Diodes DMN2050L User Manual

Page 1
Features
Low On-Resistance
29m @V
50m @V
100m @V
Very Low Gate Threshold Voltage
Low Input Capacitance
Fast Switching Speed
Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2)
Halogen and Antimony Free. “Green” Device (Note 3)
Qualified to AEC-Q101 Standards for High Reliability
= 4.5V
GS
= 2.5V
GS
GS
= 2.0V
Top View
DMN2050L
N-CHANNEL ENHANCEMENT MODE MOSFET
Mechanical Data
Case: SOT23
Case Material: Molded Plastic, “Green” Molding Compound.
UL Flammability Classification Rating 94V-0
Moisture Sensitivity: Level 1 per J-STD-020D
Terminal Connections: See Diagram
Terminals: Finish Matte Tin annealed over Copper
leadframe. Solderable per MIL-STD-202, Method 208
Weight: 0.008 grams (approximate)
SOT23
Drain
Gate
Source
Equivalent Circuit
G
D
Top View
S
e3
Ordering Information (Note 4)
Part Number Case Packaging
DMN2050L-7 SOT23 3000/Tape & Reel
Notes: 1. No purposely added lead. Fully EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant.
2. See http://www.diodes.com/quality/lead_free.html for more information about Diodes Incorporated’s definitions of Halogen- and Antimony-free, "Green" and Lead-free.
3. Halogen- and Antimony-free "Green” products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and <1000ppm antimony compounds.
4. For packaging details, go to our website at http://www.diodes.com/products/packages.html.
Marking Information
Date Code Key
Year 2008 2009 2010 2011 2012 2013 2014 2015
Code V W X Y Z A B C
Month Jan Feb Mar Apr May Jun Jul Aug Sep Oct Nov Dec
Code 1 2 3 4 5 6 7 8 9 O N D
MN3
Chengdu A/T Site
DMN2050L
Document number: DS31502 Rev. 4 - 2
YM
MN3
Shanghai A/T Site
MN3 = Marking Code YM = Date Code Marking for SAT (Shanghai Assembly/ Test site)
YM
= Date Code Marking for CAT (Chengdu Assembly/ Test site)
YM
Y or = Year (ex: A = 2013)
Y
M = Month (ex: 9 = September)
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October 2013
© Diodes Incorporated
Page 2
Maximum Ratings (@T
= +25°C, unless otherwise specified.)
A
Characteristic Symbol Value Units
Drain-Source Voltage
Gate-Source Voltage
Drain Current (Note 5)
Pulsed Drain Current (Note 6)
Thermal Characteristics
Characteristic Symbol Value Units
Total Power Dissipation (Note 5)
Thermal Resistance, Junction to Ambient (Note 5)
Operating and Storage Temperature Range
Electrical Characteristics (@T
= +25°C, unless otherwise specified.)
A
Characteristic Symbol Min Typ Max Unit Test Condition
OFF CHARACTERISTICS (Note 7)
Drain-Source Breakdown Voltage
Zero Gate Voltage Drain Current
Gate-Source Leakage
ON CHARACTERISTICS (Note 7)
Gate Threshold Voltage
Static Drain-Source On-Resistance
Forward Transfer Admittance
Diode Forward Voltage (Note 7)
DYNAMIC CHARACTERISTICS (Note 8)
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
Gate Resistance
SWITCHING CHARACTERISTICS (Note 8)
Total Gate Charge
Gate-Source Charge
Gate-Drain Charge
Notes: 5. Device mounted on FR-4 PCB, on 2oz Copper pad layout with R
6. Repetitive rating, pulse width limited by junction temperature.
7. Short duration pulse test used to minimize self-heating effect.
8. Guaranteed by design. Not subject to production testing.
DMN2050L
Document number: DS31502 Rev. 4 - 2
BV
DSS
I
DSS
I
GSS
|
fs
G

g
gs
0.45
V
R
DS(ON)
|Y
V
C
C
GS(th)
SD
C
iss
oss
rss
R
Q
Q
Q
gd
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20



= 90°C/W.
θJA
2 of 6
V
DSS
V
GSS
I
D
I
DM
PD
R
θJA
TJ, T
STG
-55 to +150 °C
V
1 µA
nA
m
S
24 42 68
8
100
1.4 V
29 50
100
0.9 1.4 V
532
144
117
1.3
6.7
0.8
3.0




pF
pF
pF
nC
DMN2050L
20 V
±12 V
5.9 A
21 A
1.4 W
90 °C/W
VGS = 0V, ID = 250µA
VDS = 20V, VGS = 0V
VGS = 12V, VDS = 0V
VDS = VGS, ID = 250µA
V
= 4.5V, ID = 5.0A
GS
VGS = 2.5V, ID = 3.1A
VGS = 2.0V, ID = 1.5A
VDS =5V, ID = 2.1A
VGS = 0V, IS = 2.0A
= 10V, VGS = 0V
V
DS
f = 1.0MHz
VDS = 0V, VGS = 0V, f = 1.0MHz
VDS = 10V, VGS = 4.5V, ID = 5.0A
VDS = 10V, VGS = 4.5V, ID = 5.0A
VDS = 10V, VGS = 4.5V, ID = 5.0A
October 2013
© Diodes Incorporated
Page 3
R
CUR
R
T
RAIN CUR
REN
T
R
RAIN-SOUR
CE O
N-R
TAN
C
R
RAIN-SO
U
R
C
T = 85°C
A
A
DMN2050L
20
V = 10V
GS
16
V = 4.5V
GS
V = 3.0V
GS
V = 2.5V
GS
(A)
12
EN
V = 2.0V
AIN
D
I, D
8
GS
4
V = 1.5V
0
0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 5
V , DRAIN-SOURCE VOLTAGE (V)
DS
GS
Fig. 1 Typical Output Characteristic
20
V = 5V
DS
16
(A)
12
8
D
I, D
4
0
0 0.5 1 1.5 2 2.5 3
V , GATE-SOURCE VOLTAGE (V) Fig. 2 Typical Transfer Characteristic
GS
T = 150°C
A
T = 125°C
A
T = 25°C
T = -55°C
A
0.08
0.07
0.06
0.05
V = 2.5V
GS
0.04
V = 4.5V
0.03
0.02
GS
V = 10V
GS
0.01
DS(ON)
0
R , DRAIN-SOURCE ON-RESISTANCE (m )
04 8121620
I , DRAIN-SOURCE CURRENT (A)
D
Fig. 3 Typical On-Resistance
vs. Drain Current and Gate Voltage
1.6
0.06
E ( )
ESIS
0.04
0.02
V = 4.5V
GS
T = 150°C
A
T = 125°C
A
T = 85°C
A
T = 25°C
A
T = -55°C
A
, D
DS(ON)
0
048121620
I , DRAIN CURRENT (A)
D
Fig. 4 Typical On-Resistance
vs. Drain Current and Temperature
1.6
1.4
1.2
1.0
0.8
0.6
I = 250µA
D
I = 1mA
D
E
, D
V = 10V
1.4
1.2
GS
I = 10A
D
V = 4.5V
GS
I = 5A
D
1.0
DSON
0.4
0.8
ON-RESISTANCE (NORMALIZED)
0.6
-50 -25 0 25 50 75 100 125 150
T , AMBIENT TEMPERATURE (°C)
A
Fig. 5 On-Resistance Variation with Temperature
DMN2050L
Document number: DS31502 Rev. 4 - 2
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0.2
GS(TH)
V , GATE THRESHOLD VOLTAGE (V)
0
-50 -25 0 25 50 75 100 125 150 T , AMBIENT TEMPERATURE (°C)
A
Fig. 6 Gate Threshold Variation vs. Ambient Temperature
© Diodes Incorporated
October 2013
Page 4
OUR
CE CUR
RENT
C, CAPACIT
C
F
T
R
T T
HER
R
TANC
DMN2050L
20
T = 25°C
A
16
(A)
12
1,000
)
E (p
AN
100
C
iss
C
oss
C
rss
8
S
I, S
4
0
0 0.2 0.4 0.6 0.8 1 1.2
V , SOURCE-DRAIN VOLTAGE (V)
SD
Fig. 7 Diode Forward Voltage vs. Current
10
0 5 10 15 20
V , DRAIN-SOURCE VOLTAGE (V)
DS
Fig. 8 Typical Total Capacitance
1
E
D = 0.7
D = 0.5
D = 0.3
ESIS
0.1
MAL
D = 0.1
D = 0.9
D = 0.05
R (t) = r(t) * R

JA JA
R = 88°C/W
JA
P(pk)
t
1
t
2
T - T = P * R (t)
JA JA12
Duty Cycle, D = t /t
ANSIEN
r(t),
0.01
D = 0.02
D = 0.01
D = 0.005
D = Single Pulse
0.001
0.00001 0.0001 0.001 0.01 0.1 1 10 100 1,000
t , PULSE DURATION TIME (s)
1
Fig. 9 Transient Thermal Response
DMN2050L
Document number: DS31502 Rev. 4 - 2
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October 2013
© Diodes Incorporated
Page 5
Package Outline Dimensions
Please see AP02002 at http://www.diodes.com/datasheets/ap02002.pdf for latest version.
K
J
A
C
B
H
K1
F
D
G
L
M
Suggested Pad Layout
Please see AP02001 at http://www.diodes.com/datasheets/ap02001.pdf for latest version.
DMN2050L
Document number: DS31502 Rev. 4 - 2
Y
Z
X
E
C
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Dim Min Max Typ
A 0.37 0.51 0.40 B 1.20 1.40 1.30 C 2.30 2.50 2.40 D 0.89 1.03 0.915 F 0.45 0.60 0.535 G 1.78 2.05 1.83 H 2.80 3.00 2.90 J 0.013 0.10 0.05 K 0.903 1.10 1.00
K1 - - 0.400
L 0.45 0.61 0.55 M 0.085 0.18 0.11

Dimensions Value (in mm)
Z 2.9 X 0.8 Y 0.9 C 2.0 E 1.35
SOT23
0° 8° -
All Dimensions in mm
DMN2050L
October 2013
© Diodes Incorporated
Page 6
DIODES INCORPORATED MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARDS TO THIS DOCUMENT, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION).
Diodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes without further notice to this document and any product described herein. Diodes Incorporated does not assume any liability arising out of the application or use of this document or any product described herein; neither does Diodes Incorporated convey any license under its patent or trademark rights, nor the rights of others. Any Customer or user of this document or products described herein in such applications shall assume all risks of such use and will agree to hold Diodes Incorporated and all the companies whose products are represented on Diodes Incorporated website, harmless against all damages.
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indirectly, any claim of personal injury or death associated with such unintended or unauthorized application.
Products described herein may be covered by one or more United States, international or foreign patents pending. Product names and markings noted herein may also be covered by one or more United States, international or foreign trademarks.
This document is written in English but may be translated into multiple languages for reference. Only the English version of this document is the final and determinative format released by Diodes Incorporated.
Diodes Incorporated products are specifically not authorized for use as critical components in life support devices or systems without the express written approval of the Chief Executive Officer of Diodes Incorporated. As used herein:
A. Life support devices or systems are devices or systems which:
1. are intended to implant into the body, or
labeling can be reasonably expected to result in significant injury to the user.
B. A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or to affect its safety or effectiveness.
Customers represent that they have all necessary expertise in the safety and regulatory ramifications of their life support devices or systems, and acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any use of Diodes Incorporated products in such safety-critical, life support devices or systems, notwithstanding any devices- or systems-related information or support that may be provided by Diodes Incorporated. Further, Customers must fully indemnify Diodes Incorporated and its representatives against any damages arising out of the use of Diodes Incorporated products in such safety-critical, life support devices or systems.
Copyright © 2013, Diodes Incorporated
www.diodes.com
2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the
IMPORTANT NOTICE
LIFE SUPPORT
DMN2050L
DMN2050L
Document number: DS31502 Rev. 4 - 2
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