Diodes DMP1045UFY4 User Manual

Product Summary
V
Description
This new generation MOSFET has been designed to minimize the on­state resistance (R performance, making it ideal for high efficiency power management applications.
(BR)DSS
-12V
R
32m@ V 45m@ VGS = -2.5V 75m@ VGS = -1.8V
) and yet maintain superior switching
DS(on)
DS(on) max
= -4.5V
GS
TA = 25°C
Applications
DC-DC Converters
Power management functions
Analog Switch
ADVANCE INFORMATION
ESD PROTECTED TO 3kV
P-CHANNEL ENHANCEMENT MODE MOSFET
Features
Low On-Resistance
I
D
-5.5A
-4.5A
-3.2A
Low Input Capacitance
Fast Switching Speed
Low Input/Output Leakage
ESD Protected Up To 3kV
Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2)
Halogen and Antimony Free. “Green” Device (Note 3)
Qualified to AEC-Q101 Standards for High Reliability
Mechanical Data
Case: X2-DFN2015-3
Case Material: Molded Plastic, “Green” Molding Compound.
UL Flammability Classification Rating 94V-0
Moisture Sensitivity: Level 1 per J-STD-020
Terminal Connections: See Diagram
Terminals: Finish – NiPdAu over Copper leadframe. Solderable
per MIL-STD-202, Method 208
Weight: 0.008 grams (approximate)
X2-DFN2015-3
Top View Bottom View
DMP1045UFY4
e4
D
Internal Schematic
S
G
Ordering Information (Note 4)
Part Number Case Packaging
DMP1045UFY4-7 X2-DFN2015-3 3,000/Tape & Reel
DMP1045UFY4-13 X2-DFN2015-3 10,000/Tape & Reel
Notes: 1. No purposely added lead. Fully EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant.
2. See http://www.diodes.com for more information about Diodes Incorporated’s definitions of Halogen- and Antimony-free, "Green" and Lead-free.
4. For packaging details, go to our website at http://www.diodes.com.
3. Halogen- and Antimony-free "Green” products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and <1000ppm antimony compounds.
Marking Information
DMP1045UFY4
Document number: DS31853 Rev. 7 - 2
15P
YM
www.diodes.com
15P = Marking Code YM = Date Code Marking Y = Year (ex: W = 2009) M = Month (ex: 9 = September)
1 of 6
September 2012
© Diodes Incorporated
)
g
g
g
)
r
)
Maximum Ratings (@T
= +25°C, unless otherwise specified.)
A
Characteristic Symbol Value Unit
Drain-Source Voltage Gate-Source Voltage
Steady
Continuous Drain Current VGS = -4.5V (Note 6)
State
t<5s
Maximum Continuous Body Diode Forward Current (Note 6) Pulsed Drain Current (10μs pulse, duty cycle = 1%)
Thermal Characteristics (@T
= +25°C, unless otherwise specified.)
A
Characteristic Symbol Value Unit
Power Dissipation (Note 5)
Thermal Resistance, Junction to Ambient (Note 5)
ADVANCE INFORMATION
Power Dissipation (Note 6)
Thermal Resistance, Junction to Ambient (Note 6) Thermal Resistance, Junction to Case (Notes 6) Steady state
Operating and Storage Temperature Range
DMP1045UFY4
V
DSS
V
GSS
T
= +25°C
A
= +70°C
T
A
= +25°C
T
A
T
= +70°C
A
T
= +25°C
A
TA = +70°C
Steady state
t<5s 135
T
= +25°C
A
TA = +70°C
Steady state
t<5s 52
I
D
I
S
I
DM
P
D
R
θJA
P
D
R
θJA
R
θJC
T
, T
J
STG
-12 V ±8 V
-5.5
-4.3
-6.5
-5.1
-2.2
A
A A
-25 A
0.7
0.4
193
1.7
1.1
W
°C/W
W
73
°C/W
17
-55 to +150 °C
Electrical Characteristics (@T
= +25°C, unless otherwise specified.)
A
Characteristic Symbol Min Typ Max Unit Test Condition
OFF CHARACTERISTICS (Note 7)
Drain-Source Breakdown Voltage Zero Gate Voltage Drain Current TJ = 25°C I Gate-Source Leakage
BV
I
DSS DSS GSS
-12 - - V
- - -1.0
- - ±10
VGS = 0V, ID = -250μA
μA μA
= -12V, VGS = 0V
V
DS
= ±8V, VDS = 0V
V
GS
ON CHARACTERISTICS (Note 7)
Gate Threshold Voltage
Static Drain-Source On-Resistance
Forward Transfer Admittance Diode Forward Voltage
V
GS(th
R
DS (ON)
|Y V
fs
SD
-0.3 -0.55 -1.0 V 26 32
-
31 45 51 75
|
- 12 - S
- -0.6 - V
VDS = VGS, ID = -250μA V
= -4.5V, ID = -4.0A
m
GS
V
= -2.5V, ID = -3.5A
GS
V
= -1.8V, ID = -2.7A
GS
VDS = -5V, ID = -4A VGS = 0V, IS = -1A
DYNAMIC CHARACTERISTICS (Note 8)
Input Capacitance Output Capacitance Reverse Transfer Capacitance Gate Resistnace
C
iss
C
oss
C
rss
R
- 1291 - pF
- 266 - pF
- 242 - pF
- 13 -
V
= -10V, VGS = 0V
DS
f = 1.0MHz VDS = 0V, V
GS
= 0V, f = 1.0MHz
SWITCHING CHARACTERISTICS (Note 8)
Total Gate Charge (VGS = -8V) Qg Total Gate Charge (VGS = -4.5V) Qg Gate-Source Charge Gate-Drain Charge Turn-On Delay Time Turn-On Rise Time Turn-Off Delay Time Turn-Off Fall Time
Notes: 5. Device mounted on FR-4 PCB with minimum recommended pad layout, single sided.
6. Device mounted on 1” x 1” FR-4 PCB with high coverage 2oz. Copper, single sided.
7. Short duration pulse test used to minimize self-heating effect.
8. Guaranteed by design. Not subject to production testing.
Q
Q
t
D(on
t
D(off
s d
t
t
f
- 23.7 - nC
- 14.7 nC
- 1.8 - nC
- 4.6 - nC
- 14 - ns
- 22 - ns
- 74 - ns
- 75 - ns
V
= -10V, ID = -4A
DS
= -10V, V
V
DS
R
= 2.5Ω, RG = 3.0Ω
L
GS
= -4.5V,
DMP1045UFY4
Document number: DS31853 Rev. 7 - 2
2 of 6
www.diodes.com
September 2012
© Diodes Incorporated
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