Diodes DMN2065UW User Manual

Page 1
Product Summary
I
max
D
V
R
(BR)DSS
56m @ V
20V
65m @ VGS = 2.5V 93m @ VGS = 1.8V
140m @ VGS = 1.5V
DS(ON)
max
= 4.5V
GS
TA = 25°C
2.8A
2.6A
2.2A
1.8A
Description and Applications
This MOSFET has been designed to minimize the on-state resistance
) and yet maintain superior switching performance, making it
(R
DS(on)
ideal for high efficiency power management applications.
General Purpose Interfacing Switch
Power Management Functions
DC-DC Converters
Analog Switch
SOT323
Top View
Gate
Equivalent Circuit Top View
DMN2065UW
20V N-CHANNEL ENHANCEMENT MODE MOSFET
Features and Benefits
Low On-Resistance
Low Input Capacitance
Fast Switching Speed
Lead Free By Design/RoHS Compliant (Note 1)
"Green" Device (Note 2)
Qualified to AEC-Q101 standards for High Reliability
Mechanical Data
Case: SOT323
Case Material: Molded Plastic, "Green" Molding Compound.
UL Flammability Classification Rating 94V-0
Moisture Sensitivity: Level 1 per J-STD-020
Terminal Connections Indicator: See diagram
Terminals: Finish Matte Tin annealed over Alloy42 leadframe.
Solderable per MIL-STD-202, Method 208
Weight: 0.027 grams (approximate)
Drain
D
G
Source
S
Ordering Information (Note 3)
Part Number Case Packaging
DMN2065UW-7 SOT323 3000/Tape & Reel
Notes: 1. No purposefully added lead.
2. Diodes Inc.’s “Green” policy can be found on our website at http://www.diodes.com.
3. For packaging details, go to our website at http://www.diodes.com.
Marking Information
Date Code Key
Year 2011 2012 2013 2014 2015 2016 2017
Code Y Z A B C D E
Month Jan Feb Mar Apr May Jun Jul Aug Sep Oct Nov Dec
Code 1 2 3 4 5 6 7 8 9 O N D
DMN2065UW
Document number: DS35554 Rev. 1 – 2
DMH
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DMH = Product Type Marking Code YM = Date Code Marking
YM
Y = Year (ex: Y = 2011) M = Month (ex: 9 = September)
1 of 6
October 2011
© Diodes Incorporated
Page 2
)
g
g
g
)
r
)
Maximum Ratings @T
= 25°C unless otherwise specified
A
Characteristic Symbol Value Units
Drain-Source Voltage Gate-Source Voltage
Continuous Drain Current (Note 5) VGS = 4.5V
Continuous Drain Current (Note 5) VGS = 1.8V
Pulsed Drain Current (10us pulse, duty cycle=1%) Maximum Body Diode Forward Current (Note 4)
Thermal Characteristics @T
= 25°C unless otherwise specified
A
Characteristic Symbol Value Units
Total Power Dissipation (Note 4) Thermal Resistance, Junction to Ambient (Note 4) Total Power Dissipation (Note 5) Thermal Resistance, Junction to Ambient (Note 5) Operating and Storage Temperature Range
Steady
State
t<10s
Steady
State
t<10s
DMN2065UW
V
DSS
V
GSS
T
= 25°C
A
T
= 70°C
A
= 25°C
T
A
= 70°C
T
A
T
= 25°C
A
T
= 70°C
A
= 25°C
T
A
= 70°C
T
A
Steady state
t<10s 252 °C/W
Steady state
t<10s 151 °C/W
I
I
I
I
I
DM
I
D
D
D
D
S
R
R
T
J, TSTG
P
D
JA
θ
P
D
JA
θ
20 V
±12 V
2.8
2.3
3.1
2.6
2.2
1.7
2.4
1.9
A
A
A
A
30 A
1.2 A
0.43 W 296 °C/W
0.7 W
178 °C/W
-55 to +150 °C
Electrical Characteristics @T
= 25°C unless otherwise specified
A
Characteristic Symbol Min Typ Max Unit Test Condition
OFF CHARACTERISTICS (Note 6)
Drain-Source Breakdown Voltage Zero Gate Voltage Drain Current @Tc = 25°C I Gate-Source Leakage
BV
I
DSS DSS GSS
20 - - V
- - 1 A
- - ±1 A
VGS = 0V, ID = 1mA VDS = 20V, VGS = 0V
VGS = ±10V, VDS = 0V ON CHARACTERISTICS (Note 6) Gate Threshold Voltage
Static Drain-Source On-Resistance
Forward Transfer Admittance Diode Forward Voltage
V
GS(th
R
DS (ON)
|Y V
fs
SD
0.35 - 1.0 V
- 52 56
- 59 65
- 60 93
- 75 140
|
- 7 - S
- 0.7 1.0 V
VDS = VGS, ID = 250A
= 4.5V, ID = 2A
V
GS
V
= 2.5V, ID = 2A
mΩ
GS
= 1.8V, ID = 1A
V
GS
= 1.5V, ID = 0.5A
V
GS
VDS = 5V, ID = 3.8A
VGS = 0V, IS = 1A DYNAMIC CHARACTERISTICS (Note 7) Input Capacitance Output Capacitance Reverse Transfer Capacitance Total Gate Charge Gate-Source Charge Gate-Drain Charge Turn-On Delay Time Turn-On Rise Time Turn-Off Delay Time Turn-Off Fall Time
Notes: 4. Device mounted on FR-4 substrate PC board, with minimum recommended pad layout.
5. Device mounted on FR-4 substrate PC board, 2oz copper, with thermal bias to bottom layer 1inch square copper plate.
6. Short duration pulse test used to minimize self-heating effect.
7. Guaranteed by design. Not subject to product testing.
C C
t
t
C
oss rss
Q Q Q
D(on
t
D(off
t
iss
s d
f
- 400.0 - pF
- 73.8 - pF
- 65.6 - pF
- 5.4 - nC
- 0.7 - nC
- 1.4 - nC
- 3.5 - ns
- 9.7 - ns
- 23.8 - ns
- 7.2 - ns
V
= 10V, VGS = 0V,
DS
f = 1.0MHz V
= 4.5V, VDS = 10V,
GS
I
= 6A
D
V
= 10V, VGS = 5V,
DD
= 1.7, RG = 6,
R
L
DMN2065UW
Document number: DS35554 Rev. 1 – 2
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October 2011
© Diodes Incorporated
Page 3
R
C
URRENT
R
C
U
R
R
T
R,DR
OUR
CE ON-R
TANC
R
R
OUR
ON-R
R
RAIN
OUR
C
R
R
OUR
CE ON-R
C
DMN2065UW
10
(A)
AIN
D
I, D
8
6
4
V = 8.0VGS
V = 4.5VGS
V = 3.0VGS
V = 2.5VGS
V = 2.0VGS
V = 1.5VGS
2
V = 1.2VGS
0
0 0.5 1.0 1.5 2.0 2.5 3.0
V , DRAIN -SOURCE VOLTAGE( V )
DS
Fig. 1 Typical Output Ch ar acteristics
0.14
Ω
E( )
0.12
5
V = 5.0VDS
4
(A) EN
3
2
AIN
T = 150 C
°
D
I, D
1
0
0 0.5 1.0 1.5 2.0
A
T = 125 C
°
A
V , GATE-SOURCE VOLTAGE (V)
GS
T = 85C
A
T = 25C
A
T = -55C
°
A
°
Fig. 2 T ypical Transfer Characteristics
0.08
Ω
0.07
V= 4.5V
GS
°
0.10
ESIS
0.08
0.06
0.04
AIN-S
ESISTANCE( )
CE
AIN-S
0.06
0.05
0.04
0.03
0.02
T = 150C
A
T = 125C
A
T = 85C
°
A
T = 25C
°
A
T = -55C
°
A
°
°
, D
0.02
DS(ON)
0
12345678
I , DRAIN SOURCE CURRENT (A)
D
Fig. 3 Typical On-Resistance vs.
Drain Curr ent and Gate V ol tage
1.8
0.01
DS(ON)
0
012 345
I , DRAIN SOURCE CURRENT (A)
D
Fig. 4 Typical On-Resistance vs.
Drain Curr ent and Temperature
0.08
Ω
E ( )
0.07
1.6
ESISTAN
AIN-S , D
0.06
0.05
0.04
0.03
0.02
V=.5V
2
GS
I=A
5
D
V= 4.5V
GS
I= A
10
D
E
-S
, D
1.4
1.2
1.0
DS(ON)
ON-RESISTA NCE (Normalized)
0.8
0.01
0.6
-50 -25 0 25 50 75 100 125 150 T , JUNCTION TEMPERATURE ( C)
J
°
Fig. 5 On- Resistance Variation with Temperatur e
DS(ON)
0
-50 -25 0 25 50 75 100 125 150 T , JUNCTION TEMPERATURE ( C)
J
Fig. 6 On-Resistance Variation with Temperature
°
DMN2065UW
Document number: DS35554 Rev. 1 – 2
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Page 4
GATE THRESH
O
OLT
G
OUR
CE CUR
RENT
C
UNC
TIO
N CAPACITAN
C
F
GE CUR
RENT
GAT
OUR
C
OLT
G
R
CUR
RENT
DMN2065UW
1.4
1.2
E(V) A
1.0
LD V
0.8
0.6
0.4
0.2
GS(TH)
V,
0
-50 -25 0 25 50 75 100 125 150 T , AMBIENT TEMPERATURE (°C)
A
Fig. 7 Gate Threshold Variation vs. Ambient Temperature
1,000
5
4
(A)
3
2
S
I, S
1
0
0 0.2 0.4 0.6 0.8 1.0 1.2
V , SOURCE-DRAIN VOLTAGE (V)
SD
Fig. 8 Dio de Forward Voltage vs . Cur r ent
100
T =150°C
A
)
C
E (p
iss
10
(nA)
T =125°C
A
1
T =85°C
100
C
oss
A
0.1
C
rss
0.01
, J
T
f = 1MHz
10
048121620
V , DRAIN-SOURCE VOLTAGE (V)
DS
Fig. 9 Typical Junction Ca pacitance
10
f = 1MHz
9 8
E (V) A
7 6
E V
5 4
E-S
3 2
GS
V,
1 0
0 3 6 9 12 15
Q , TOT AL GATE CHARGE (nC)
g
Fig. 11 Gate-Charge Characte r istics
DSS
I , LEAKA
0.001 0246 8101214161820
V , DRAIN-SOURCE VOLTAGE(V)
DS
T = 25°C
A
T = -55°C
A
Fig. 10 Typical Drain-Source Leakage Current vs. Voltage
100
R
DS(on)
Limited
10
(A)
DC
1
P = 10s
W
P = 1s
AIN
D
I, D
0.01
0.1
W
P = 100ms
W
P = 10ms
W
P = 1ms
W
P = 100µs
W
P = 10µs
W
0.1 1 10 100
V , DRAIN-SOURCE VOLT AGE (V)
DS
Fig. 12 SOA, Safe Operation Area
DMN2065UW
Document number: DS35554 Rev. 1 – 2
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Page 5
T
R
T T
HER
R
TANC
1
D = 0.7
E
D = 0.5 D = 0.3
ESIS
0.1
D = 0.1
MAL
D = 0.05
D = 0.02
0.01
D = 0.01
ANSIEN
D = 0.005
r(t),
Single Pulse
0.001
0.00001 0.0001 0.001 0.01 0.1 1 10 100 1,000
Package Outline Dimensions
A
G H
K
J
D
Suggested Pad Layout
DMN2065UW
D = 0.9
R (t) = r(t) * R
θθ
JA JA
R = 300°C/W
θ
JA
Duty Cycle, D = t1/ t2
t1, PULSE DURATION TIMES (sec)
Fig. 13 Transient Therm al Resist ance
C
B
A 0.25 0.40 0.30 B 1.15 1.35 1.30 C 2.00 2.20 2.10 D - - 0.65 G 1.20 1.40 1.30 H 1.80 2.20 2.15
Dim Min Max Typ
M
J 0.0 0.10 0.05 K 0.90 1.00 1.00 L 0.25 0.40 0.30
L
M 0.10 0.18 0.11
α
SOT323
0° 8° -
All Dimensions in mm
Y
Z
C
Dimensions Value (in mm)
Z 2.8 X 0.7 Y 0.9 C 1.9 E 1.0
X
DMN2065UW
Document number: DS35554 Rev. 1 – 2
E
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IMPORTANT NOTICE
DIODES INCORPORATED MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARDS TO THIS DOCUMENT, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION).
Diodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes without further notice to this document and any product described herein. Diodes Incorporated does not assume any liability arising out of the application or use of this document or any product described herein; neither does Diodes Incorporated convey any license under its patent or trademark rights, nor the rights of others. Any Customer or user of this document o r products described herein in such applica tions shall assume all risks of such use and will agree to hold Diodes Incorporated and all the companies whose products are represented on Diodes Incorporated website, harmless against all damages.
Diodes Incorporated does not warrant or accept any liability whatsoever in respect of any products purchased through unauthorized sales channel. Should Customers purchase or use Diodes Incorporated products for any unintended or unauthorize d application, Customers shall indemnify and hold Diodes Incorporated and its representatives harmless against all claims, damages, expenses, and attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized application.
Products described herein may be covered by one or more United States, international or foreign patents pending. Product names and markings noted herein may also be covered by one or more United States, international or foreign trademarks.
LIFE SUPPORT
Diodes Incorporated products are specifically not authorized for use as critical components in life support devices or systems without the express written approval of the Chief Executive Officer of Diodes Incorporated. As used herein:
A. Life support devices or systems are devices or systems which:
1. are intended to implant into the body, or
2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the
labeling can be reasonably expected to result in significant injury to the user. B. A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the
failure of the life support device or to affect its safety or effectiveness. Customers represent that they have all necessary expertise in the safety and regulatory ramifications of their life support devices or systems, and
acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any use of Diodes Incorporated products in such safety-critical, life support devices or systems, notwithstanding any devices- or systems-related information or support that may be provided by Diodes Incorporated. Further, Customers must fully indemnify Diodes Incorporated and its representatives against any damages arising out of the use of Diodes Incorporated products in such safety-critical, life support devices or systems.
Copyright © 2011, Diodes Incorporated
www.diodes.com
DMN2065UW
DMN2065UW
Document number: DS35554 Rev. 1 – 2
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