DMN2015UFDE
20V N-CHANNEL ENHANCEMENT MODE MOSFET
Product Summary
I
D max
TA = +25°C
10.5A
9.4A
V
R
(BR)DSS
20V
Package
DS(ON) max
11.6mΩ @ V
15m @ VGS = 2.5V
= 4.5V
GS
U-DFN2020-6
Type E
Description
This new generation MOSFET has been designed to minimize the onstate resistance (R
performance, making it ideal for high efficiency power management
applications.
) and yet maintain superior switching
DS(on)
Applications
ADVANCE INFORMATION
• General Purpose Interfacing Switch
• Power Management Functions
Features
• 0.6mm profile – ideal for low profile applications
• PCB footprint of 4mm
• Low Gate Threshold Voltage
• Low On-Resistance
• Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2)
• Halogen and Antimony Free. “Green” Device (Note 3)
• Qualified to AEC-Q101 Standards for High Reliability
2
Mechanical Data
• Case: U-DFN2020-6 Type E
• Case Material: Molded Plastic, “Green” Molding Compound.
UL Flammability Classification Rating 94V-0
• Moisture Sensitivity: Level 1 per J-STD-020
• Terminals: Finish – NiPdAu over Copper leadframe. Solderable
per MIL-STD-202, Method 208
• Weight: 0.0065 grams (approximate)
Drain
Pin1
U-DFN2020-6 Type E
Bottom View
Bottom View
Pin Out
Gate
Source
Equivalent Circuit
Ordering Information (Note 4)
Part Number Marking Reel size (inches) Quantity per reel
DMN2015UFDE-7 N4 7 3,000
DMN2015UFDE-13 N4 13 10,000
Notes: 1. No purposely added lead. Fully EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant.
2. See http://www.diodes.com for more information about Diodes Incorporated’s definitions of Halogen- and Antimony-free, "Green" and Lead-free.
3. Halogen- and Antimony-free "Green” products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and
<1000ppm antimony compounds.
4. For packaging details, go to our website at http://www.diodes.com.
Marking Information
Date Code Key
Year 2011 2012 2013 2014 2015 2016 2017
Code Y Z A B C D E
Month Jan Feb Mar Apr May Jun Jul Aug Sep Oct Nov Dec
Code 1 2 3 4 5 6 7 8 9 O N D
DMN2015UFDE
D
atasheet number: DS35560 Rev. 9 - 2
N4
www.diodes.com
N4 = Product Type Marking Code
YM = Date Code Marking
YM
Y = Year (ex: Y = 2011)
M = Month (ex: 9 = September)
1 of 6
© Diodes Incorporated
July 2012
DMN2015UFDE
Maximum Ratings (@T
= +25°C, unless otherwise specified.)
A
Characteristic Symbol Value Units
Drain-Source Voltage
Gate-Source Voltage
Continuous Drain Current (Note 6) VGS = 4.5V
Continuous Drain Current (Note 6) VGS = 2.5V
Pulsed Drain Current (10µs pulse, duty cycle = 1%)
Maximum Body Diode Continuous Current
Steady
State
t<10s
Steady
State
t<10s
T
= +25°C
A
= +70°C
T
A
= +25°C
T
A
T
= +70°C
A
T
= +25°C
A
= +70°C
T
A
= +25°C
T
A
T
= +70°C
A
V
DSS
V
GSS
I
D
I
D
I
D
I
D
I
DM
I
S
20 V
±12 V
10.5
8.5
12.5
10.0
9.4
7.5
11.2
8.8
A
A
A
A
80 A
2.5 A
Thermal Characteristics
Characteristic Symbol Value Units
T
= +25°C
Total Power Dissipation (Note 5)
ADVANCE INFORMATION
Thermal Resistance, Junction to Ambient (Note 5)
Total Power Dissipation (Note 6)
Thermal Resistance, Junction to Ambient (Note 6)
Thermal Resistance, Junction to Case (Note 6)
Operating and Storage Temperature Range
A
TA = +70°C
Steady state
t<10s 132
T
= +25°C
A
TA = +70°C
Steady state
t<10s 43
P
R
P
R
R
T
J, TSTG
D
JA
θ
D
JA
θ
JC
0.66
0.42
189
2.03
1.31
W
°C/W
W
61
°C/W
9.3
-55 to +150 °C
Electrical Characteristics (@T
= +25°C, unless otherwise specified.)
A
Characteristic Symbol Min Typ Max Unit Test Condition
OFF CHARACTERISTICS (Note 7)
Drain-Source Breakdown Voltage
Zero Gate Voltage Drain Current TJ = +25°C I
Gate-Source Leakage
BV
DSS
I
GSS
DSS
20
— —
— —
—
— V
1
μA
±100 nA
VGS = 0V, ID = 250A
= 16V, VGS = 0V
V
DS
= ±12V, VDS = 0V
V
GS
ON CHARACTERISTICS (Note 7)
Gate Threshold Voltage
Static Drain-Source On-Resistance
Forward Transfer Admittance
Diode Forward Voltage
V
GS(th
R
DS (ON)
|Y
V
fs
SD
0.5 — 1.1 V
9.3 11.6
—
11.4 15
17 30
24 50
— 11.3 — S
|
— — 1.2 V
VDS = VGS, ID = 250A
= 4.5V, ID = 8.5A
V
GS
= 2.5V, ID = 8.5A
V
mΩ
GS
= 1.8V, ID = 5A
V
GS
= 1.5V, ID = 3A
V
GS
VDS = 10V, ID = 8.5A
VGS = 0V, IS = 8.5A
DYNAMIC CHARACTERISTICS (Note 8)
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
Gate Resistance
C
iss
C
oss
C
rss
R
Total Gate Charge (VGS = 4.5V) Qg
Total Gate Charge (VGS = 10V) Qg
Gate-Source Charge
Gate-Drain Charge
Turn-On Delay Time
Turn-On Rise Time
Turn-Off Delay Time
Turn-Off Fall Time
Reverse Recovery Time
Reverse Recovery Charge
Notes: 5. Device mounted on FR-4 PC board, with minimum recommended pad layout, single sided.
8. Guaranteed by design. Not subject to production testing.
6. Device mounted on FR-4 substrate PC board, 2oz copper, with thermal bias to bottom layer 1inch square copper plate.
7. Short duration pulse test used to minimize self-heating effect.
DMN2015UFDE
D
atasheet number: DS35560 Rev. 9 - 2
Q
s
Q
d
t
D(on
t
t
D(off
t
f
T
r
Q
r
www.diodes.com
— 1779 —
— 175 —
— 154 —
— 0.94 —
— 19.7 —
— 45.6 —
— 2.9 —
— 3.8 —
— 7.4 —
— 16.8 —
— 43.6 —
— 10.9 —
— 8.6 —
— 3.7 —
2 of 6
pF
pF
pF
= 10V, VGS = 0V,
V
DS
f = 1.0MHz
VDS = 0V, VGS = 0V, f = 1MHz
nC
nC
V
= 10V, ID = 8.5A
nC
DS
nC
ns
ns
V
= 10V, ID = 8.5A
DS
ns
= 4.5V, RG = 1.8
V
GS
ns
ns
I
= 8.5A, di/dt = 210A/s
F
nC
July 2012
© Diodes Incorporated