Diodes DMN2009LSS User Manual

θ
Features
Low On-Resistance
8m @ V
9m @ V
12m @ V
Low Gate Threshold Voltage
Low Input Capacitance
Fast Switching Speed
Low Input/Output Leakage
Lead Free By Design/RoHS Compliant (Note 2)
"Green" Device (Note 4)
Qualified to AEC-Q101 Standards for High Reliability
= 10V
GS
= 4.5V
GS
GS
= 2.5V
SO-8
TOP VIEW
DMN2009LSS
SINGLE N-CHANNEL ENHANCEMENT MODE MOSFET
Mechanical Data
Case: SO-8
Case Material: Molded Plastic, “Green” Molding Compound.
UL Flammability Classification Rating 94V-0
Moisture Sensitivity: Level 1 per J-STD-020
Terminals Connections: See Diagram
Terminals: Finish - Matte Tin annealed over Copper lead frame.
Solderable per MIL-STD-202, Method 208
Marking Information: See Page 4
Ordering Information: See Page 4
Weight: 0.072 grams (approximate)
S
S S G
TOP VIEW
Internal Schematic
D
D D D
Maximum Ratings @T
= 25°C unless otherwise specified
A
Characteristic Symbol Value Units
Drain-Source Voltage Gate-Source Voltage Drain Current (Note 1) Steady
State Pulsed Drain Current (Note 3)
T
= 25°C
A
= 70°C
T
A
V
DSS
V
GSS
I
D
I
DM
20 V
±12
12
9.6
V A
42 A
Thermal Characteristics
Characteristic Symbol Value Unit
Total Power Dissipation (Note 1) Thermal Resistance, Junction to Ambient Operating and Storage Temperature Range
Notes: 1. Device mounted on 2 oz, FR-4 PCB, with R
2. No purposefully added lead.
3. Pulse width ≤10μS, Duty Cycle ≤1%.
4. Diodes Inc.'s "Green" policy can be found on our website at http://www.diodes.com/products/lead_free/index.php.
= 62.5°C/W
JA
θ
P
R
T
J, TSTG
D JA
DMN2009LSS
Document number: DS31409 Rev. 6- 2
1 of 5
www.diodes.com
2 W
62.5 °C/W
-55 to +150 °C
June 2010
© Diodes Incorporated
)
g
g
R
N C
U
R
R
N
T
RAIN
C
U
R
REN
T
Electrical Characteristics @T
= 25°C unless otherwise specified
A
Characteristic Symbol Min Typ Max Unit Test Condition
OFF CHARACTERISTICS (Note 5)
Drain-Source Breakdown Voltage Zero Gate Voltage Drain Current Gate-Source Leakage
BV
DSS
I
DSS
I
GSS
ON CHARACTERISTICS (Note 5)
Gate Threshold Voltage
Static Drain-Source On-Resistance
Forward Transconductance Diode Forward Voltage (Note 5)
V
GS(th
R
DS (ON)
V
g
fs
SD
DYNAMIC CHARACTERISTICS
Input Capacitance Output Capacitance Reverse Transfer Capacitance Gate Resistance
C
iss
C
oss
C
rss
R
G
SWITCHING CHARACTERISTICS
Total Gate Charge Gate-Source Charge
Gate-Drain Charge
Notes: 5. Short duration pulse test used to minimize self-heating effect.
Q
g
Q
s
Q
d
30
V = 10V
GS
25
(A)
20
E
V = 4.5V
GS
V = 4.0V
GS
V = 3.0V
GS
V = 2.5V
GS
V = 5V
DS
15
20
1
±100
0.5
⎯ ⎯
⎯ ⎯
27
1.2 V 8
9
12
0.5 0.7 1.2 V
⎯ ⎯ ⎯
2555
523 496
1.1
28.9
58.3
3.7
11.4
⎯ ⎯ ⎯ ⎯ Ω
VDS = 10V, VGS = 10V, ID = 12A ⎯ VDS = 10V, VGS = 10V, ID = 12A
V
V
GS
μA
V
nA
mΩ
DS
V
GS
V
DS
V
GS
V
GS
V
GS
S
V
DS
VGS = 0V, IS = 3A
pF pF
V
DS
pF
VGS = 0V VDS = 0V, f = 1MHz
V
DS
V
nC
DS
30
25
V = 10V
(A)
20
15
DS
DMN2009LSS
= 0V, ID = 250μA = 20V, VGS = 0V
= ±12V, VDS = 0V
= VGS, ID = 250μA = 10V, ID = 12A = 4.5V, ID = 10A = 2.5V, ID = 8A
= 5V, ID = 6.5A
= 10V, VGS = 0V, f = 1.0MHz
= 10V, VGS = 4.5V, ID = 12A = 10V, VGS = 10V, ID = 12A
AI
D
I, D
10
V = 1.5V
GS
5
0
012345
V , DRAIN-SOURCE VOLT AGE (V)
DS
Fig. 1 Typical Output Characteristics
DMN2009LSS
Document number: DS31409 Rev. 6- 2
2 of 5
www.diodes.com
10
D
I, D
5
0
0.4 0.6 0.8 1 1.2 1.4 1.6 V , GATE SOURCE VOLTAGE (V)
GS
T = 150°C
T = 125°C
A
T = 85°C
A
A
T = 25°C
A
T = -55°C
A
Fig. 2 Typical Transfer Characteristics
June 2010
© Diodes Incorporated
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