Diodes DMP2038USS User Manual

Page 1
DMP2038USS
20V P-CHANNEL ENHANCEMENT MODE MOSFET
Product Summary
V
R
(BR)DSS
-20V
38m @ V
56m @ VGS = -2.5V
DS(ON)
max
= -4.5V
GS
TA = +25°C
Description and Applications
This MOSFET has been designed to minimize the on-state
resistance (R
performance, making it ideal for high efficiency power management
applications.
Backlighting
Power Management Functions
DC-DC Converters
) and yet maintain superior switching
DS(ON)
SO-8
S
S
G
Top View
I
max
D
-6.5A
-5.0A
Top View
Pin-Out
Features and Benefits
Low On-Resistance
Low Gate Threshold Voltage
Low Input Capacitance
Fast Switching Speed
Low Input/Output Leakage
Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2)
Halogen and Antimony Free. “Green” Device (Note 3)
Qualified to AEC-Q101 standards for High Reliability
Mechanical Data
Case: SO-8
Case Material: Molded Plastic, “Green” Molding Compound.
UL Flammability Classification Rating 94V-0
Moisture Sensitivity: Level 1 per J-STD-020
Terminals Connections: See Diagram
Terminals: Finish - Matte Tin annealed over Copper lead
frame. Solderable per MIL-STD-202, Method 208
Weight: 0.072g (approximate)
DS
D
D
D
D
G
Equivalent Circuit
S
Ordering Information (Note 4)
Part Number Case Packaging
DMP2038USS-13 SO-8 2500/Tape & Reel
Notes: 1. No purposely added lead. Fully EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant.
2. See http://www.diodes.com/quality/lead_free.html for more information about Diodes Incorporated’s definitions of Halogen- and Antimony-free, "Green" and Lead-free.
3. Halogen- and Antimony-free "Green” products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and <1000ppm antimony compounds.
4. For packaging details, go to our website at http://www.diodes.com/products/packages.html.
Marking Information
Chengdu A/T Site Shanghai A/T Site
DMP2038USS
Document number: DS36919 Rev. 2 - 2
www.diodes.com
= Manufacturer’s Marking P2038US = Product Type Marking Code YYWW = Date Code Marking YY or YY = Year (ex: 13 = 2013) WW = Week (01 - 53) YY = Date Code Marking for SAT (Shanghai Assembly/ Test site) YY = Date Code Marking for CAT (Chengdu Assembly/ Test site)
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© Diodes Incorporated
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DMP2038USS
Maximum Ratings (@T
= +25°C, unless otherwise specified.)
A
Characteristic Symbol Value Units
Drain-Source Voltage
Gate-Source Voltage
Drain Current (Note 6) Steady State
Pulsed Drain Current (10µs pulse, duty cycle = 1%)
= +25°C
T
A
T
= +70°C
A
V
DSS
V
GSS
I
D
I
DM
-20 V
±8
-6.5
-5.2
V
A
-25 A
Maximum Continuous Body Diode Forward Current (Note 6) IS 2 A
Avalanche Current (Note 7) L=0.3mH IAS 13.2 A
Avalanche Energy (Note 7) L=0.3mH EAS 26 mJ
Thermal Characteristics
Characteristic Symbol Value Unit
Total Power Dissipation (Note 6)
Thermal Resistance, Junction to Ambient (Note 6)
Operating and Storage Temperature Range
P
R
T
J, TSTG
D
JA
θ
2.5 W
50 °C/W
-55 to +150 °C
Electrical Characteristics (@T
= +25°C, unless otherwise specified.)
A
Characteristic Symbol Min Typ Max Unit Test Condition
OFF CHARACTERISTICS (Note 8)
Drain-Source Breakdown Voltage
Zero Gate Voltage Drain Current
Gate-Source Leakage
BV
DSS
I
DSS
I
GSS
-20
-1 µA
±100
V
V
GS
V
DS
nA
VGS = ±8V, VDS = 0V
= 0V, ID = -250µA
= -16V, VGS = 0V
ON CHARACTERISTICS (Note 8)
Gate Threshold Voltage
Static Drain-Source On-Resistance
Diode Forward Voltage
V
R
DS(ON)
V
GS(th)
SD
-0.4
24 38
33 56
-0.7 -1.2 V
-1.1 V
mΩ
V
V
V
VGS = 0V, IS = -2.1A
= VGS, ID = -250µA
DS
= -4.5V, ID = -5A
GS
= -2.5V, ID = -4.3A
GS
DYNAMIC CHARACTERISTICS (Note 9)
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
Total Gate Charge
Gate-Source Charge
Gate-Drain Charge
Turn-On Delay Time
Turn-On Rise Time
Turn-Off Delay Time
Turn-Off Fall Time
Notes: 5. Device mounted on FR-4 PC board, with minimum recommended pad layout, single sided.
6. Device mounted on FR-4 substrate PC board, 2oz copper, with thermal bias to bottom layer 1inch square copper plate
7. I
and EAS rating are based on low frequency and duty cycles to keep TJ = +25°C
AS
8. Short duration pulse test used to minimize self-heating effect.
9. Guaranteed by design. Not subject to product testing.
C
iss
C
oss
C
rss
Q
g
Q
gs
Q
gd
t
D(on)
t
r
t
D(off)
t
f
1496
130
116
14.4
2.6
2.7
13.7
14.0
79.1
35.5
pF
pF
pF
nC
ns
= -15V, VGS = 0V
V
DS
f = 1.0MHz
V
= -10V, VGS = -4.5V
DS
= -4.5A
I
D
V
= -10V, VGS = -4.5V,
DD
= 6, RL = 10, ID = -1A
R
G
DMP2038USS
Document number: DS36919 Rev. 2 - 2
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© Diodes Incorporated
Page 3
RAIN CUR
R
N
T
R
CUR
RENT
R
R
OUR
ON-R
R
R
OUR
ON-R
R
R
OUR
C
R
R
N-SOUR
CE O
N
R
T
N
C
DMP2038USS
20
15
V = -4.5V
GS
V = -3.5V
GS
V = -3.0V
GS
(A)
E
V = -2.5V
GS
10
V = -1.5V
GS
D
5
-I , D
0
0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 5
-V , DRAIN -SOURCE VOLTAGE (V)
DS
Figure 1 Typical Output Char acteristics
0.08
Ω
V = -2.0V
GS
V = -1.8V
GS
V = -1.2V
GS
20
V= -5.0V
DS
15
(A)
10
AIN
D
5
-I , D
0
0
0.05
Ω
T = 150CA°
T = 125CA°
T = 85CA°
T = 25CA°
T = -55CA°
0.5 1 1.5 2 2.5 3
-V , GATE-SOURCE VOLTAGE (V)
GS
Figure 2 Typical Transfer Characteristics
V= -10V
GS
T = 125 CA°
T = 150 CA°
0.04
0.06
ESISTANCE ( )
CE
0.04
V = -1.8V
GS
V = -2.5V
GS
V = -4.5V
GS
ESISTANCE ( )
CE
0.03
0.02
T = 25CA°
T = 85CA°
T = -55CA°
AIN-S
0.02
, D
DS(ON)
0
-I , DRAIN SOURCE CURRENT (A)
D
Figure 3 Typical On-Resistance vs.
Drain Current and Gate Voltage
1.7
V = -4.5V
GS
I = -5A
1.5
D
E
1.3
AIN-S
1.1
, D
0.9
DS(ON)
ON-RESISTANCE (NORMALIZED)
0.7
0.5
-50 -25 0 25 50 75 100 125 150 T , JUNCTION TEMPERATURE ( C)J°
Figure 5 On-Resistance Variation with Temperature
V = -10V
GS
I = -10A
D
AIN-S
0.01
, D
DS(ON)
0
0 5 10 15 20
-I , DRAIN SOURCE CURRENT (A)
D
Figure 4 Typical On-Resistance vs.
Drain Current and Temperature
0.06
Ω
E ( )
0.05
A
V=5V
-4.
GS
I= A
ESIS
0.04
-
0.03
-5
D
V= -10V
GS
I= A
-10
D
0.02
AI
, D
0.01
DS(on)
0
-50 -25 0 25 50 75 100 125 150 T , JUNCTION TEMPERATURE ( C)J°
Figure 6 On-Resistance Variation with Temperature
DMP2038USS
Document number: DS36919 Rev. 2 - 2
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© Diodes Incorporated
Page 4
GATE THRESH
O
OLTAG
OUR
CE CUR
R
T
C
UNC
TION CAPACITANC
F
GAT
OUR
C
OLTAG
RAN
S
N
H
R
R
SIS
N
C
1.2
E (V)
1
0.8
-I = 1mAD
LD V
-I = 250µA
0.6
D
0.4
0.2
GS(TH)
V,
0
-50 -25 0 25 50 75 100 125 150 T , AMBIENT TEMPERATURE (°C)
A
Figure 7 Gate Threshold Variation vs. Ambient Temperature
10000
)
E (p
f = 1MHz
DMP2038USS
20
18
16
(A)
14
EN
12
10
8
6
S
-I , S 4
2
0
0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1 1.1 1.2
-V , SOURCE-DRAIN VOLTAGE (V)
SD
Figure 8 Diode Forward Voltage vs. Current
5
4
E (V)
T= 25CA°
, J
T
1000
100
C
iss
C
C
rss
-V , DRAIN-SOURCE VOLTAGE (V)
DS
oss
Figure 9 Typical Junction Capacitance
1
D = 0.9
D = 0.7
D = 0.5
E
D = 0.3
TA
E
0.1
D = 0.1
MAL
D = 0.05
E
T T
D = 0.02
IE
0.01
D = 0.01
3
E V
V = -10V
DS
I = -4.5A
2
D
E-S
1
GS
-V ,
0
-20-16-12-8-40
0 2 4 6 8 10 12 14 16 18
Q , TOTAL GATE CHARGE (nC)
g
Figure 10 Gate-Charge Characteristics
D = 0.005
r(t), T
Single Pulse
R (t) = r(t) * R
θθ
JA JA
R = 216°C/W
θ
JA
Duty Cycle, D = t1/ t2
0.001
t1, PULSE DURATION TIMES (sec)
Figure 11 Transient Thermal Resistance
DMP2038USS
Document number: DS36919 Rev. 2 - 2
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© Diodes Incorporated
Page 5
Package Outline Dimensions
Please see AP02002 at http://www.diodes.com/datasheets/ap02002.pdf for latest version.
E1
E
A1
Detail ‘A’
h
°
45
A2
A3
A
e
b
D
L
0.254 Gauge Plane
Seating Plane
7°~9
°
Suggested Pad Layout
Please see AP02002 at http://www.diodes.com/datasheets/ap02002.pdf for latest version.
DMP2038USS
Document number: DS36919 Rev. 2 - 2
X
C1
C2
Y
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Detail ‘A’
Dimensions Value (in mm)
X 0.60
Y 1.55 C1 5.4 C2 1.27
DMP2038USS
Dim Min Max
SO-8
A - 1.75 A1 0.10 0.20 A2 1.30 1.50 A3 0.15 0.25
b 0.3 0.5 D 4.85 4.95 E 5.90 6.10
E1 3.85 3.95
e 1.27 Typ
h - 0.35
L 0.62 0.82
0° 8°
θ
All Dimensions in mm
April 2014
© Diodes Incorporated
Page 6
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Diodes Incorporated products are specifically not authorized for use as critical components in life support devices or systems without the express written approval of the Chief Executive Officer of Diodes Incorporated. As used herein:
A. Life support devices or systems are devices or systems which:
1. are intended to implant into the body, or
labeling can be reasonably expected to result in significant injury to the user.
B. A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or to affect its safety or effectiveness.
Customers represent that they have all necessary expertise in the safety and regulatory ramifications of their life support devices or systems, and acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any use of Diodes Incorporated products in such safety-critical, life support devices or systems, notwithstanding any devices- or systems-related information or support that may be provided by Diodes Incorporated. Further, Customers must fully indemnify Diodes Incorporated and its representatives against any damages arising out of the use of Diodes Incorporated products in such safety-critical, life support devices or systems.
Copyright © 2014, Diodes Incorporated
www.diodes.com
2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the
IMPORTANT NOTICE
LIFE SUPPORT
DMP2038USS
DMP2038USS
Document number: DS36919 Rev. 2 - 2
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