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Features
• Dual N-Channel MOSFET
• Low On-Resistance
• 100mΩ @V
• 140mΩ @V
• 215mΩ @V
= 4.5V, ID = 2.5A
GS
= 2.5V, ID = 1.5A
GS
= 1.8V, ID = 1A
GS
• Very Low Gate Threshold Voltage
• Low Input Capacitance
• Fast Switching Speed
• ESD Protected Gate to 2kV HBM
• Lead Free By Design/RoHS Compliant (Note 2)
• "Green" Device (Note 3)
• Qualified to AEC-Q101 Standards for High Reliability
NEW PRODUCT
ESD PROTECTED TO 2kV
DMN2215UDM
DUAL N-CHANNEL ENHANCEMENT MODE FIELD EFFECT TRANSISTOR
Mechanical Data
• Case: SOT-26
• Case Material: Molded Plastic, “Green” Molding Compound.
UL Flammability Classification Rating 94V-0
• Moisture Sensitivity: Level 1 per J-STD-020D
• Terminal Connections: See Diagram
• Terminals: Finish ⎯ Matte Tin annealed over Copper
leadframe. Solderable per MIL-STD-202, Method 208
• Marking Information: See Page 4
• Ordering Information: See Page 4
• Weight: 0.015 grams (approximate)
D
1
S
1
D
2
TOP VIEW
SOT-26
G
1
S
2
G
2
Schematic and Pin Configuration
TOP VIEW
Maximum Ratings @T
= 25°C unless otherwise specified
A
Characteristic Symbol Value Units
Drain-Source Voltage
Gate-Source Voltage
Drain Current (Note 1)
T
Pulsed Drain Current ( Note 4)
Thermal Characteristics @T
= 25°C unless otherwise specified
A
Characteristic Symbol Value Units
Total Power Dissipation (Note 1)
Thermal Resistance, Junction to Ambient
Operating and Storage Temperature Range
Notes: 1. Device mounted on FR-4 PCB, or minimum recommended pad layout
4. Pulse width ≤ 10μs, duty cycle ≤ 1%.
2. No purposefully added lead.
3. Diodes Inc.’s “Green” policy can be found on our website at http://www.diodes.com/products/lead_free/index.php.
DMN2215UDM
Document number: DS31176 Rev. 4 - 2
T
= 25°C
A
= 85°C
A
V
DSS
V
GSS
I
D
I
DM
PD
R
JA
θ
TJ, T
STG
1 of 4
www.diodes.com
20 V
±12 V
2.0
1.4
A
7.0 A
650 mW
192 °C/W
-55 to +150 °C
© Diodes Incorporated
June 2008
Electrical Characteristics @T
= 25°C unless otherwise specified
A
Characteristic Symbol Min Typ Max Unit Test Condition
OFF CHARACTERISTICS (Note 5)
Drain-Source Breakdown Voltage
Zero Gate Voltage Drain Current
Gate-Source Leakage
ON CHARACTERISTICS (Note 5)
Gate Threshold Voltage
Static Drain-Source On-Resistance
Forward Transfer Admittance
Diode Forward Voltage (Note 5)
DYNAMIC CHARACTERISTICS
Input Capacitance
Output Capacitance
NEW PRODUCT
Reverse Transfer Capacitance
Turn-On Delay Time
Rise Time
Turn-Off Delay Time
Fall Time
Notes: 5. Short duration pulse test used to minimize self-heating effect.
10
BV
IDSS
IGSS
V
GS(th)
R
DS (ON)
|Y
V
C
C
C
t
d(on)
t
d(off)
DSS
fs
SD
iss
oss
rss
t
r
t
t
|
⎯
20
⎯ ⎯
⎯ ⎯
⎯ ⎯
0.6
⎯
80
105
165
5
⎯
0.73 1.1 V
⎯
188
⎯
44
⎯
30
⎯
8
⎯
3.8
⎯
19.6
⎯
8.3
⎯
8
V
1
μA
±10 μA
1.0 V
100
140
mΩ
215
S
⎯
pF
⎯
pF
⎯
pF
⎯
⎯
⎯
ns
⎯
⎯
DMN2215UDM
VGS = 0V, ID = 10μA
VDS = 20V, VGS = 0V
V
= ±12V, VDS = 0V
GS
VDS = VCS, ID = 250μA
VGS = 4.5V, ID = 2.5A
VGS = 2.5V, ID = 1.5A
V
= 1.8V, ID = 1.0A
GS
VDS =5V, ID = 2.4A
VGS = 0V, IS = 1.05A
V
= 10V, VGS = 0V
DS
f = 1.0MHz
= 10V, RL = 10Ω
V
DD
I
= 1A, V
D
= 4.5V, RG = 6Ω
GEN
8
6
4
2
0
DMN2215UDM
Document number: DS31176 Rev. 4 - 2
2 of 4
www.diodes.com
7
6
5
4
3
2
1
0
0 0.5 1 1.5 2 2.5 3 3.5 4
© Diodes Incorporated
June 2008