10V
GS
I = 10A
D
1.2
1.0
DS(ON)
V = 4.5V
GS
I = 5A
D
0.06
ESIS
0.04
0.02
, D
DS(ON)
0
0 6 12 18 24 30
-I , DRAIN CURRENT (A)
D
Fig. 4 Typical On-Resistance
vs. Drain Current and Temperature
2.4
E (V)
2.0
A L
1.6
LD V
ES
E
1.2
0.8
I = 1mA
D
I = 250µA
D
T = 150°C
A
T = 125°C
A
T = 85°C
A
T = 25°C
A
T = -55°C
A
0.8
ON-RESISTANCE (NORMALIZED)
0.6
-50 -25 0 25 50 75 100 125 150 T , AMBIENT TEMPERATURE (°C)
A
Fig. 5 Normalized On-Resistance vs. Ambient T emperature
0.4
GS(TH)
V,
0
-50 -25 0 25 50 75 100 125 150 T , AMBIENT TEMPERATURE (°C)
A
Fig. 6 Gat e Threshol d Variation vs. Ambient Temperature
DMP2066LDM
Document number: DS31464 Rev. 4 - 2
3 of 5
www.diodes.com
December 2011
© Diodes Incorporated
Page 4
OUR
CE CUR
REN
T
C, TOT
CAPACITANC
F
T
R
T T
HER
R
TANC
20
T = 25°C
A
16
(A)
12
8
S
I, S
4
0
0 0.2 0.4 0.6 0.8 1 1.2
V , SOURCE-DRAIN VOLTAGE (V)
SD
Fig. 7 Diode Forward Voltag e vs . C ur r e nt
1
D = 0.7
E
D = 0.5
D = 0.3
ESIS
0.1
D = 0.1
MAL
D = 0.05
D = 0.02
0.01
D = 0.01
ANSIEN
D = 0.005
r(t),
D = Single Pulse
0.001
0.00001 0.0001 0.001 0.01 0.1 1 10 100 1,000
Package Outline Dimensions
K
J
DMP2066LDM
10,000
) E (p
1,000
AL
T
C
C
oss
C
rss
100
0 5 10 15 20
V , DRAIN-SOURCE VOLTAGE (V)
DS
Fig. 8 Typical Total Capacitance
D = 0.9
R (t) = r(t) * R
θθ
JA JA
R = 120°C/W
θ
JA
P(pk)
t
1
t
2
T - T = P * R (t)
JA JA12θ
Duty Cycle, D = t /t
t , PULSE DURATION TIME (s)
1
Fig. 9 Transient Therm al Respo nse
A
SOT26
Dim Min Max Typ
B C
A 0.35 0.50 0.38 B 1.50 1.70 1.60 C 2.70 3.00 2.80 D
H
H 2.90 3.10 3.00
J 0.013 0.10 0.05
0.95
K 1.00 1.30 1.10
M
L 0.35 0.55 0.40
M 0.10 0.20 0.15
0° 8°
D
L
α
All Dimensions in mm
f = 1MHz
iss
DMP2066LDM
Document number: DS31464 Rev. 4 - 2
4 of 5
www.diodes.com
December 2011
© Diodes Incorporated
Page 5
DMP2066LDM
Suggested Pad Layout
DIODES INCORPORATED MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARDS TO THIS DOCUMENT, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION).
Diodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes without further notice to this document and any product described herein. Diodes Incorporated does not assume any liability arising out of the application or use of this document or any product described herein; neither does Diodes Incorporated convey any license under its patent or trademark rights, nor the rights of others. Any Customer or user of this document o r products described herein in such applica tions shall assume all risks of such use and will agree to hold Diodes Incorporated and all the companies whose products are represented on Diodes Incorporated website, harmless against all damages.
Diodes Incorporated does not warrant or accept any liability whatsoever in respect of any products purchased through unauthorized sales channel. Should Customers purchase or use Diodes Incorporated products for any unintended or unauthorize d application, Customers shall indemnify and hold Diodes Incorporated and its representatives harmless against all claims, damages, expenses, and attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized application.
Products described herein may be covered by one or more United States, international or foreign patents pending. Product names and markings noted herein may also be covered by one or more United States, international or foreign trademarks.
Diodes Incorporated products are specifically not authorized for use as critical components in life support devices or systems without the express written approval of the Chief Executive Officer of Diodes Incorporated. As used herein:
A. Life support devices or systems are devices or systems which:
1. are intended to implant into the body, or
labeling can be reasonably expected to result in significant injury to the user. B. A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the
failure of the life support device or to affect its safety or effectiveness. Customers represent that they have all necessary expertise in the safety and regulatory ramifications of their life support devices or systems, and
acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any use of Diodes Incorporated products in such safety-critical, life support devices or systems, notwithstanding any devices- or systems-related information or support that may be provided by Diodes Incorporated. Further, Customers must fully indemnify Diodes Incorporated and its representatives against any damages arising out of the use of Diodes Incorporated products in such safety-critical, life support devices or systems.
Copyright © 2011, Diodes Incorporated
www.diodes.com
2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the
G
Z
Y
X
EE
C
IMPORTANT NOTICE
LIFE SUPPORT
Dimensions Value (in mm)
Z G X Y C 2.40
E
3.20
1.60
0.55
0.80
0.95
DMP2066LDM
Document number: DS31464 Rev. 4 - 2
5 of 5
www.diodes.com
December 2011
© Diodes Incorporated
Loading...