Diodes DMN2028UFDH User Manual

Page 1
n
n
Product Summary
max
I
D
V
R
(BR)DSS
20V
22mΩ @ VGS = 4.5V
26mΩ @ VGS = 2.5V
36mΩ @ VGS = 1.8V
DS(ON)
20mΩ @ V
max
= 10V
GS
TA = +25°C
6.8A
6.5A
6.1A
5.2A
Description
This new generation MOSFET has been designed to minimize the on­state resistance (R performance, making it ideal for high efficiency power management
applications.
) and yet maintain superior switching
DS(on)
Applications
Power management functions
Load Switch
ESD PROTECTED
POWERDI3030-8
D
D
D
D
Bottom View
S2
G2
S1
DUAL N-CHANNEL ENHANCEMENT MODE MOSFET
POWERDI
Features
Low On-Resistance
Low Input Capacitance
ESD Protected Up To 2kV
Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2)
Halogen and Antimony Free. “Green” Device (Note 3)
Qualified to AEC-Q101 Standards for High Reliability
Mechanical Data
Case: POWERDI3030-8
Case Material: Molded Plastic, “Green” Molding Compound.
UL Flammability Classification Rating 94V-0
Moisture Sensitivity: Level 1 per J-STD-020
Terminal Connections: See Diagram
Weight: 0.0072 grams (approximate)
Drai
Source 2
G1
Gate 1
Gate
Protection
Diode
Drai
Source 1
Internal Schematic
Gate 2
Gate Protection Diode
®
Ordering Information (Note 4)
Part Number Case Packaging
DMN2028UFDH-7 POWERDI3030-8 3,000/Tape & Reel
Notes: 1. No purposely added lead. Fully EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant.
2. See http://www.diodes.com for more information about Diodes Incorporated’s definitions of Halogen- and Antimony-free, "Green" and Lead-free.
4. For packaging details, go to our website at http://www.diodes.com.
3. Halogen- and Antimony-free "Green” products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and <1000ppm antimony compounds.
Marking Information
POWERDI is a registered trademark of Diodes Incorporated.
DMN2028UFDH
Document number: DS35805 Rev. 5 - 2
S34 = Product Type Marking Code YYWW = Date Code Marking
YYWW
YY = Last Digit of Year (ex: 13 = 2013) WW = Week Code (01 to 53)
S34
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Page 2
θ
)
g
g
g
g
r
Maximum Ratings (@T
= +25°C, unless otherwise specified.)
A
Characteristic Symbol Value Units
Drain-Source Voltage Gate-Source Voltage (Note 5)
Continuous Drain Current (Note 7) VGS = 10V
Maximum Body Diode Forward Current (Note 7) Pulsed Drain Current (10μs pulse, Duty cycle = 1%)
Thermal Characteristics (@T
= +25°C, unless otherwise specified.)
A
Characteristic Symbol Value Units
Total Power Dissipation (Note 6)
Thermal Resistance, Junction to Ambient (Note 6)
Total Power Dissipation (Note 7)
Thermal Resistance, Junction to Ambient (Note 7)
Thermal Resistance, Junction to Case (Note 7) Operating and Storage Temperature Range
Steady
State
t<10s
T
= +25°C
A
= +70°C
T
A
= +25°C
T
A
T
= +70°C
A
Steady state
Steady state
V
DSS
V
GSS
I
D
I
D
I
S
I
DM
P
D
R
JA
P
R
R
T
J, TSTG
θ
D
JA
θ
JC
t<10s 72
t<10s 50
20 V
±12 V
6.8
5.8
8.8
7.0
A
A
2 A
40 A
1.1 W
118
°C/W
1.5 W 82
°C/W
14
-55 to +150 °C
Electrical Characteristics (@T
= +25°C, unless otherwise specified.)
A
Characteristic Symbol Min Typ Max Unit Test Condition
OFF CHARACTERISTICS (Note 8)
Drain-Source Breakdown Voltage Zero Gate Voltage Drain Current TJ = +25°C I Gate-Source Leakage ON CHARACTERISTICS (Note 8)
Gate Threshold Voltage
Static Drain-Source On-Resistance
Forward Transfer Admittance Diode Forward Voltage DYNAMIC CHARACTERISTICS (Note 9) Input Capacitance Output Capacitance Reverse Transfer Capacitance Gate Resistance Total Gate Charge Gate-Source Charge Gate-Drain Charge Turn-On Delay Time Turn-On Rise Time Turn-Off Delay Time Turn-Off Fall Time
Notes: 5. AEC-Q101 VGS maximum is ±9.6V.
9. Guaranteed by design. Not subject to production testing.
6. Device mounted on FR-4 PC board, with minimum recommended pad layout, single sided.
7. Device mounted on FR-4 substrate PC board, 2oz copper, with thermal bias to bottom layer 1inch square copper plate. 8 .Short duration pulse test used to minimize self-heating effect.
BV
DSS
I
GSS
V
GS(th
R
DS (ON)
|Y V
C C C
R
Q Q Q
t
D(on)
t
D(off)
DSS
SD
iss
oss
rss
t
t
20 — — V — — 1 µA — — ±10 µA
0.5 — 1 V 16 20
17 22 19 26 24 36
— 8 — S
|
fs
s
d
f
— 0.7 1.0 V
— 151 — — 91 — — 32 — — 200 — — 8.5 — — 1.6 — — 2.8 —
— — — —
53 77
561 234
— ns — ns — ns — ns
VGS = 0V, ID = 250μA VDS = 20V, VGS = 0V VGS = ±10V, VDS = 0V
VDS = VGS, ID = 250μA
= 10V, ID = 4A
V
GS
V
= 4.5V, ID = 4A
m
GS
V
= 2.5V, ID = 4A
GS
V
= 1.8V, ID = 4A
GS
VDS = 5V, ID = 12A VGS = 0V, IS = 5A
pF
V
= 10V, VGS = 0V,
pF pF
nC nC nC
DS
f = 1.0MHz
VDS = 0V, VGS = 0V, f = 1MHz
= 4.5V, VDS = 10V,
V
GS
I
= 6.5A
D
= 10V, VDS = 4.5V,
V
GS
= 6Ω, RL = 1.0 Ω, ID = 1A
R
G
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DMN2028UFDH
Document number: DS35805 Rev. 5 - 2
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Page 3
RAIN CUR
REN
T
RAIN CUR
REN
T
R
R
OUR
ON-R
R
R
OUR
ON-R
R
R
OUR
C
R
R
OUR
CE ON-R
TANC
30
V= 8.0V
GS
25
V= 4.5V
GS
V= 3.0V
(A)
20
GS
V= 2.5V
GS
V= 2.0V
GS
20
V= 5.0V
DS
16
(A)
12
15
T = 150°C
A
T = 125°C
A
V , GATE-SOURCE VOLTAGE (V)
GS
T = 85°C
A
T = 25°C
A
T = -55°C
A
I, D
10
D
V= 1.5V
GS
5
0
0 0.5 1.0 1.5 2.0
V , DRAIN-SOURCE VOLTAGE (V)
DS
Figure 1 Typical Output Characteristic
0.05
Ω
0.04
8
D
I, D
4
0
0 0.5 1.0 1.5 2.0 2.5
Figure 2 Typical Transfer Characteristics
0.06
Ω
0.05
V = 4.5VGS
ESISTANCE ( )
0.03
V = 1.8VGS
CE
0.02
AIN-S
0.01
, D
DS(ON)
0
0 5 10 15 20 25 30
I , DRAIN-SOURCE CURRENT (A)
D
Figure 3 Typical On-Resistance vs.
Drain Current and Gate Voltage
1.6
V= V
GS
I= 5.5A
D
1.4
E
1.2
AIN-S
, D
1.0
DS(ON)
0.8
ON-RESISTANCE (NORMALIZED)
2. 5
V = 2.5VGS
V = 4.5VGS
V = 4.5V
GS
I= 6.5A
D
ESISTANCE ( )
0.04
T = 150°C
0.03
CE
0.02
AIN-S
, D
0.01
DS(ON)
0
04 8121620
I , DRAIN CURRENT (A)
D
A
T = 125°C
A
T = 85°C
A
T = 25°C
A
T = -55°C
A
Figure 4 Typical On-Resistance vs.
Drain Current and Temperature
0.06
Ω
E ( )
0.05
0.04
ESIS
V= V
2.5
GS
I = 5.5A
D
0.03
V = 4.5V
GS
I = 6.5A
D
AIN-S
, D
0.02
0.01
DS(ON)
0.6
-50 -25 0 25 50 75 100 125 150 T , JUNCTION TEMPERATURE ( C)
J
°
Figure 5 On-Resistance Variation with Temperature
0
-50 -25 0 25 50 75 100 125 150 T , JUNCTION TEMPERATURE ( C)
J
°
Figure 6 On-Resistance Variati on with Temperature
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DMN2028UFDH
Document number: DS35805 Rev. 5 - 2
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Page 4
GAT
THR
H
O
OLT
G
OUR
CE CUR
RENT
C
UNC
TIO
N CAPACITAN
C
F
T
R
T
T
H
R
R
TANC
1.4
1.2
E (V) A
1.0
I= 1mA
LD V
0.8
ES
0.6
E
0.4
0.2
GS(th)
V,
0
-50 -25 0 25 50 75 100 125 150
I = 250µA
D
T , JUNCTION TEMPERATURE ( C)
J
D
Figure 7 Gate Threshold Variation vs. Ambient Temperat ure
1,000
)
E (p
20
16
(A)
12
T= 25°C
A
8
S
I, S
4
0
°
0 0.2 0.4 0.6 0.8 1.0 1.2
V , SOURCE-DRAIN VOLTAGE (V)
SD
Figure 8 Diode Forward Voltage vs. Current
100
R
DS(ON)
Limited
P = 100µs
W
10
DC
P = 10s
1
C
iss
100
C
oss
, J
T
f = 1MHz
10
0 2 4 6 8 10 12 14 16 18 20
V , DRAIN-SOURCE VOLTAGE (V)
DS
C
rss
Figure 9 Typical Junction Capacitance
1
D = 0.9 D = 0.7
E
D = 0.5
D = 0.3
ESIS
0.1
D = 0.1
MAL
D = 0.05
0.1
D
I , DRAIN CURRENT (A)
0.01
0.001
W
P = 1s
W
P = 100ms
W
P = 10ms
W
P = 1ms
W
T = 150°C
J(MAX)
T = 25
°C
A
Single Pulse
0.1 1 10 100 V , DRAIN-SOURCE VOLTAGE (V)
DS
Figure 10 SOA, Safe Operation Area
E
D = 0.02
0.01
D = 0.01
R (t) = r(t) * R
θθ
ANSIEN
D = 0.005
r(t),
D = Single Pulse
0.001
0.00001 0.0001 0.001 0.01 0.1 1 10 100 1,000
JA JA
R = 120°C/W
θ
JA
Duty Cycle, D = t1/ t2
t1, PULSE DURATION TIME (sec)
Figure 11 Transient Thermal Resistance
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DMN2028UFDH
Document number: DS35805 Rev. 5 - 2
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Page 5
Package Outline Dimensions
Please see AP02002 at http://www.diodes.com/datasheets/ap02002.pdf for latest version.
A
E
Z (4X)
D
1
Pin#1 C0.10
L (8x)
e
b (8x)
A1
A3
Suggested Pad Layout
Please see AP02001 at http://www.diodes.com/datasheets/ap02001.pdf for the latest version.
POWERDI is a registered trademark of Diodes Incorporated.
X (8x)
DMN2028UFDH
Document number: DS35805 Rev. 5 - 2
C
Y (8x)
Dimensions
Y1
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POWERDI3030-8
Dim Min Max Typ
A 0.75 0.85 0.80 A1 0 0.05 0.02 A3
b 0.25 0.35 0.30 D 2.95 3.05 3.00 E 2.95 3.05 3.00 e
L 0.55 0.65 0.60
Z
Y1 3.400
All Dimensions in mm
(in mm) C 0.650 X 0.400 Y 0.850
0.203
0.65
0.375
Value
January 2013
© Diodes Incorporated
Page 6
IMPORTANT NOTICE
DIODES INCORPORATED MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARDS TO THIS DOCUMENT, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION).
Diodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes without further notice to this document and any product described herein. Diodes Incorporated does not assume any liability arising out of the application or use of this document or any product described herein; neither does Diodes Incorporated convey any license under its patent or trademark rights, nor the rights of others. Any Customer or user of this document or products described herein in such applications shall assume all risks of such use and will agree to hold Diodes Incorporated and all the companies whose products are represented on Diodes Incorporated website, harmless against all damages.
Diodes Incorporated does not warrant or accept any liability whatsoever in respect of any products purchased through unauthorized sales channel. Should Customers purchase or use Diodes Incorporated products for any unintended or unauthorized application, Customers shall indemnify and hold Diodes Incorporated and its representatives harmless against all claims, damages, expenses, and attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized application.
Products described herein may be covered by one or more United States, international or foreign patents pending. Product names and markings noted herein may also be covered by one or more United States, international or foreign trademarks.
This document is written in English but may be translated into multiple languages for reference. Only the English version of this document is the final and determinative format released by Diodes Incorporated.
LIFE SUPPORT
Diodes Incorporated products are specifically not authorized for use as critical components in life support devices or systems without the express written approval of the Chief Executive Officer of Diodes Incorporated. As used herein:
A. Life support devices or systems are devices or systems which:
1. are intended to implant into the body, or
2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the
labeling can be reasonably expected to result in significant injury to the user.
B. A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or to affect its safety or effectiveness.
Customers represent that they have all necessary expertise in the safety and regulatory ramifications of their life support devices or systems, and acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any use of Diodes Incorporated products in such safety-critical, life support devices or systems, notwithstanding any devices- or systems-related information or support that may be provided by Diodes Incorporated. Further, Customers must fully indemnify Diodes Incorporated and its representatives against any damages arising out of the use of Diodes Incorporated products in such safety-critical, life support devices or systems.
Copyright © 2013, Diodes Incorporated
www.diodes.com
POWERDI is a registered trademark of Diodes Incorporated.
DMN2028UFDH
Document number: DS35805 Rev. 5 - 2
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