DMP1022UFDF
Datasheet number: DS36624 Rev. 3 - 2
March 2014
© Diodes Incorporated
Description
This MOSFET has been designed specifically for use in battery
management applications.
Features
0.6mm profile – ideal for low profile applications
PCB footprint of 4mm2
Low Gate Threshold Voltage
Fast Switching Speed
ESD Protected Gate
Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2)
Halogen and Antimony Free. “Green” Device (Note 3)
Qualified to AEC-Q101 Standards for High Reliability
Mechanical Data
Case: U-DFN2020-6
Case Material: Molded Plastic, “Green” Molding Compound.
UL Flammability Classification Rating 94V-0
Moisture Sensitivity: Level 1 per J-STD-020
Terminals: Finish – NiPdAu over Copper leadframe. Solderable
per MIL-STD-202, Method 208
Weight: 0.0065 grams (approximate)
PU = Product Type Marking Code
YM = Date Code Marking
Y = Year (ex: A = 2013)
M = Month (ex: 9 = September)
D
S
G
Gate Protection
Diode
12V P-CHANNEL ENHANCEMENT MODE MOSFET
Ordering Information (Note 4)
Notes: 1. No purposely added lead. Fully EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant.
2. See http://www.diodes.com/quality/lead_free.html for more information about Diodes Incorporated’s definitions of Halogen- and Antimony-free, "Green"
and Lead-free.
3. Halogen- and Antimony-free "Green” products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and
<1000ppm antimony compounds.
Marking Information
Date Code Key
4. For packaging details, go to our website at http://www.diodes.com/products/packages.html.
DMP1022UFDF
Datasheet number: DS36624 Rev. 3 - 2
March 2014
© Diodes Incorporated
Continuous Drain Current (Note 6) VGS = -4.5V
Pulsed Drain Current (10μs pulse, duty cycle = 1%)
Continuous Source-Drain Diode Current
Pulsed Source-Drain Diode Current (10μs pulse, duty cycle = 1%)
Total Power Dissipation (Note 5)
Thermal Resistance, Junction to Ambient (Note 5)
Total Power Dissipation (Note 6)
Thermal Resistance, Junction to Ambient (Note 6)
Thermal Resistance, Junction to Case (Note 6)
Operating and Storage Temperature Range
OFF CHARACTERISTICS (Note 7)
Drain-Source Breakdown Voltage
Zero Gate Voltage Drain Current TJ = +25°C
ON CHARACTERISTICS (Note 7)
Static Drain-Source On-Resistance
DYNAMIC CHARACTERISTICS (Note 8)
VDS = -10V, VGS = 0V,
f = 1.0MHz
Reverse Transfer Capacitance
VDS = 0V, VGS = 0V, f = 1MHz
VGS = -8V, VDS = -6V, ID = -10A
VGS = -4.5V, VDS = -6V,
ID = -10A
VDS = -6V, VGS = -4.5V,
RG = 1Ω, ID = -8A
Maximum Ratings (@T
= +25°C, unless otherwise specified.)
A
Thermal Characteristics
Electrical Characteristics (@T
= +25°C, unless otherwise specified.)
A
Notes: 5. Device mounted on FR-4 PC board, with minimum recommended pad layout, single sided.
8. Guaranteed by design. Not subject to production testing
6. Device mounted on FR-4 substrate PC board, 2oz copper, with thermal vias to bottom layer 1inch square copper plate
7. Short duration pulse test used to minimize self-heating effect