Diodes DMN65D8LFB User Manual

n
Product Summary
V
R
(BR)DSS
3.0 @ V
60V
4.0 @ VGS = 5V
DS(ON)
GS
= 10V
Description and Applications
These N-Channel enhancement mode field effect transistors are produced using DIODES proprietary, high density, uses advanced trench technology.These products have been designed to minimize on-state resistance while provide rugged, reliable, and fast switching
performance.These products are particularly suited for low voltage, low current applications such as small
Load switching
.
ESD PROTECTED TO 1.2kV
X1-DFN1006-3
Bottom View
I
D
TA = 25°C
400mA
330mA
DMN65D8LFB
N-CHANNEL ENHANCEMENT MODE FIELD MOSFET
Features and Benefits
N-Channel MOSFET
Low On-Resistance
Low Gate Threshold Voltage
Low Input Capacitance
Fast Switching Speed
Small Surface Mount Package
ESD Protected Gate, 1.2kV HBM
Lead, Halogen and Antimony Free, RoHS Compliant
"Green" Device (Notes 1 and 2)
Qualified to AEC-Q101 Standards for High Reliability
Mechanical Data
Case: X1-DFN1006-3
Case Material: Molded Plastic, “Green” Molding Compound.
UL Flammability Classification Rating 94V-0
Moisture Sensitivity: Level 1 per J-STD-020
Terminal Connections: See Diagram
Terminals: Finish – NiPdAu over Copper leadframe. Solderable
per MIL-STD-202, Method 208
Weight: 0.001 grams (approximate)
Drai
Body
Source
Diode
S
D
G
Top View
Pin Configuration
Gate
Gate Protection Diode
Equivalent Circuit
Ordering Information (Note 3)
Part Number Case Packaging
DMN65D8LFB-7 X1-DFN1006-3 3,000/Tape & Reel
DMN65D8LFB-7B X1-DFN1006-3 10,000/Tape & Reel
Notes: 1. No purposefully added lead. Halogen and Antimony Free.
2. Diodes Inc.`s “Green” Policy can be found on our website at http://www.diodes.com
3. For packaging details, go to our website at http://www.diodes.com
Marking Information
ate Code Key
Year 2011 2012 2013 2014 2015 2016 2017
Code Y Z A B C D E
Month Jan Feb Mar Apr May Jun Jul Aug Sep Oct Nov Dec
Code 1 2 3 4 5 6 7 8 9 O N D
DMN65D8LFB-7
X1
Top View
Dot Denotes Drain Side
Bar Denotes Gate and Source Side
DMN65D8LFB
Document number: DS35449 Rev. 2 - 2
DMN65D8LFB-7B
X1
Top View
1 of 5
www.diodes.com
X1 = Product Type Marking Code
November 2011
© Diodes Incorporated
θ
θ
)
)
r
)
Maximum Ratings
Characteristic Symbol Value Units
Drain-Source Voltage Gate-Source Voltage
Continuous Drain Current (Note 4) VGS = 10V
Continuous Drain Current (Note 5) VGS = 10V
Steady
State
Steady
State
T
= 25°C
A
= 70°C
T
A
T
= 25°C
A
T
= 70°C
A
V
DSS
V
GSS
I
D
I
D
60 V ±20 260
210 400
310
Thermal Characteristics
Characteristic Symbol Value Units
Power Dissipation, @TA = 25°C (Note 4) PD Thermal Resistance, Junction to Ambient @TA = 25°C (Note 4) Power Dissipation, @TA = 25°C (Note 5) PD Thermal Resistance, Junction to Ambient @TA = 25°C (Note 5)
Operating and Storage Temperature Range
R
JA
R
JSA
T
, T
J
STG
430 mW 290 840 mW 147
-55 to +150
DMN65D8LFB
V
mA
mA
°C/W
°C/W
°C
Electrical Characteristics @T
= 25°C unless otherwise specified
A
Characteristic Symbol Min Typ Max Unit Test Condition
OFF CHARACTERISTICS (Note 6)
Drain-Source Breakdown Voltage Zero Gate Voltage Drain Current TJ = 25°C I Gate-Body Leakage
BV
DSS
I
GSS
DSS
60 - - V
- - 0.1 µA
- -
±10
µA
VGS = 0V, ID = 250μA V
= 60V, VGS = 0V
DS
VGS = ±20V, V
DS
= 0V
ON CHARACTERISTICS (Note 6)
Gate Threshold Voltage Static Drain-Source On-Resistance Forward Transfer Admittance
Diode Forward Voltage
V
GS(th
R
DS (ON)
|Y V
SD
|
fs
1.2 - 2.0 V
-
-
3.0
4.0
80 320 - mS
- 0.7 1.2 V
Ω
VDS = VGS, ID = 250μA V
= 10V, ID = 0.115A
GS
V
= 5V, ID = 0.1115A
GS
VDS = 10V, ID = 0.115A VGS = 0V, IS = 0.115A
DYNAMIC CHARACTERISTICS (Note 7)
Input Capacitance Output Capacitance Reverse Transfer Capacitance Turn-On Delay Time Turn-On Rise Time Turn-Off Delay Time Turn-Off Fall Time
Notes: 4. Device mounted on FR-4 PCB with minimum recommended pad layout, single sided.
5. Device mounted on 2” x 2” FR-4 PCB with high coverage 2 oz. Copper, single sided.
6. Short duration pulse test used to minimize self-heating effect.
7. Guaranteed by design. Not subject to production testing.
C C C
t
t
iss oss rss
D(on
t
D(off
t
f
- 25 - pF
- 4.7 - pF
V
- 2.5 - pF
- 3.27 - ns
- 3.15 - ns
- 12.025 - ns
V R
- 6.29 - ns
= 25V, V
DS
= 30V, V
DD
GEN
GS
GEN
= 25,ID = 0.115A
= 0V, f = 1.0MHz
= 10V,
DMN65D8LFB
Document number: DS35449 Rev. 2 - 2
2 of 5
www.diodes.com
November 2011
© Diodes Incorporated
R
R
OUR
CE ON-R
TANC
G
R
O
O
G
C
UNC
T
O
C
PAC
TANC
p
F
DMN65D8LFB
0.6
0.5
0.4
0.3
0.2
V =10V
GS
V =5.0V
GS
V =4.0V
GS
V =4.5V
GS
V =3.5V
GS
V =3.0V
GS
V =2.5V
GS
D
I , DRAIN CURRENT (A)
1
0.1
V= 5.0V
DS
T=25C
A
T=85C
°
A
°
T =125 C
A
T=-55C
A
°
T =150 C
A
°
°
0.1
0.0 0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 5
V , DRAIN-SOURCE VOLTAGE (V)
DS
Fig.1 Typical Output Characteristics
5
0.01 0 0.5 1 1.5 2 2.5 3 3.5 4
V , GATE-SOURCE VOLTAGE
GS
Fig. 2 Typical Transfer Characteristics
2.4
Ω
4.5
E ( )
4
3.5
ESIS
3
V=5V
GS
2.5
V =10V
2
1.5
AIN-S
1
, D
0.5
DS(ON)
0
0 0.1 0.2 0.3 0.4 0.5 0.6
I , DRAIN-SOURCE CURRENT (A)
D
GS
Fig. 3 Typical On-Resistance vs. Drain Curr ent and G at e C harge
2
1.8
E (V)
1.6
I =250µA
D
I=1mA
D
LTA
LD V
ESH
1.4
1.2 1
0.8
0.6
ATE TH
0.4
GS(TH)
0.2
V,
0
-50 -25 0 25 50 75 100 125 150 TJ, JUNCTION TEMPERATURE (°C)
Fig. 5 Gat e Threshold V ariation vs. Ambient Temperature
2.2 2
1.8
1.6
1.4
1.2
(Normalized)
1
0.8
0.6
DS(ON)
R , DRAIN-SOURCE ON-RESISTANCE
0.4
-50 -25 0 25 50 75 100 125 150 TJ, JUNCTION TEMPER ATURE ( C)
Fig. 4 On-Resistance Variation with Temperature
50 45
)
40
E (
35
I
30 25
A N
20
I
15 10
, J
T
5 0
0 5 10 15 20 25
V , DRAIN-SOURCE VOLTAGE
DS
Fig. 6 Typical Junction Capac it ance
V =10V,
GS
I =115mA
D
V=5V,
GS
I =115mA
D
°
f=1MHz
C
ISS
C
OSS
C
RSS
DMN65D8LFB
Document number: DS35449 Rev. 2 - 2
3 of 5
www.diodes.com
November 2011
© Diodes Incorporated
1
0.1
0.01
S
I , SOURCE CURRENT (A)
0.001 0 0.2 0.4 0.6 0.8 1 1.2
V , SOURCE-DRAIN VOLTAGE (V)
SD
Fig. 7 Diode Forward Voltage vs. Current
T =85°C
Package Outline Dimensions
A
A1
b2
E
Suggested Pad Layout
X
DMN65D8LFB
Document number: DS35449 Rev. 2 - 2
T =125°C
T =150°C
A
A
L2
X
1
G2
DMN65D8LFB
A
T =25°C
A
T =-55°C
A
X1-DFN1006-3
Dim Min Max Typ
A 0.47 0.53 0.50
D
b1
e
L1L3
C
Dimensions Value (in mm)
G1
Y
Z
4 of 5
www.diodes.com
A1 0 0.05 0.03
b1 0.10 0.20 0.15 b2 0.45 0.55 0.50
D 0.95 1.075 1.00 E 0.55 0.675 0.60 e
L1 0.20 0.30 0.25 L2 0.20 0.30 0.25 L3
All Dimensions in mm
Z 1.1 G1 0.3 G2 0.2
X 0.7
X1 0.25
Y 0.4 C 0.7
0.35
0.40
November 2011
© Diodes Incorporated
DIODES INCORPORATED MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARDS TO THIS DOCUMENT, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION).
Diodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes without further notice to this document and any product described herein. Diodes Incorporated does not assume any liability arising out of the application or use of this document or any product described herein; neither does Diodes Incorporated convey any license under its patent or trademark rights, nor the rights of others. Any Customer or user of this document o r products described herein in such applica tions shall assume all risks of such use and will agree to hold Diodes Incorporated and all the companies whose products are represented on Diodes Incorporated website, harmless against all damages.
Diodes Incorporated does not warrant or accept any liability whatsoever in respect of any products purchased through unauthorized sales channel. Should Customers purchase or use Diodes Incorporated products for any unintended or unauthorize d application, Customers shall indemnify and hold Diodes Incorporated and its representatives harmless against all claims, damages, expenses, and attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized application.
Products described herein may be covered by one or more United States, international or foreign patents pending. Product names and markings noted herein may also be covered by one or more United States, international or foreign trademarks.
Diodes Incorporated products are specifically not authorized for use as critical components in life support devices or systems without the express written approval of the Chief Executive Officer of Diodes Incorporated. As used herein:
A. Life support devices or systems are devices or systems which:
1. are intended to implant into the body, or
labeling can be reasonably expected to result in significant injury to the user. B. A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the
failure of the life support device or to affect its safety or effectiveness. Customers represent that they have all necessary expertise in the safety and regulatory ramifications of their life support devices or systems, and
acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any use of Diodes Incorporated products in such safety-critical, life support devices or systems, notwithstanding any devices- or systems-related information or support that may be provided by Diodes Incorporated. Further, Customers must fully indemnify Diodes Incorporated and its representatives against any damages arising out of the use of Diodes Incorporated products in such safety-critical, life support devices or systems.
Copyright © 2011, Diodes Incorporated
www.diodes.com
2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the
IMPORTANT NOTICE
LIFE SUPPORT
DMN65D8LFB
DMN65D8LFB
Document number: DS35449 Rev. 2 - 2
5 of 5
www.diodes.com
November 2011
© Diodes Incorporated
Loading...