Diodes DMP1080UCB4 User Manual

Product Summary
I
V
R
(BR)DSS
-12V
80m @ V 93m @ VGS = -2.5V
DS(ON)
GS
= -4.5V
D
TA = +25°C
-3.3A
-3.0A
Description
This new generation MOSFET has been designed to minimize the on­state resistance (R performance, making it ideal for high efficiency power management applications.
) and yet maintain superior switching
DS(on)
Applications
Battery Management
Load Switch
Battery Protection
ESD PROTECTED TO 3kV
U-WLB1010-4
DMP1080UCB4
P-CHANNEL ENHANCEMENT MODE MOSFET
Features
Low Qg & Qgd
Small Footprint
Low Profile 0.62mm height
ESD Protected Up To -3KV
Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2)
Halogen and Antimony Free. “Green” Device (Note 3)
Qualified to AEC-Q101 Standards for High Reliability
Mechanical Data
Case: U-WLB1010-4
Terminal Connections: See Diagram Below
Weight: 0.0018 grams (approximate)
D
G
Top View
Equivalent Circuit
D
S
Ordering Information (Note 4)
Part Number Case Packaging
DMP1080UCB4-7 U-WLB1010-4 3000/Tape & Reel
Notes: 1. No purposely added lead. Fully EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant.
2. See http://www.diodes.com for more information about Diodes Incorporated’s definitions of Halogen- and Antimony-free, "Green" and Lead-free.
3. Halogen- and Antimony-free "Green” products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and <1000ppm antimony compounds.
4. For packaging details, go to our website at http://www.diodes.com.
Marking Information
Date Code Key
Year 2011 2012 2013 2014 2015 2016 2017
Code Y Z A B C D E
Month Jan Feb Mar Apr May Jun Jul Aug Sep Oct Nov Dec
Code 1 2 3 4 5 6 7 8 9 O N D
BW
YM
DMP1080UCB4
Document number: DS35827 Rev. 4 - 2
BW = Product Type Marking Code YM = Date Code Marking Y = Year (ex: X = 2010) M = Month (ex: 9 = September)
1 of 6
www.diodes.com
December 2012
© Diodes Incorporated
)
r
r
g
g
g
g
(th)
)
r
)
Maximum Ratings (@T
= +25°C, unless otherwise specified.)
A
Characteristic Symbol Value Unit Drain-Source Voltage Gate-Source Voltage
Continuous Drain Current (Note 5) VGS = -4.5V
Continuous Drain Current (Note 5) VGS = -2.5V Pulsed Drain Current (Note 6)
Thermal Characteristics
Characteristic Symbol Value Unit
Power Dissipation (Note 7) Thermal Resistance, Junction to Ambient @T Thermal Resistance, Junction to Case @T Power Dissipation (Note 5) Thermal Resistance, Junction to Ambient @T Operating and Storage Temperature Range
= +25°C (Note 7) R
C
T
Steady
State
Steady
State
= +25°C (Note 7) R
A
= +25°C (Note 5) R
A
= +25°C
A
= +70°C
T
A
T
= +25°C
A
T
= +70°C
A
DMP1080UCB4
V
DSS
V
GSS
I
D
I
D
I
DM
P
D
JAJC
P
D
JA
T
, T
J
STG
-12 V
-6 V
-3.3
-2.7
-3.0
-2.4
A
A
20 A
0.82 W 150 °C/W
42.66 °C/W
1.59 W
80.29 °C/W
-55 to +150 °C
Electrical Characteristics (@T
= +25°C, unless otherwise specified.)
A
Characteristic Symbol Min Typ Max Unit Test Condition
OFF CHARACTERISTICS (Note 8)
Drain-Source Breakdown Voltage Gate-Source Breakdown Voltage Zero Gate Voltage Drain Current TJ = +25°C I Gate-Source Leakage
BV BV
I
DSS
GSS DSS GSS
-12 - - V
-6.0 - - V
- - -1
- - -100 nA
VGS = 0V, ID = -250A VDS = 0V, IG = -250A
μA
= -9.6V, VGS = 0V
V
DS
VGS = -6V, VDS = 0V ON CHARACTERISTICS (Note 8) Gate Threshold Voltage
Static Drain-Source On-Resistance
Forward Transfer Admittance Diode Forward Voltage Reverse Recovery Charge Reverse Recovery Time
V
GS(th
R
DS (ON)
|Y V
Q
fs
SD
r
t
r
-0.4 -0.6 -1.0 V
- 65 80
- 77 93
- 108 130
|
- 4 - S
-0.6 -1.0 V
- 2.0 - nC
- 9.5 - ns
VDS = VGS, ID = -250A
V
= -4.5V, ID = -500mA
mΩ
GS
= -2.5V, ID = -500mA
V
GS
= -1.5V, ID = -500mA
V
GS
VDS = -6V, ID = -500mA
VGS = 0V, IS = -500mA
V
= –4.0V, IF = –0.5A,
dd
di/dt =100A/s DYNAMIC CHARACTERISTICS (Note 9) Input Capacitance Output Capacitance Reverse Transfer Capacitance Total Gate Charge Gate-Source Charge Gate-Drain Charge Gate Charge at Vth Turn-On Delay Time Turn-On Rise Time Turn-Off Delay Time Turn-Off Fall Time
Notes: 5. Device mounted on FR4 material with 1-inch2 (6.45-cm
6. Repetitive rating, pulse width limited by junction temperature.
7. Device mounted on FR-4 PCB with minimum recommended pad layout, single sided.
8. Short duration pulse test used to minimize self-heating effect.
9. Guaranteed by design. Not subject to production testing.
2
), 2-oz. (0.071-mm thick) Cu.
C C
Q t
t
C
oss rss
Q Q Q
D(on
t
D(off
t
iss
s d
f
- 213 350
- 119 250
- 54.4 90
- 2.5 5
- 0.3 -
- 0.6 -
- 0.15 -
- 16.7 -
- 20.6 -
- 38.4 -
- 28.4 -
pF
nC
ns
V
= -6V, VGS = 0V,
DS
f = 1.0MHz
= -4.5V, VDS = -6V,
V
GS
I
= -500mA
D
= -6V, VGS = -2.5V,
V
DS
R
= 20, ID = -500mA
G
DMP1080UCB4
Document number: DS35827 Rev. 4 - 2
2 of 6
www.diodes.com
December 2012
© Diodes Incorporated
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