Diodes DMP1045UFY4 User Manual

Page 1
Product Summary
V
Description
This new generation MOSFET has been designed to minimize the on­state resistance (R performance, making it ideal for high efficiency power management applications.
(BR)DSS
-12V
R
32m@ V 45m@ VGS = -2.5V 75m@ VGS = -1.8V
) and yet maintain superior switching
DS(on)
DS(on) max
= -4.5V
GS
TA = 25°C
Applications
DC-DC Converters
Power management functions
Analog Switch
ADVANCE INFORMATION
ESD PROTECTED TO 3kV
P-CHANNEL ENHANCEMENT MODE MOSFET
Features
Low On-Resistance
I
D
-5.5A
-4.5A
-3.2A
Low Input Capacitance
Fast Switching Speed
Low Input/Output Leakage
ESD Protected Up To 3kV
Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2)
Halogen and Antimony Free. “Green” Device (Note 3)
Qualified to AEC-Q101 Standards for High Reliability
Mechanical Data
Case: X2-DFN2015-3
Case Material: Molded Plastic, “Green” Molding Compound.
UL Flammability Classification Rating 94V-0
Moisture Sensitivity: Level 1 per J-STD-020
Terminal Connections: See Diagram
Terminals: Finish – NiPdAu over Copper leadframe. Solderable
per MIL-STD-202, Method 208
Weight: 0.008 grams (approximate)
X2-DFN2015-3
Top View Bottom View
DMP1045UFY4
e4
D
Internal Schematic
S
G
Ordering Information (Note 4)
Part Number Case Packaging
DMP1045UFY4-7 X2-DFN2015-3 3,000/Tape & Reel
DMP1045UFY4-13 X2-DFN2015-3 10,000/Tape & Reel
Notes: 1. No purposely added lead. Fully EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant.
2. See http://www.diodes.com for more information about Diodes Incorporated’s definitions of Halogen- and Antimony-free, "Green" and Lead-free.
4. For packaging details, go to our website at http://www.diodes.com.
3. Halogen- and Antimony-free "Green” products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and <1000ppm antimony compounds.
Marking Information
DMP1045UFY4
Document number: DS31853 Rev. 7 - 2
15P
YM
www.diodes.com
15P = Marking Code YM = Date Code Marking Y = Year (ex: W = 2009) M = Month (ex: 9 = September)
1 of 6
September 2012
© Diodes Incorporated
Page 2
)
g
g
g
)
r
)
Maximum Ratings (@T
= +25°C, unless otherwise specified.)
A
Characteristic Symbol Value Unit
Drain-Source Voltage Gate-Source Voltage
Steady
Continuous Drain Current VGS = -4.5V (Note 6)
State
t<5s
Maximum Continuous Body Diode Forward Current (Note 6) Pulsed Drain Current (10μs pulse, duty cycle = 1%)
Thermal Characteristics (@T
= +25°C, unless otherwise specified.)
A
Characteristic Symbol Value Unit
Power Dissipation (Note 5)
Thermal Resistance, Junction to Ambient (Note 5)
ADVANCE INFORMATION
Power Dissipation (Note 6)
Thermal Resistance, Junction to Ambient (Note 6) Thermal Resistance, Junction to Case (Notes 6) Steady state
Operating and Storage Temperature Range
DMP1045UFY4
V
DSS
V
GSS
T
= +25°C
A
= +70°C
T
A
= +25°C
T
A
T
= +70°C
A
T
= +25°C
A
TA = +70°C
Steady state
t<5s 135
T
= +25°C
A
TA = +70°C
Steady state
t<5s 52
I
D
I
S
I
DM
P
D
R
θJA
P
D
R
θJA
R
θJC
T
, T
J
STG
-12 V ±8 V
-5.5
-4.3
-6.5
-5.1
-2.2
A
A A
-25 A
0.7
0.4
193
1.7
1.1
W
°C/W
W
73
°C/W
17
-55 to +150 °C
Electrical Characteristics (@T
= +25°C, unless otherwise specified.)
A
Characteristic Symbol Min Typ Max Unit Test Condition
OFF CHARACTERISTICS (Note 7)
Drain-Source Breakdown Voltage Zero Gate Voltage Drain Current TJ = 25°C I Gate-Source Leakage
BV
I
DSS DSS GSS
-12 - - V
- - -1.0
- - ±10
VGS = 0V, ID = -250μA
μA μA
= -12V, VGS = 0V
V
DS
= ±8V, VDS = 0V
V
GS
ON CHARACTERISTICS (Note 7)
Gate Threshold Voltage
Static Drain-Source On-Resistance
Forward Transfer Admittance Diode Forward Voltage
V
GS(th
R
DS (ON)
|Y V
fs
SD
-0.3 -0.55 -1.0 V 26 32
-
31 45 51 75
|
- 12 - S
- -0.6 - V
VDS = VGS, ID = -250μA V
= -4.5V, ID = -4.0A
m
GS
V
= -2.5V, ID = -3.5A
GS
V
= -1.8V, ID = -2.7A
GS
VDS = -5V, ID = -4A VGS = 0V, IS = -1A
DYNAMIC CHARACTERISTICS (Note 8)
Input Capacitance Output Capacitance Reverse Transfer Capacitance Gate Resistnace
C
iss
C
oss
C
rss
R
- 1291 - pF
- 266 - pF
- 242 - pF
- 13 -
V
= -10V, VGS = 0V
DS
f = 1.0MHz VDS = 0V, V
GS
= 0V, f = 1.0MHz
SWITCHING CHARACTERISTICS (Note 8)
Total Gate Charge (VGS = -8V) Qg Total Gate Charge (VGS = -4.5V) Qg Gate-Source Charge Gate-Drain Charge Turn-On Delay Time Turn-On Rise Time Turn-Off Delay Time Turn-Off Fall Time
Notes: 5. Device mounted on FR-4 PCB with minimum recommended pad layout, single sided.
6. Device mounted on 1” x 1” FR-4 PCB with high coverage 2oz. Copper, single sided.
7. Short duration pulse test used to minimize self-heating effect.
8. Guaranteed by design. Not subject to production testing.
Q
Q
t
D(on
t
D(off
s d
t
t
f
- 23.7 - nC
- 14.7 nC
- 1.8 - nC
- 4.6 - nC
- 14 - ns
- 22 - ns
- 74 - ns
- 75 - ns
V
= -10V, ID = -4A
DS
= -10V, V
V
DS
R
= 2.5Ω, RG = 3.0Ω
L
GS
= -4.5V,
DMP1045UFY4
Document number: DS31853 Rev. 7 - 2
2 of 6
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September 2012
© Diodes Incorporated
Page 3
R
CUR
R
T
RAIN CUR
R
N
T
R
R
OUR
ON-R
R
R
OUR
CE ON-R
TANC
R
R
OUR
ON-R
R
R
OUR
C
DMP1045UFY4
20
15
(A)
V= -8.0V
GS
V= -4.5V
V= -2.5V
GS
V= -2.0V
GS
GS
V= -1.8V
GS
EN
10
AIN
D
-I , D
5
0
0 0.5 1.0 1.5 2.0 2.5 3.0
-V , DRAIN -SOURCE VOLTAGE (V)
DS
V= -1.5V
GS
V= -1.2V
GS
Fig. 1 Typical Output Characteri st ics
0.12
Ω
ADVANCE INFORMATION
0.10
20
V = -5.0V
DS
15
(A) E
10
D
-I , D
5
0
0 0.5 1.0 1.5 2.0 2.5
T = 150C
°
A
T = 125C
°
A
-V , GATE-SOURCE VOLTAGE (V)
GS
T = 85C
A
T = 25C
A
T = -55C
°
A
°
°
Fig. 2 Typical Transfer Characteristics
0.20
Ω
E ( )
0.18
0.16
ESISTANCE ( )
0.08
0.06
CE
V = -1.8V
GS
0.04
V = -2.5V
AIN-S , D
0.02
DS(ON)
0
048121620
-I , DRAIN SOURCE CURRENT (A)
D
GS
V = -4.5V
GS
Fig. 3 Typical On-Resistance vs.
Drain Curr ent and G at e Vol t age
0.06
Ω
ESISTANCE ( )
CE
0.04
0.02
V= -4.5V
GS
T = 125C
°
A
T = 150C
°
A
T = 85C
°
A
T = 25C
°
A
T = -55C
°
A
AIN-S , D
0.14
ESIS
I = -4.0A
0.12
D
0.10
0.08
0.06
AIN-S
0.04
, D
0.02
DS(ON)
0
012345678
-V , GATE-SOURCE VOLTAGE (V)
GS
Fig. 4 Typical Drain-S ource On- Resistance
vs. G ate- S ource Voltage
1.7
V = -2.5V
1.5
GS
I = -5A
D
E
1.3
1.1
AIN-S , D
0.9
DS(ON)
0.7
ON-RESISTANCE (NORMALIZED)
V = -4.5V
GS
I = -10A
D
DS(ON)
0
0 5 10 15 20
-I , DRAIN SOURCE CURRENT (A)
D
Fig. 5 Typical On-Resistance vs.
Drain Curr ent and Temperature
0.5
-50 -25 0 25 50 75 100 125 150 T , JUNCTION TEMPERATURE ( C)
J
°
Fig. 6 On- Resistance Variati on with Temperature
DMP1045UFY4
Document number: DS31853 Rev. 7 - 2
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September 2012
© Diodes Incorporated
Page 4
R
R
OUR
C
ON-R
TANC
GATE THRESH
O
OLTAG
OUR
CE CUR
REN
T
C
UNC
TIO
N CAPACITAN
C
F
GAT
OUR
C
OLTAG
R
CUR
RENT
DMP1045UFY4
Ω
0.10
1.0
E ( )
E (V)
0.08
0.8
ESIS
-I = 250µA
0.06
E
0.04
AIN-S
0.02
, D
DS(on)
0
-50 -25 0 25 50 75 100 125 150 T , JUNCTION TEMPERATURE ( C)
J
V=5V
-2.
GS
I= A
-5
D
V = -4.5V
GS
I= A
-10
D
Fig. 7 On-R esis tance Variation with Temperatur e
20
°
0.6
LD V
0.4
0.2
GS(TH)
V,
0
-50 -25 0 25 50 75 100 125 150 T , AMBIENT TEMPERATURE (°C)
A
Fig. 8 Gate Threshold Variation vs. Ambient Temperature
10,000
ADVANCE INFORMATION
D
f = 1MHz
)
16
(A)
T= 25C
°
12
A
E (p
1,000
C
iss
C
oss
C
8
rss
100
S
-I , S 4
0
0.4 0.6 0.8 1.0 1.4
-V , SOURCE-DRAIN VOLTAGE (V)
SD
1.2
Fig. 9 Diode Forward Voltage vs. Current
8
E (V)
6
, J
T
10
02 4 681012
-V , DRAIN-SOURCE VOLTAGE (V)
DS
Fig. 10 Typical Junction Capacitance
100
R
DS(on)
Limited
P = 10sWµ
10
(A)
V = -10V
DS
I= -4A
E V
D
4
E-S
2
GS
-V ,
0
0 5 10 15 20 25
Q , TOTAL GATE CHARGE (nC)
g
Fig. 11 Gate-Charge Cha r acteristics
DC
P = 10s
1
W
P = 1s
W
AIN
D
-I , D
0.1
0.01
0.1 1 10 100
P = 100ms
W
P = 10ms
W
P = 1ms
W
P = 100µs
T = 150°C
J(max)
T = 25°C
A
V = -8V
GS
Single Pulse
DUT on 1 * MRP Board
-V , DRAIN-SOURCE VOLTAGE (V)
DS
W
Fig. 12 SOA, Safe Operation Area
DMP1045UFY4
Document number: DS31853 Rev. 7 - 2
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Page 5
T
RAN
N
T T
HER
R
T
N
C
E A
ESIS
MAL
SIE
r(t),
0.001
ADVANCE INFORMATION
Package Outline Dimensions
Please see AP02002 at http://www.diodes.com/datasheets/ap02002.pdf for latest version.
Suggested Pad Layout
Please see AP02001 at http://www.diodes.com/datasheets/ap02001.pdf for the latest version.
DMP1045UFY4
Document number: DS31853 Rev. 7 - 2
DMP1045UFY4
1
D = 0.7 D = 0.5
D = 0.3
0.1
D = 0.1
D = 0.05
D = 0.02
0.01
D = 0.01
D = 0.005
Single Pulse
0.00001 0.0001 0.001 0.01 0.1 1 10 100 1,000
A
A1
E
Y2
G
D
z
e
D2
X
X1
C
t1, PULSE DURATION TIMES (sec)
Fig. 13 Transient Thermal Resistance
A3
SEATING PLANE
L
E2
b
Y1
X
Y
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D = 0.9
Dim Min Max Typ
A
A1 0 0.05 0.02 A3
b 0.20 0.30 0.25 D 1.45 1.575 1.50
D2 1.00 1.20 1.10
e
E 1.95 2.075 2.00
E2 0.70 0.90 0.80
L 0.25 0.35 0.30
z
All Dimensions in mm
Dimensions Value (in mm)
C 1.00 G 0.15 X 0.31
X1 1.30
Y 0.50 Y1 1.00 Y2 0.65
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R (t) = r(t) * R
θθ
JA JA
R = 193°C/W
θ
JA
Duty Cycle, D = t1/ t2
X2-DFN2015-3
0.40
0.13
0.50
0.125
September 2012
© Diodes Incorporated
Page 6
DIODES INCORPORATED MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARDS TO THIS DOCUMENT, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION).
Diodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes without further notice to this document and any product described herein. Diodes Incorporated does not assume any liability arising out of the application or use of this document or any product described herein; neither does Diodes Incorporated convey any license under its patent or trademark rights, nor the rights of others. Any Customer or user of this document o r products described herein in such applica tions shall assume all risks of such use and will agree to hold Diodes Incorporated and all the companies whose products are represented on Diodes Incorporated website, harmless against all damages.
Diodes Incorporated does not warrant or accept any liability whatsoever in respect of any products purchased through unauthorized sales channel. Should Customers purchase or use Diodes Incorporated products for any unintended or unauthorize d application, Customers shall indemnify and hold Diodes Incorporated and its representatives harmless against all claims, damages, expenses, and attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized application.
Products described herein may be covered by one or more United States, international or foreign patents pending. Product names and markings noted herein may also be covered by one or more United States, international or foreign trademarks.
ADVANCE INFORMATION
Diodes Incorporated products are specifically not authorized for use as critical components in life support devices or systems without the express written approval of the Chief Executive Officer of Diodes Incorporated. As used herein:
A. Life support devices or systems are devices or systems which:
1. are intended to implant into the body, or
labeling can be reasonably expected to result in significant injury to the user. B. A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the
failure of the life support device or to affect its safety or effectiveness. Customers represent that they have all necessary expertise in the safety and regulatory ramifications of their life support devices or systems, and
acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any use of Diodes Incorporated products in such safety-critical, life support devices or systems, notwithstanding any devices- or systems-related information or support that may be provided by Diodes Incorporated. Further, Customers must fully indemnify Diodes Incorporated and its representatives against any damages arising out of the use of Diodes Incorporated products in such safety-critical, life support devices or systems.
Copyright © 2012, Diodes Incorporated
www.diodes.com
2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the
IMPORTANT NOTICE
LIFE SUPPORT
DMP1045UFY4
DMP1045UFY4
Document number: DS31853 Rev. 7 - 2
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