Diodes DMN2015UFDE User Manual

20V N-CHANNEL ENHANCEMENT MODE MOSFET
Product Summary
I
D max
TA = +25°C
10.5A
9.4A
V
R
(BR)DSS
20V
Package
DS(ON) max
11.6mΩ @ V 15m @ VGS = 2.5V
= 4.5V
GS
U-DFN2020-6
Type E
Description
This new generation MOSFET has been designed to minimize the on­state resistance (R performance, making it ideal for high efficiency power management applications.
) and yet maintain superior switching
DS(on)
Applications
ADVANCE INFORMATION
General Purpose Interfacing Switch
Power Management Functions
Features
0.6mm profile – ideal for low profile applications
PCB footprint of 4mm
Low Gate Threshold Voltage
Low On-Resistance
Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2)
Halogen and Antimony Free. “Green” Device (Note 3)
Qualified to AEC-Q101 Standards for High Reliability
2
Mechanical Data
Case: U-DFN2020-6 Type E
Case Material: Molded Plastic, “Green” Molding Compound.
UL Flammability Classification Rating 94V-0
Moisture Sensitivity: Level 1 per J-STD-020
Terminals: Finish – NiPdAu over Copper leadframe. Solderable
per MIL-STD-202, Method 208
Weight: 0.0065 grams (approximate)
Drain
Pin1
U-DFN2020-6 Type E
Bottom View
Bottom View
Pin Out
Gate
Source
Equivalent Circuit
Ordering Information (Note 4)
Part Number Marking Reel size (inches) Quantity per reel
DMN2015UFDE-7 N4 7 3,000
DMN2015UFDE-13 N4 13 10,000
Notes: 1. No purposely added lead. Fully EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant.
2. See http://www.diodes.com for more information about Diodes Incorporated’s definitions of Halogen- and Antimony-free, "Green" and Lead-free.
3. Halogen- and Antimony-free "Green” products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and <1000ppm antimony compounds.
4. For packaging details, go to our website at http://www.diodes.com.
Marking Information
Date Code Key
Year 2011 2012 2013 2014 2015 2016 2017
Code Y Z A B C D E
Month Jan Feb Mar Apr May Jun Jul Aug Sep Oct Nov Dec
Code 1 2 3 4 5 6 7 8 9 O N D
DMN2015UFDE
D
atasheet number: DS35560 Rev. 9 - 2
N4
www.diodes.com
N4 = Product Type Marking Code YM = Date Code Marking
YM
Y = Year (ex: Y = 2011) M = Month (ex: 9 = September)
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© Diodes Incorporated
July 2012
θ
)
g
g
g
)
r
)
r
r
Maximum Ratings (@T
= +25°C, unless otherwise specified.)
A
Characteristic Symbol Value Units
Drain-Source Voltage Gate-Source Voltage
Continuous Drain Current (Note 6) VGS = 4.5V
Continuous Drain Current (Note 6) VGS = 2.5V
Pulsed Drain Current (10µs pulse, duty cycle = 1%) Maximum Body Diode Continuous Current
Steady
State t<10s
Steady
State t<10s
T
= +25°C
A
= +70°C
T
A
= +25°C
T
A
T
= +70°C
A
T
= +25°C
A
= +70°C
T
A
= +25°C
T
A
T
= +70°C
A
V
DSS
V
GSS
I
D
I
D
I
D
I
D
I
DM
I
S
20 V
±12 V
10.5
8.5
12.5
10.0
9.4
7.5
11.2
8.8
A
A
A
A
80 A
2.5 A
Thermal Characteristics
Characteristic Symbol Value Units
T
= +25°C
Total Power Dissipation (Note 5)
ADVANCE INFORMATION
Thermal Resistance, Junction to Ambient (Note 5)
Total Power Dissipation (Note 6)
Thermal Resistance, Junction to Ambient (Note 6) Thermal Resistance, Junction to Case (Note 6)
Operating and Storage Temperature Range
A
TA = +70°C
Steady state
t<10s 132
T
= +25°C
A
TA = +70°C
Steady state
t<10s 43
P
R
P
R R
T
J, TSTG
D
JA
θ
D
JA
θ
JC
0.66
0.42 189
2.03
1.31
W
°C/W
W
61
°C/W
9.3
-55 to +150 °C
Electrical Characteristics (@T
= +25°C, unless otherwise specified.)
A
Characteristic Symbol Min Typ Max Unit Test Condition
OFF CHARACTERISTICS (Note 7)
Drain-Source Breakdown Voltage Zero Gate Voltage Drain Current TJ = +25°C I Gate-Source Leakage
BV
DSS
I
GSS
DSS
20 — — — —
— V
1
μA
±100 nA
VGS = 0V, ID = 250A
= 16V, VGS = 0V
V
DS
= ±12V, VDS = 0V
V
GS
ON CHARACTERISTICS (Note 7) Gate Threshold Voltage
Static Drain-Source On-Resistance
Forward Transfer Admittance Diode Forward Voltage
V
GS(th
R
DS (ON)
|Y V
fs
SD
0.5 — 1.1 V
9.3 11.6
11.4 15 17 30 24 50
— 11.3 — S
|
— — 1.2 V
VDS = VGS, ID = 250A
= 4.5V, ID = 8.5A
V
GS
= 2.5V, ID = 8.5A
V
mΩ
GS
= 1.8V, ID = 5A
V
GS
= 1.5V, ID = 3A
V
GS
VDS = 10V, ID = 8.5A
VGS = 0V, IS = 8.5A DYNAMIC CHARACTERISTICS (Note 8) Input Capacitance
Output Capacitance Reverse Transfer Capacitance Gate Resistance
C
iss
C
oss
C
rss
R Total Gate Charge (VGS = 4.5V) Qg Total Gate Charge (VGS = 10V) Qg Gate-Source Charge Gate-Drain Charge Turn-On Delay Time Turn-On Rise Time Turn-Off Delay Time Turn-Off Fall Time Reverse Recovery Time Reverse Recovery Charge
Notes: 5. Device mounted on FR-4 PC board, with minimum recommended pad layout, single sided.
8. Guaranteed by design. Not subject to production testing.
6. Device mounted on FR-4 substrate PC board, 2oz copper, with thermal bias to bottom layer 1inch square copper plate.
7. Short duration pulse test used to minimize self-heating effect.
DMN2015UFDE
D
atasheet number: DS35560 Rev. 9 - 2
Q
s
Q
d
t
D(on
t
t
D(off
t
f
T
r
Q
r
www.diodes.com
— 1779 — — 175 — — 154 — — 0.94 — — 19.7 — — 45.6 — — 2.9 — — 3.8 — — 7.4 — — 16.8 — — 43.6 — — 10.9 — — 8.6 — — 3.7 —
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pF pF pF
= 10V, VGS = 0V,
V
DS
f = 1.0MHz
VDS = 0V, VGS = 0V, f = 1MHz nC nC
V
= 10V, ID = 8.5A
nC
DS
nC
ns ns
V
= 10V, ID = 8.5A
DS
ns
= 4.5V, RG = 1.8
V
GS
ns ns
I
= 8.5A, di/dt = 210A/s
F
nC
July 2012
© Diodes Incorporated
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