NEW PRODUCT
Product Summary
V
Description
This new generation MOSFET has been designed to minimize the onstate resistance (R
performance, making it ideal for high efficiency power management
applications.
(BR)DSS
-12V
R
32mΩ@ V
45mΩ@ VGS = -2.5V
75mΩ@ VGS = -1.8V
) and yet maintain superior switching
DS(on)
DS(on) max
= -4.5V
GS
TA = 25°C
Applications
• DC-DC Converters
• Power management functions
• Analog Switch
ADVANCE INFORMATION
ESD PROTECTED TO 3kV
P-CHANNEL ENHANCEMENT MODE MOSFET
Features
• Low On-Resistance
I
D
-5.5A
-4.5A
-3.2A
• Low Input Capacitance
• Fast Switching Speed
• Low Input/Output Leakage
• ESD Protected Up To 3kV
• Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2)
• Halogen and Antimony Free. “Green” Device (Note 3)
• Qualified to AEC-Q101 Standards for High Reliability
Mechanical Data
• Case: X2-DFN2015-3
• Case Material: Molded Plastic, “Green” Molding Compound.
UL Flammability Classification Rating 94V-0
• Moisture Sensitivity: Level 1 per J-STD-020
• Terminal Connections: See Diagram
• Terminals: Finish – NiPdAu over Copper leadframe. Solderable
• per MIL-STD-202, Method 208
• Weight: 0.008 grams (approximate)
X2-DFN2015-3
Top View Bottom View
DMP1045UFY4
e4
D
Internal Schematic
S
G
Ordering Information (Note 4)
Part Number Case Packaging
DMP1045UFY4-7 X2-DFN2015-3 3,000/Tape & Reel
DMP1045UFY4-13 X2-DFN2015-3 10,000/Tape & Reel
Notes: 1. No purposely added lead. Fully EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant.
2. See http://www.diodes.com for more information about Diodes Incorporated’s definitions of Halogen- and Antimony-free, "Green" and Lead-free.
4. For packaging details, go to our website at http://www.diodes.com.
3. Halogen- and Antimony-free "Green” products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and
<1000ppm antimony compounds.
Marking Information
DMP1045UFY4
Document number: DS31853 Rev. 7 - 2
15P
YM
www.diodes.com
15P = Marking Code
YM = Date Code Marking
Y = Year (ex: W = 2009)
M = Month (ex: 9 = September)
1 of 6
September 2012
© Diodes Incorporated
NEW PRODUCT
Maximum Ratings (@T
= +25°C, unless otherwise specified.)
A
Characteristic Symbol Value Unit
Drain-Source Voltage
Gate-Source Voltage
Steady
Continuous Drain Current VGS = -4.5V (Note 6)
State
t<5s
Maximum Continuous Body Diode Forward Current (Note 6)
Pulsed Drain Current (10μs pulse, duty cycle = 1%)
Thermal Characteristics (@T
= +25°C, unless otherwise specified.)
A
Characteristic Symbol Value Unit
Power Dissipation (Note 5)
Thermal Resistance, Junction to Ambient (Note 5)
ADVANCE INFORMATION
Power Dissipation (Note 6)
Thermal Resistance, Junction to Ambient (Note 6)
Thermal Resistance, Junction to Case (Notes 6) Steady state
Operating and Storage Temperature Range
DMP1045UFY4
V
DSS
V
GSS
T
= +25°C
A
= +70°C
T
A
= +25°C
T
A
T
= +70°C
A
T
= +25°C
A
TA = +70°C
Steady state
t<5s 135
T
= +25°C
A
TA = +70°C
Steady state
t<5s 52
I
D
I
S
I
DM
P
D
R
θJA
P
D
R
θJA
R
θJC
T
, T
J
STG
-12 V
±8 V
-5.5
-4.3
-6.5
-5.1
-2.2
A
A
A
-25 A
0.7
0.4
193
1.7
1.1
W
°C/W
W
73
°C/W
17
-55 to +150 °C
Electrical Characteristics (@T
= +25°C, unless otherwise specified.)
A
Characteristic Symbol Min Typ Max Unit Test Condition
OFF CHARACTERISTICS (Note 7)
Drain-Source Breakdown Voltage
Zero Gate Voltage Drain Current TJ = 25°C I
Gate-Source Leakage
BV
I
DSS
DSS
GSS
-12 - - V
- - -1.0
- - ±10
VGS = 0V, ID = -250μA
μA
μA
= -12V, VGS = 0V
V
DS
= ±8V, VDS = 0V
V
GS
ON CHARACTERISTICS (Note 7)
Gate Threshold Voltage
Static Drain-Source On-Resistance
Forward Transfer Admittance
Diode Forward Voltage
V
GS(th
R
DS (ON)
|Y
V
fs
SD
-0.3 -0.55 -1.0 V
26 32
-
31 45
51 75
|
- 12 - S
- -0.6 - V
VDS = VGS, ID = -250μA
V
= -4.5V, ID = -4.0A
mΩ
GS
V
= -2.5V, ID = -3.5A
GS
V
= -1.8V, ID = -2.7A
GS
VDS = -5V, ID = -4A
VGS = 0V, IS = -1A
DYNAMIC CHARACTERISTICS (Note 8)
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
Gate Resistnace
C
iss
C
oss
C
rss
R
- 1291 - pF
- 266 - pF
- 242 - pF
- 13 - Ω
V
= -10V, VGS = 0V
DS
f = 1.0MHz
VDS = 0V, V
GS
= 0V, f = 1.0MHz
SWITCHING CHARACTERISTICS (Note 8)
Total Gate Charge (VGS = -8V) Qg
Total Gate Charge (VGS = -4.5V) Qg
Gate-Source Charge
Gate-Drain Charge
Turn-On Delay Time
Turn-On Rise Time
Turn-Off Delay Time
Turn-Off Fall Time
Notes: 5. Device mounted on FR-4 PCB with minimum recommended pad layout, single sided.
6. Device mounted on 1” x 1” FR-4 PCB with high coverage 2oz. Copper, single sided.
7. Short duration pulse test used to minimize self-heating effect.
8. Guaranteed by design. Not subject to production testing.
Q
Q
t
D(on
t
D(off
s
d
t
t
f
- 23.7 - nC
- 14.7 nC
- 1.8 - nC
- 4.6 - nC
- 14 - ns
- 22 - ns
- 74 - ns
- 75 - ns
V
= -10V, ID = -4A
DS
= -10V, V
V
DS
R
= 2.5Ω, RG = 3.0Ω
L
GS
= -4.5V,
DMP1045UFY4
Document number: DS31853 Rev. 7 - 2
2 of 6
www.diodes.com
September 2012
© Diodes Incorporated