Diodes DMN2041LSD User Manual

Page 1
4
8
5
Y
W
485
Y
Product Summary
V
R
(BR)DSS
28mΩ @ V
20V
41mΩ @ VGS = 2.5V
DS(ON)
max
= 4.5V
GS
TA = +25°C
Description
This MOSFET has been designed to minimize the on-state resistance
) and yet maintain superior switching performance, making it
(R
DS(on)
ideal for high efficiency power management applications.
Applications
Power Management Functions  DC-DC Converters
TOP VIEW
S1
G1
S2
G2
I
max
D
7.63A
4.35A
TOP VIEW
Internal Schematic
DMN2041LSD
DUAL N-CHANNEL ENHANCEMENT MODE MOSFET
Features
 Low On-Resistance  Low Gate Threshold Voltage  Low Input Capacitance  Fast Switching Speed  Low Input/Output Leakage
Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2)
Halogen and Antimony Free. “Green” Device (Note 3)
Qualified to AEC-Q101 Standards for High Reliability
Mechanical Data
Case: SO-8 Case Material: Molded Plastic, “Green” Molding Compound.
UL Flammability Classification Rating 94V-0
Moisture Sensitivity: Level 1 per J-STD-020  Terminals Connections: See Diagram  Terminals: Finish - Matte Tin annealed over Copper lead frame.
Solderable per MIL-STD-202, Method 208
Marking Information: See Page 4  Ordering Information: See Page 4  Weight: 0.072 grams (approximate)
SO-8
D2
S2
D1
D1
D2
D2
D1
G1
S1
N-Channel MOSFET
G2
N-Channel MOSFET
Ordering Information (Note 4)
Part Number Case Packaging
DMN2041LSD-13 SO-8 2,500/Tape & Reel
Notes: 1. No purposely added lead. Fully EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant.
2. See http://www.diodes.com/quality/lead_free.html for more information about Diodes Incorporated’s definitions of Halogen- and Antimony-free, "Green" and Lead-free.
3. Halogen- and Antimony-free "Green” products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and <1000ppm antimony compounds.
4. For packaging details, go to our website at http://www.diodes.com/products/packages.html.
Marking Information
N2041LD
Y WW
1
Chengdu A/T Site
DMN2041LSD
Document number: DS31964 Rev. 3 - 2
N2041LD
Y W
1
Shanghai A/T Site
www.diodes.com
= Manufacturer’s Marking N2041LD = Product Type Marking Code YYWW = Date Code Marking YY or YY = Year (ex: 13 = 2013) WW = Week (01 - 53) YY = Date Code Marking for SAT (Shanghai Assembly/ Test site) YY = Date Code Marking for CAT (Chengdu Assembly/ Test site)
1 of 6
February 2014
© Diodes Incorporated
Page 2
)
g
g
g
g
g
)
r
)
DMN2041LSD
Maximum Ratings (@T
= +25°C, unless otherwise specified.)
A
Characteristic Symbol Value Units
Drain-Source Voltage Gate-Source Voltage
Drain Current (Note 5) Steady State
Pulsed Drain Current (Note 6)
T
= +25°C
A
= +85°C
T
A
V
DSS
V
GSS
I
D
I
DM
20 V
12
7.63
4.92
V
A
30 A
Thermal Characteristics
Characteristic Symbol Value Unit
Total Power Dissipation (Note 5) Thermal Resistance, Junction to Ambient @TA = +25°C R
Operating and Storage Temperature Range
P
T
J, TSTG
θJA
D
Electrical Characteristics (@T
= +25°C, unless otherwise specified.)
A
Characteristic Symbol Min Typ Max Unit Test Condition
OFF CHARACTERISTICS (Note 7)
Drain-Source Breakdown Voltage Zero Gate Voltage Drain Current TJ = +25°C I Gate-Source Leakage
BV
I
DSS
DSS
GSS
20 — — — —
—
— V
1 μA
±100 nA ON CHARACTERISTICS (Note 7) Gate Threshold Voltage
Static Drain-Source On-Resistance
Forward Transfer Admittance Diode Forward Voltage
V
GS(th
R
DS (ON)
|Y V
fs
SD
0.5 — 1.2 V
—
— 6 — S
|
— 0.7 1.2 V
19 28 25 41
DYNAMIC CHARACTERISTICS (Note 8) Input Capacitance Output Capacitance Reverse Transfer Capacitance Gate Resistance Total Gate Charge Total Gate Charge Gate-Source Charge Gate-Drain Charge Turn-On Delay Time Turn-On Rise Time Turn-Off Delay Time Turn-Off Fall Time
Notes: 5. Device mounted on FR-4 PCB with minimum recommended pad layout.
6. Repetitive rating, pulse width limited by function temperature.
7. Short duration pulse test used to minimize self-heating effect.
8. Guaranteed by design. Not subject to production testing.
C C
t
t
C
oss
rss
R Q
Q Q Q
D(on
t
D(off
t
iss
s
d
f
— — — — — — — — — — — —
550
88 81
1.34
15.6
7.2 1
1.9
4.69
13.19
22.1
6.43
— — — — — — — — — — — —
DMN2041LSD
Document number: DS31964 Rev. 3 - 2
2 of 6
www.diodes.com
1.16 W
107.4 °C/W
-55 to +150 °C
VGS = 0V, ID = 250μA VDS = 20V, VGS = 0V VGS = ±12V, VDS = 0V
VDS = VGS, ID = 250μA V
= 4.5V, ID = 6A
mΩ
GS
V
= 2.5V, ID = 5.2A
GS
VDS = 10V, ID = 6A VGS = 0V, IS = 1.7A
=10V, VGS = 0V,
V
pF
Ω
nC
nC
ns
DS
f = 1MHz
VDS = 0V, VGS = 0V, f = 1MHz VGS = 10V, VDS = 10V, ID = 6A
= 4.5 V, VDS = 10V,
V
GS
= 6A
I
D
= 10V, V
V
DD
= 1Ω, ID = 6.7A
R
g
= 4.5V,
GEN
February 2014
© Diodes Incorporated
Page 3
RAIN CUR
R
N
T
R
CUR
RENT
R
R
OUR
CE ON-R
TANC
R
RAIN-SOUR
CE O
N-R
TAN
C
DMN2041LSD
20
16
(A)
12
E
V = 10V
GS
V = 4.5V
GS
V = 3.0V
GS
V = 2.5V
GS
V = 2.0V
GS
8
D
I, D
4
0
0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 5
V , DRAIN-SOURCE VOLTAGE (V)
DS
V = 1.5V
GS
Fig. 1 Typical Output Characteristics
20
V = 5V
16
DS
(A)
12
8
AIN
D
I, D
4
0
T = 150°C
A
T = 125°C
A
T = 85°C
A
T = 25°C
A
T = -55°C
A
0 0.5 1 1.5 2 2.5 3
V , GATE SOURCE VOLTAGE (V)
GS
Fig. 2 Typical Transfer Characteristics
0.06
E ( )
0.05
V = 1.8V
GS
ESIS
0.04
E ( )
ESIS
0.06
0.04
V = 4.5V
GS
0.03
V = 2.5V
GS
0.02
AIN-S
, D
0.01
DS(ON)
0
04 8121620
I , DRAIN-SOURCE CURRENT (A)
D
V = 10V
GS
V = 4.5V
GS
Fig. 3 Typical On-Resistance
vs. Drain Current and Gate Voltage
1.6
1.4
1.2
1.0
V = 4.5V
GS
I = 10A
DS(ON)
R , DRAIN-SOURCE
ON-RESISTANCE (NORMALIZED)
D
0.8
V = 2.5V
GS
I = 5A
D
0.6
-50 -25 0 25 50 75 100 125 150 T , JUNCTION TEMPERATURE (°C)
J
Fig. 5 On-Resistance Variation with Temperature
T = 150°C
A
T = 125°C
A
T = 85°C
0.02
, D
DS(ON)
0
04 8121620
I , DRAIN CURRENT (A)
Fig. 4 Typical Drain-Source On-Resistance
0.08
D
vs. Drain Current and Temperature
A
T = 25°C
A
T = -55°C
A
0.06
0.04
0.02
DS(ON)
R , DRAIN-SOURCE ON-RESISTANCE ( )
0
-50 -25 0 25 50 75 100 125 150 T , JUNCTION TEMPERATURE (°C)
J
Fig. 6 On-Resistance Variat ion with Temperature
V = 2.5V
GS
I = 5A
D
V = 4.5V
GS
I = 10A
D
DMN2041LSD
Document number: DS31964 Rev. 3 - 2
3 of 6
www.diodes.com
February 2014
© Diodes Incorporated
Page 4
OUR
CE CUR
RENT
C, CAPACITANC
F
D
RAIN-SOUR
C
GE CUR
REN
T
T
R
T
T
HER
R
TANC
DMN2041LSD
1.6
20
1.4
16
1.2
T = 25°C
A
1.0
0.8
0.6
I = 250µA
I = 1mA
D
D
0.4
0.2
GS(TH)
V , GATE THRESHOLD VOLTAGE (V)
0
-50 -25 0 25 50 75 100 125 150 T , AMBIENT TEMPERATURE (°C)
A
Fig. 7 Gate Threshold Variation vs. Ambient Temperature
(A)
12
8
S
I, S
4
0
0 0.2 0.4 0.6 0.8 1.0 1.2
V , SOURCE-DRAIN VOLTAGE (V)
SD
Fig. 8 Diode Forward Voltage vs. Current
10,000
(nA)
1,000
T = 150°C
A
T = 125°C
A
)
1,000
f = 1MHz
C
iss
E (p
C
100
oss
C
rss
E LEAKA
100
T = 85°C
A
10
T = 25°C
A
T = -55°C
A
DSS
1
10
0 5 10 15 20
V , DRAIN-SOURCE VOLTAGE (V)
DS
Fig. 9 Typical Capacitance
I,
2 4 6 8 10 12 14 16 18 20
V , DRAIN-SOURCE VOLTAGE (V)
DS
Fig. 10 Typical Drain-Source Leakage Current
vs. Drain-Source Voltage
1
D = 0.7
E
D = 0.5
D = 0.3
ESIS
0.1
D = 0.1
MAL
D = 0.05
D = 0.02
0.01
D = 0.01
ANSIEN
D = Single Pulse
r(t),
0.001
0.00001 0.0001 0.001 0.01 0.1 1 10 100 1,000
D = 0.005
D = 0.9
t , PULSE DURATION TIME (s)
1
R (t) = r(t) *
JA
R = 111°C /W
JA
P(pk)
t
1
t
2
T - T = P * R (t)
JA JA12
Duty Cycle, D = t /t
R
JA
Fig. 11 Transient Thermal Response
DMN2041LSD
Document number: DS31964 Rev. 3 - 2
4 of 6
www.diodes.com
February 2014
© Diodes Incorporated
Page 5
Package Outline Dimensions
Please see AP02002 at http://www.diodes.com/datasheets/ap02002.pdf for latest version.
E1
E
A1
Detail ‘A’
h
°
45
A2
A3
A
e
b
D
L
0.254 Gauge Plane
Seating Plane
7°~9
°
Suggested Pad Layout
Please see AP02001 at http://www.diodes.com/datasheets/ap02001.pdf for the latest version.
X
C1
C2
Y
Dim Min Max
A - 1.75 A1 0.10 0.20 A2 1.30 1.50 A3 0.15 0.25
b 0.3 0.5
D 4.85 4.95
E 5.90 6.10 E1 3.85 3.95
e 1.27 Typ
h - 0.35
L 0.62 0.82

Detail ‘A’
Dimensions Value (in mm)
X 0.60
Y 1.55 C1 5.4 C2 1.27
All Dimensions in mm
DMN2041LSD
SO-8
0 8
DMN2041LSD
Document number: DS31964 Rev. 3 - 2
5 of 6
www.diodes.com
February 2014
© Diodes Incorporated
Page 6
DIODES INCORPORATED MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARDS TO THIS DOCUMENT, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION).
Diodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes without further notice to this document and any product described herein. Diodes Incorporated does not assume any liability arising out of the application or use of this document or any product described herein; neither does Diodes Incorporated convey any license under its patent or trademark rights, nor the rights of others. Any Customer or user of this document or products described herein in such applications shall assume all risks of such use and will agree to hold Diodes Incorporated and all the companies whose products are represented on Diodes Incorporated website, harmless against all damages.
Diodes Incorporated does not warrant or accept any liability whatsoever in respect of any products purchased through unauthorized sales channel. Should Customers purchase or use Diodes Incorporated products for any unintended or unauthorized application, Customers shall indemnify and hold Diodes Incorporated and its representatives harmless against all claims, damages, expenses, and attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized application.
Products described herein may be covered by one or more United States, international or foreign patents pending. Product names and markings
noted herein may also be covered by one or more United States, international or foreign trademarks.
This document is written in English but may be translated into multiple languages for reference. Only the English version of this document is the final and determinative format released by Diodes Incorporated.
Diodes Incorporated products are specifically not authorized for use as critical components in life support devices or systems without the express written approval of the Chief Executive Officer of Diodes Incorporated. As used herein:
A. Life support devices or systems are devices or systems which:
1. are intended to implant into the body, or
labeling can be reasonably expected to result in significant injury to the user.
B. A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or to affect its safety or effectiveness.
Customers represent that they have all necessary expertise in the safety and regulatory ramifications of their life support devices or systems, and acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any use of Diodes Incorporated products in such safety-critical, life support devices or systems, notwithstanding any devices- or systems-related information or support that may be provided by Diodes Incorporated. Further, Customers must fully indemnify Diodes Incorporated and its representatives against any damages arising out of the use of Diodes Incorporated products in such safety-critical, life support devices or systems.
Copyright © 2014, Diodes Incorporated
www.diodes.com
2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the
IMPORTANT NOTICE
LIFE SUPPORT
DMN2041LSD
DMN2041LSD
Document number: DS31964 Rev. 3 - 2
6 of 6
www.diodes.com
February 2014
© Diodes Incorporated
Loading...