Features
• Dual N-Channel MOSFET
• Low On-Resistance
• Low Gate Threshold Voltage
• Low Input Capacitance
• Fast Switching Speed
• Ultra-Small Surface Mount Package
• Lead Free By Design/RoHS Compliant (Note 1)
• ESD Protected Gate up to 2kV
• "Green" Device (Note 2)
• Qualified to AEC-Q101 Standards for High Reliability
ESD protected up to 2kV
Top View
DMN2004VK
DUAL N-CHANNEL ENHANCEMENT MODE MOSFET
Mechanical Data
• Case: SOT563
• Case Material: Molded Plastic, “Green” Molding Compound.
UL Flammability Classification Rating 94V-0
• Moisture Sensitivity: Level 1 per J-STD-020
• Terminal Connections: See Diagram
• Terminals: Finish - Matte Tin annealed over Copper lead frame.
Solderable per MIL-STD-202, Method 208
• Weight: 0.006 grams (approximate)
S
G
SOT563
Bottom View
D
2
G
S
2
Top View
Internal Schematic
1
1
D
1
2
Ordering Information (Note 3)
Part Number Case Packaging
DMN2004VK-7 SOT563 3000/Tape & Reel
DMN2004VK-13 SOT563 10000/Tape & Reel
Notes: 1. EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant. No purposely added lead. Halogen and Antimony free
2. Diodes Inc.’s “Green” policy can be found on our website at http://www.diodes.com.
3. For packaging details, go to our website at http://www.diodes.com.
Marking Information
NAB
YM
NAB = Marking Code
YM = Date Code Marking
Y = Year (ex: T = 2006)
M = Month (ex: 9 = September)
Date Code Key
Year 2006 2007 2008 2009 2010 2011 2012 2013 2014 2015 2016 2017
Code T U V W X Y Z A B C D E
Month Jan Feb Mar Apr May Jun Jul Aug Sep Oct Nov Dec
Code 1 2 3 4 5 6 7 8 9 O N D
DMN2004VK
Document number: DS30865 Rev. 5 - 2
1 of 6
www.diodes.com
March 2012
© Diodes Incorporated
Maximum Ratings @T
= 25°C unless otherwise specified
A
Characteristic Symbol Value Units
Drain-Source Voltage
Gate-Source Voltage
Drain Current (Note 4) Steady
State
Pulsed Drain Current (10μs pulse, duty cycle = 1%)
Thermal Characteristics @T
= 25°C unless otherwise specified
A
Characteristic Symbol Value Units
Total Power Dissipation (Note 4)
Thermal Resistance, Junction to Ambient
Operating and Storage Temperature Range
T
= 25°C
A
= 85°C
T
A
V
V
I
P
R
T
J, TSTG
DSS
GSS
I
D
DM
D
JA
DMN2004VK
20 V
±8
540
390
V
mA
1.5 A
250 mW
500 °C/W
-55 to +150 °C
Electrical Characteristics @T
= 25°C unless otherwise specified
A
Characteristic Symbol Min Typ Max Unit Test Condition
OFF CHARACTERISTICS (Note 5)
Drain-Source Breakdown Voltage
Zero Gate Voltage Drain Current
Gate-Source Leakage
BV
I
DSS
I
GSS
DSS
20
⎯ ⎯
⎯ ⎯
⎯ ⎯
1
±1 μA
V
μA
V
= 0V, ID = 10μA
GS
V
= 16V, VGS = 0V
DS
V
= ±4.5V, VDS = 0V
GS
ON CHARACTERISTICS (Note 5)
Gate Threshold Voltage
Static Drain-Source On-Resistance
Forward Transfer Admittance
Diode Forward Voltage
V
GS(th
R
DS (ON)
|Y
V
SD
0.5
⎯
0.4
⎯
0.5
0.7
|
fs
200
0.5
⎯ ⎯
⎯
1.0 V
0.55
0.70
0.9
1.4 V
V
V
Ω
V
VGS = 1.8V, ID = 350mA
ms
V
VGS = 0V, IS = 115mA
= VGS, ID = 250μA
DS
= 4.5V, ID = 540mA
GS
= 2.5V, ID = 500mA
GS
=10V, ID = 0.2A
DS
DYNAMIC CHARACTERISTICS (Note 6)
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
C
⎯ ⎯
iss
C
⎯ ⎯
oss
C
⎯ ⎯
rss
150 pF
25 pF
20 pF
V
DS
f = 1.0MHz
= 16V, VGS = 0V
SWITCHING CHARACTERISTICS (Note 6)
Turn-On Delay Time
Rise Time
Turn-Off Delay Time
Fall Time
Notes: 4. Device mounted on FR-4 substrate PC board, 2oz copper, with minimum recommended pad layout.
5. Short duration pulse test used to minimize self-heating effect.
6. Guaranteed by design. Not subject to product testing.
DMN2004VK
Document number: DS30865 Rev. 5 - 2
t
⎯
d(on
t
⎯
t
⎯
d(off
t
⎯
f
www.diodes.com
2 of 6
8.0
13.3
53.5
36.1
⎯
⎯
⎯
⎯
ns
ns
ns
ns
= 10V, RL = 47Ω,
V
DD
= 200mA. V
I
D
R
= 10Ω
G
= 4.5V,
GEN
March 2012
© Diodes Incorporated