Features
• Ultra Low Profile Package
• Low On-Resistance
• Very Low Gate Threshold Voltage, 0.9V Max.
• Fast Switching Speed
• Low Input/Output Leakage
• Ultra-Small Surface Mount Package
• ESD Protected Gate
• Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2)
• Halogen and Antimony Free. “Green” Device (Note 3)
ESD PROTECTED
Mechanical Data
• Case: X2-DFN1310-6
• Case Material: Molded Plastic, “Green” Molding Compound.
• Moisture Sensitivity: Level 1 per J-STD-020
• Terminal Connections: See Diagram
• Terminals: Finish ⎯ NiPdAu annealed over Copper leadframe.
X2-DFN1310-6
DMN2005DLP4K
DUAL N-CHANNEL ENHANCEMENT MODE MOSFET
UL Flammability Classification Rating 94V-0
Solderable per MIL-STD-202, Method 208
D
G
1
S
G
1
S
2
2
D
1
2
Top View
Internal Schematic
e4
Ordering Information (Note 4)
Part Number Case Packaging
DMN2005DLP4K-7 X2-DFN1310-6 3000/Tape & Reel
Notes: 1. No purposely added lead. Fully EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant.
2. See http://www.diodes.com for more information about Diodes Incorporated’s definitions of Halogen- and Antimony-free, "Green" and Lead-free.
3. Halogen- and Antimony-free "Green” products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and
<1000ppm antimony compounds.
4. For packaging details, go to our website at http://www.diodes.com.
Marking Information
DL
DL = Product Type Marking Code
DMN2005DLP4K
Document number: DS30801 Rev. 9 - 2
1 of 5
www.diodes.com
© Diodes Incorporated
June 2012
Maximum Ratings @T
= 25°C unless otherwise specified
A
Characteristic Symbol Value Unit
Drain-Source Voltage
Gate-Source Voltage
Drain Current per element (Note 5) Continuous
Pulsed (Note 6)
Thermal Characteristics @T
= 25°C unless otherwise specified
A
Characteristic Symbol Value Unit
Total Power Dissipation (Note 5)
Thermal Resistance, Junction to Ambient
Operating and Storage Temperature Range
Electrical Characteristics @T
= 25°C unless otherwise specified
A
Characteristic Symbol Min Typ Max Unit Test Condition
OFF CHARACTERISTICS (per element) (Note 7)
Drain-Source Breakdown Voltage
Zero Gate Voltage Drain Current
Gate-Source Leakage
ON CHARACTERISTICS (per element) (Note 7)
Gate Threshold Voltage
Static Drain-Source On-Resistance
Forward Transfer Admittance
Notes: 5. Device mounted on FR-4 PCB.
6. Pulse width ≤10μS, Duty Cycle ≤1%.
7. Short duration pulse test used to minimize self-heating effect.
2.0
V = 4.5V
GS
V = 2.5V
GS
BV
I
I
V
GS(th
R
DS (ON)
⏐Y
DSS
DSS
GSS
DMN2005DLP4K
V
DSS
V
GSS
I
D
P
D
R
JA
T
, T
STG
J
20
⎯ ⎯
⎯ ⎯
0.53
⎯
⎯
⎯
⎯
⎯
40
⏐
fs
⎯ ⎯
⎯
0.35
0.4
0.45
0.55
0.65
⎯ ⎯
10
±5 μA
0.9 V
1.5
1.7
1.7
3.5
3.5
1.5
V = 5V
DS
20 V
±10
300
350
V
mA
400 mW
231 °C/W
-65 to +150 °C
V
VGS = 0V, ID = 100μA
μA
V
Ω
mS
= 17V, V
DS
V
= ±8V, VDS = 0V
GS
= VGS, ID = 100μA
V
DS
V
= 4V, ID = 10mA
GS
V
= 2.7V, ID = 200mA
GS
= 2.5V, ID = 10mA
V
GS
V
= 1.8V, ID = 200mA
GS
V
= 1.5V, ID = 1mA
GS
V
= 3V, ID = 10mA
DS
GS
= 0V
1.5
(A)
E
1.0
V = 2.0V
GS
V = 1.8V
GS
(A)
EN
1.0
AIN
0.5
D
I, D
0.5
0
012345
V , DRAIN-SOURCE VOLTAGE (V)
DS
V = 1.5V
GS
V = 1.2V
GS
Figure 1 Typical Output Characteristics
D
I, D
0
0 0.5 1 1.5 2 2.5 3
T = 150°C
A
T = 125°C
A
T = 85°C
A
V , GATE SOURCE VOLT AGE (V)
GS
T = 25°C
A
T = -55°C
A
Figure 2 Typical Transfer Characteristics
DMN2005DLP4K
Document number: DS30801 Rev. 9 - 2
2 of 5
www.diodes.com
June 2012
© Diodes Incorporated