Diodes DMN62D0LFD User Manual

DMN62D0LFD
NEW PRODUCT
Product Summary
V
R
(BR)DSS
60V
2 @ V
2.5 @ VGS = 2.5V
DS(ON)
GS
= 4V
TA = +25°C
Description
This new generation MOSFET has been designed to minimize the on-
state resistance (R
performance, making it ideal for high efficiency power management
applications.
) and yet maintain superior switching
DS(ON)
Applications
DC-DC Converters
Power management functions
Battery Operated Systems and Solid-State Relays
Drivers: Relays, Solenoids, Lamps, Hammers, Displays,
NEW PRODUCT
Memories, Transistors, etc.
ESD PROTECTED
Top View
I
D
310mA
295mA
Bottom View
Features and Benefits
Low On-Resistance
Low Input Capacitance
Fast Switching Speed
Low Input/Output Leakage
ESD Protected
Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2)
Halogen and Antimony Free. “Green” Device (Note 3)
Qualified to AEC-Q101 Standards for High Reliability
Mechanical Data
Case: X1-DFN1212-3
Case Material: Molded Plastic. UL Flammability Classification
Rating 94V-0
Moisture Sensitivity: Level 1 per J-STD-020
Terminals: NiPdAu over Copper leadframe. Solderable per MIL-
STD-202, Method 208
Terminal Connections: See Diagram
Weight: 0.005 grams (approximate)
G pin
D
Pin-Out Top View
e4
S
Gate
G
Gate Protection Diode
Equivalent Circuit
Ordering Information (Note 4)
N-CHANNEL ENHANCEMENT MODE MOSFET
Part Number Compliance Case Packaging
DMN62D0LFD-7 Standard X1-DFN1212-3 3,000/Tape & Reel
DMN62D0LFD-13 Standard X1-DFN1212-3 10,000/Tape & Reel
Notes: 1. No purposely added lead. Fully EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant.
2. See http://www.diodes.com/quality/lead_free.html for more information about Diodes Incorporated’s definitions of Halogen- and Antimony-free, "Green" and Lead-free.
3. Halogen- and Antimony-free "Green” products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and <1000ppm antimony compounds.
4. For packaging details, go to our website at http://www.diodes.com/products/packages.html.
Marking Information
Date Code Key
Year 2007 2008 2009 2010 2011 2012 2013 2014 2015 2016 2017
Code U V W X Y Z A B C D E
Month Jan Feb Mar Apr May Jun Jul Aug Sep Oct Nov Dec
Code 1 2 3 4 5 6 7 8 9 O N D
K63
YM
DMN62D0LFD
Document number: DS36359 Rev. 2 - 2
K63 = Product Type Marking Code YM = Date Code Marking Y = Year (ex: Y = 2013) M = Month (ex: 9 = September)
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Drain
Body Diode
Source
May 2014
© Diodes Incorporated
NEW PRODUCT
Maximum Ratings (@T
= +25°C, unless otherwise specified.)
A
Characteristic Symbol Value Unit
Drain-Source Voltage
Gate-Source Voltage
T
= +25°C
Continuous Drain Current (Note 5) VGS = 4.0V
A
= +70°C
T
A
Pulsed Drain Current (Note 6) (10µs pulse, duty cycle = 1%)
Thermal Characteristics
Characteristic Symbol Max Unit
Power Dissipation (Note 5)
Thermal Resistance, Junction to Ambient @TA = +25°C (Note 5) R
Operating and Storage Temperature Range
NEW PRODUCT
Electrical Characteristics (@T
OFF CHARACTERISTICS (Note 7)
Drain-Source Breakdown Voltage
Zero Gate Voltage Drain Current TJ = +25°C I
Gate-Source Leakage
ON CHARACTERISTICS (Note 7)
Gate Threshold Voltage
Static Drain-Source On-Resistance
Forward Transfer Admittance
Diode Forward Voltage
DYNAMIC CHARACTERISTICS (Note 8)
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
Gate Resistance
Total Gate Charge
Gate-Source Charge
Gate-Drain Charge
Turn-On Delay Time
Turn-On Rise Time
Turn-Off Delay Time
Turn-Off Fall Time
Notes: 5. Device mounted on FR-4 PCB with minimum recommended pad layout, single sided.
6. Repetitive rating, pulse width limited by junction temperature.
7. Short duration pulse test used to minimize self-heating effect.
8. Guaranteed by design. Not subject to production testing.
DMN62D0LFD
Document number: DS36359 Rev. 2 - 2
Characteristic Symbol Min Typ Max Unit Test Condition
= +25°C, unless otherwise specified.)
A
BV
DSS
DSS
60
— —
— —
I
GSS
— —
— —
V
GS(th)
0.6 — 1.0 V
R
DS(ON)
|Y
V
C
C
C
R
Q
Q
Q
t
D(on)
t
D(off)
SD
iss
oss
rss
gd
t
t
|
fs
g
g
gs
r
f
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1.3 2
1.4 2.5
1.8 3
2.4
1.8
0.8 1.3 V
31
4.3
3.0
99
0.5
0.09
0.07
2.6
2.1
18
8.7
V
DSS
V
GSS
I
D
I
DM
P
D
JA
T
, T
J
STG
— V
1.0 A
±100 nA
±500 nA
±2.0 A
-55 to +150 °C
VGS = 0V, ID = 250A
VDS = 60V, VGS = 0V
V
V
V
VDS = VGS, ID = 250A
V
V
V
V
S
VDS = 10V, ID = 200mA
VGS = 0V, IS = 115mA
VDS = 25V, VGS = 0V,
pF
f = 1.0MHz
VDS = 0V, VGS = 0V, f = 1MHz
nC
ns
ns
ns
ns
V I
V R I
DMN62D0LFD
60 V
±20 V
310 260
1.0 A
0.48 W
265 °C/W
= ±5V, VDS = 0V
GS
= ±10V, VDS = 0V
GS
= ±15V, VDS = 0V
GS
= 4V, ID = 100mA
GS
= 2.5V, ID = 50mA
GS
= 1.8V, ID = 50mA
GS
= 1.5V, ID = 10mA
GS
= 4.5V, VDS = 10V,
GS
= 250mA
D
= 10V, VDS = 30V,
GS
= 150, RG = 25,
L
= 200mA
D
mA
May 2014
© Diodes Incorporated
R
C
URRENT
R
CUR
R
T
R
R
OUR
ON-R
R
R
OUR
ON-R
R
R
OUR
C
R
RAIN-SO
U
R
CE O
N
R
T
N
C
DMN62D0LFD
0.5
V = 10VGS
V= 4.5V
0.4
GS
V= 4.0V
GS
0.5
V = 5.0VDS
0.4
NEW PRODUCT
NEW PRODUCT
(A)
0.3
0.2
AIN
D
I, D
0.1
0.0 0 0.5 1.0 1.5 2.0 2.5 3.0
V= 3.5V
GS
V= 3.0V
GS
V= 2.5V
GS
V= 2.0V
GS
V= 1.2V
GS
V , DRAIN-SOURCE VOLTAGE (V)
DS
Figure 1 Typical Output Characteri stics
2.5
Ω
2.3
ESISTANCE ( )
CE
2.1
1.9
1.7
1.5
V = 2.5VGS
V = 4.5VGS
1.3
1.1
AIN-S
0.9
, D
0.7
DS(ON)
0.5 0 0.1 0.2 0.3 0.4 0.5
I , DRAIN-SOURCE CURRENT (A)D
Figure 3 Typical On-Resistance vs.
Drain Current and Gate Voltage
2.4
2.0
E
V=V
4
GS
I = 200mA
D
1.6
AIN-S
1.2
, D
DS(ON)
0.8
ON-RESISTANCE (NORMALIZED)
V= 1.5V
GS
V = 10VGS
V=.5V
2
GS
I = 100mA
D
(A)
0.3
EN
GS
T = 150°C
A
T = 125°C
A
1.5 2.0 2.500.51.0
T = 85°C
A
T = 25°C
A
T = -55°C
A
0.2
AIN
D
I, D
0.1
0
V , GATE-SOURCE VOLTAGE (V)
Figure 2 Typical Transfer Characteristics
3.0
Ω
V= 4.5V
GS
T = 150°C
A
2.5
T = 125°C
ESISTANCE ( )
2.0
1.5
CE
1.0
A
T = 85°C
A
T = 25°C
A
AIN-S
T = -55°C
, D
0.5
DS(ON)
0
0 0.1 0.2 0.3 0.4 0.5
I , DRAIN CURRENT (A)
D
A
Figure 4 Typical On-Resistance vs.
Drain Current and Temperature
3.0
Ω
E ( )
2.5
A
2.0
ESIS
-
1.5
V=.5V
2
GS
I = 100mA
D
V=V
GS
I = 200mA
D
4
1.0
, D
0.5
DS(ON)
0.4
-50 -25 0 25 50 75 100 125 150 T , JUNCTION TEMPERATURE ( C)
J
°
Figure 5 On-Resistance Variation with Temperature
0
-50 -25 0 25 50 75 100 125 150 T , JUNCTION TEMPERATURE ( C)
J
°
Figure 6 On-Resistance Variation with Temperature
DMN62D0LFD
Document number: DS36359 Rev. 2 - 2
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May 2014
© Diodes Incorporated
GATE THRESH
O
OLTAG
2
OUR
CE CUR
REN
T
C
CTION C
C
C
GATE THRESH
O
OLTAG
DMN62D0LFD
1.
0.5
NEW PRODUCT
NEW PRODUCT
E (V)
1.0
LD V
0.8
I = 250µA
D
I= 1mA
D
0.6
GS(th)
V,
0.4
-50 -25 0 25 50 75 100 125 150 T , JUNCTION TEMPERATURE ( C)
J
°
Figure 7 Gate Threshold Variation vs. Ambient Temperature
100
C
E (pF)
iss
ITAN
APA
10
0.4
(A)
0.3
T= 25°C
A
0.2
S
I, S
0.1
0
0 0.3 0.6 0.9 1.2 1.5
V , SOURCE-DRAIN VOLTAGE (V)
SD
Figure 8 Diode Forward Voltage vs. Current
10
8
E (V)
V = 10V
6
LD V
DS
I= A
250m
D
4
C
oss
, JUN
T
f = 1MHz
1
0 10203040
V , DRAIN-SOURCE VOLTAGE (V)
DS
C
rss
Figure 9 Typical Junction Capacitance
1
D = 0.9 D = 0.7
D = 0.5
D = 0.3
0.1
D = 0.1
D = 0.05
D = 0.02
0.01
D = 0.01
D = 0.005
r(t), TRANSIENT THERMAL RESISTANCE
D = Single Pulse
2
GS
V
0
0 0.2 0.4 0.6 0.8 1.0 1.2
Q(nC)
, TOTAL GATE CHARGE
g
Figure 10 Gate Charge
R (t) = r(t) * R
θθ
JA JA
R = 256°C/W
θ
JA
Duty Cycle, D = t1/ t2
0.001
0.000001
0.00001 0.0 001 0.0 01 0.0 1 0.1 1 10 100 1,0 00
t1, PULSE DURATION TIME (sec)
Figure 11 Transient The rmal Res istanc e
DMN62D0LFD
Document number: DS36359 Rev. 2 - 2
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NEW PRODUCT
Package Outline Dimensions
Please see AP02002 at http://www.diodes.com/datasheets/ap02002.pdf for latest version.
A
A
1
A
3
Seating Plane
L
D e
b
1
E
L
1
D
2
E
2
b
NEW PRODUCT
Suggested Pad Layout
Please see AP02001 at http://www.diodes.com/datasheets/ap02001.pdf for latest version.
Y
1
G
X
2
X
1
Y
2
X
Y
C
DMN62D0LFD
U-DFN1212-3
Type C
Dim Min Max Typ
A 0.47 0.53 0.50 A1 0 0.05 0.02 A3 - - 0.13
b 0.27 0.37 0.32
b1 0.17 0.27 0.22
D 1.15 1.25 1.20 D2 0.75 0.95 0.85
e - - 0.80
E 1.15 1.25 1.20
E2 0.40 0.60 0.50
L 0.25 0.35 0.30
L1 0.65 0.75 0.70
All Dimensions in mm
U-DFN1212-3
Type C
Dimensions Value
C 0.800 G 0.200
X 0.320 X1 0.520 X2 1.050
Y 0.450 Y1 0.250 Y2 0.850
All Dimensions in mm
DMN62D0LFD
Document number: DS36359 Rev. 2 - 2
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© Diodes Incorporated
NEW PRODUCT
DMN62D0LFD
DIODES INCORPORATED MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARDS TO THIS DOCUMENT, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION).
Diodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes without further notice to this document and any product described herein. Diodes Incorporated does not assume any liability arising out of the application or use of this document or any product described herein; neither does Diodes Incorporated convey any license under its patent or trademark rights, nor the rights of others. Any Customer or user of this document or products described herein in such applications shall assume all risks of such use and will agree to hold Diodes Incorporated and all the companies whose products are represented on Diodes Incorporated website, harmless against all damages.
Diodes Incorporated does not warrant or accept any liability whatsoever in respect of any products purchased through unauthorized sales channel. Should Customers purchase or use Diodes Incorporated products for any unintended or unauthorized application, Customers shall indemnify and hold Diodes Incorporated and its representatives harmless against all claims, damages, expenses, and attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized application.
Products described herein may be covered by one or more United States, international or foreign patents pending. Product names and markings noted herein may also be covered by one or more United States, international or foreign trademarks.
This document is written in English but may be translated into multiple languages for reference. Only the English version of this document is the final and determinative format released by Diodes Incorporated.
NEW PRODUCT
Diodes Incorporated products are specifically not authorized for use as critical components in life support devices or systems without the express
written approval of the Chief Executive Officer of Diodes Incorporated. As used herein:
A. Life support devices or systems are devices or systems which:
1. are intended to implant into the body, or
labeling can be reasonably expected to result in significant injury to the user.
B. A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or to affect its safety or effectiveness.
Customers represent that they have all necessary expertise in the safety and regulatory ramifications of their life support devices or systems, and acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any use of Diodes Incorporated products in such safety-critical, life support devices or systems, notwithstanding any devices- or systems-related information or support that may be provided by Diodes Incorporated. Further, Customers must fully indemnify Diodes Incorporated and its representatives against any damages arising out of the use of Diodes Incorporated products in such safety-critical, life support devices or systems.
Copyright © 2014, Diodes Incorporated
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2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the
IMPORTANT NOTICE
LIFE SUPPORT
DMN62D0LFD
Document number: DS36359 Rev. 2 - 2
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