Diodes DMN65D8LDW User Manual

Product Summary
V
R
(BR)DSS
60V
8 @ V
6 @ VGS = 10V
Package
DS(ON)
= 5V
GS
SOT363
Description
This new generation MOSFET has been designed to minimize the on-state resistance (R performance, making it ideal for high efficiency power management applications.
Applications
 DC-DC Converters  Power Management Functions  Battery Operated Systems and Solid-State Relays  Drivers: Relays, Solenoids, Lamps, Hammers, Displays,
Memories, Transistors, etc
) and yet maintain superior switching
DS(on)
ESD PROTECTED TO 1kV
I
D
TA = +25°C
170mA
200mA
DUAL N-CHANNEL ENHANCEMENT MODE MOSFET
Features
 Dual N-Channel MOSFET  Low On-Resistance  Low Gate Threshold Voltage  Low Input Capacitance  Fast Switching Speed  Small Surface Mount Package  ESD Protected Gate, 1KV (HBM)  Lead-Free Finish; RoHS Compliant (Notes 1 & 2)
Halogen and Antimony Free. “Green” Device (Note 3) Qualified to AEC-Q101 Standards for High Reliability
Mechanical Data
Case: SOT363 Case Material: Molded Plastic. UL Flammability Classification
Rating 94V-0
Moisture Sensitivity: Level 1 per J-STD-020  Terminals: Solderable per MIL-STD-202, Method 208  Lead Free Plating (Matte Tin Finish annealed over Alloy 42
leadframe).
Terminal Connections: See Diagram  Weight: 0.006 grams (approximate)
D
SOT363
Top View Top View
G
2
1
S
G
2
2
Internal Schematic
DMN65D8LDW
e3
S
1
D
1
Ordering Information (Note 4)
Part Number Case Packaging
DMN65D8LDW-7 SOT363 3000/Tape & Reel
Notes: 1. EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant. All applicable RoHS exemptions applied.
2. See http://www.diodes.com/quality/lead_free.html for more information about Diodes Incorporated’s definitions of Halogen- and Antimony-free, "Green" and Lead-free.
3. Halogen- and Antimony-free "Green” products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and <1000ppm antimony compounds.
4. For packaging details, go to our website at http://www.diodes.com/products/packages.html
Marking Information
Date Code Key
Year 2007 2008 2009 2010 2011 2012 2013 2014 2015 2016 2017 2018
Code U V W X Y Z A B C D E F
Month Jan Feb Mar Apr May Jun Jul Aug Sep Oct Nov Dec
Code 1 2 3 4 5 6 7 8 9 O N D
MM1 YM
MM1 YM
MM1 YM
MM1 YM
DMN65D8LDW
Document number: DS35500 Rev. 6 - 2
MM1= Product Type Marking Code YM = Date Code Marking for SAT (Shanghai Assembly/ Test site) YM = Date Code Marking for CAT (Chengdu Assembly/ Test site) Y or Y = Year (ex: A = 2013) M = Month (ex: 9 = September)
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© Diodes Incorporated
)
g
g
)
r
)
Maximum Ratings (@T
= +25°C, unless otherwise specified.)
A
Drain-Source Voltage Gate-Source Voltage
Continuous Drain Current (Note 5) V
Continuous Drain Current (Note 5) V
Continuous Drain Current (Note 6) V
Continuous Drain Current (Note 6) V
Pulsed Drain Current (10µs pulse, duty cycle = 1%)
Thermal Characteristics
Characteristic Symbol Value Units
Total Power Dissipation (Note 5) Thermal Resistance, Junction to Ambient (Note 5) Total Power Dissipation (Note 6) Thermal Resistance, Junction to Ambient (Note 6) Thermal Resistance, Junction to Case (Note 6) Operating and Storage Temperature Range
DMN65D8LDW
Characteristic Symbol Value Units
60 V ±20 V
180 140
150 120
200 160
170 140
mA
mA
mA
mA
800 mA
=10V
GS
5V
GS =
10V
GS =
5V
GS =
Steady
State
Steady
State
Steady
State
Steady
State
= +25°C
T
A
= +70°C
T
A
= +25°C
T
A
T
= +70°C
A
= +25°C
T
A
= +70°C
T
A
= +25°C
T
A
= +70°C
T
A
P
D
R
θJA
P
D
R
θJA
R
θJC
T
J, TSTG
V
DSS
V
GSS
I
D
I
D
I
D
I
D
I
DM
300 mW 435 °C/W 400 mW 330 °C/W 139 °C/W
-55 to +150 °C
Electrical Characteristics (@T
= +25°C, unless otherwise specified.)
A
Characteristic Symbol Min Typ Max Unit Test Condition
OFF CHARACTERISTICS (Note 7)
Drain-Source Breakdown Voltage Zero Gate Voltage Drain Current Gate-Body Leakage
BV
I
DSS
I
GSS
DSS
60
V
1.0 µA
±5.0 µA
V
= 0V, ID = 250µA
GS
V
= 60V, V
DS
V
±20V, V
GS =
GS
DS
= 0V
= 0V
ON CHARACTERISTICS (Note 7)
Gate Threshold Voltage
Static Drain-Source On-Resistance
Forward Transconductance Diode Forward Voltage
V
GS(th
R
DS (ON)
g
V
FS
SD
1.0

80 — 0.8
2.0 V
8
6
1.2
mS
V
V
= VGS, ID = 250µA
DS
V
= 5.0V, ID = 0.115A
GS
V
= 10.0V, ID = 0.115A
GS
V
= 10V, ID = 0.115A
DS
V
= 0V, IS = 115mA
GS
DYNAMIC CHARACTERISTICS (Note 8)
Input Capacitance Output Capacitance Reverse Transfer Capacitance Gate Resistance
C
iss
C
oss
C
rss
R
G
  
Total Gate Charge VGS = 10V Qg Total Gate Charge VGS = 4.5V Qg  Gate-Source Charge Gate-Drain Charge Turn-On Delay Time Turn-On Rise Time Turn-Off Delay Time Turn-Off Fall Time
Notes: 5. Device mounted on FR-4 PC board, with minimum recommended pad layout, single sided.
6. Device mounted on FR-4 substrate PC board, 2oz copper, with 1inch square copper pad layout 7 .Short duration pulse test used to minimize self-heating effect.
8. Guaranteed by design. Not subject to production testing.
Q
s
Q
d
t
D(on
t
t

D(off
t

f
 
22.0
3.2
2.0
79.9
0.87
0.43
0.11
0.11
3.3
3.2
12.0
6.3
           
pF
V
= 25V, VGS = 0V, f = 1.0MHz
DS
VDS = 0V, VGS = 0V, f = 1.0MHz
= 10V, VDS = 30V,
V
GS
nC
= 150mA
I
D
= 30V, ID = 0.115A, V
V
DD
nS
R
= 25
GEN
GEN
= 10V
,
DMN65D8LDW
Document number: DS35500 Rev. 6 - 2
2 of 6
www.diodes.com
January 2014
© Diodes Incorporated
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