Diodes DMN2004TK User Manual

q
p
n
DMN2004T
N-CHANNEL ENHANCEMENT MODE MOSFET
Features
Low On-Resistance
Low Gate Threshold Voltage
Low Input Capacitance
Fast Switching Speed
Low Input/Output Leakage
ESD Protected up to 2kV
Lead Free By Design/RoHS Compliant (Note 1)
"Green" Device (Note 2)
Qualified to AEC-Q101 standards for High Reliability
NEW PRODUCT
ESD PROTECTED TO 2kV
SOT-523
Top View
Mechanical Data
Case: SOT-523
Case Material: Molded Plastic, “Green” Molding Compound. UL
Flammability Classification Rating 94V-0
Moisture Sensitivity: Level 1 per J-STD-020
Terminals: Finish Matte Tin annealed over Alloy 42
leadframe. Solderable per MIL-STD-202, Method 208
Terminal Connections: See Diagram
Weight: 0.002 grams (approximate)
Drai
D
Gate
Gate
Protection
Diode
E
uivalent Circuit
Source
G
To
S
View
Ordering Information (Note 3)
Part Number Case Packaging
DMN2004TK-7 SOT-523 3000/Tape & Reel
Notes: 1. No purposefully added lead.
2. Diodes Inc.’s “Green” policy can be found on our website at http://www.diodes.com.
3. For packaging details, go to our website at http://www.diodes.com.
Marking Information
Date Code Key
Year 2006 2007 2008 2009 2010 2011 2012
Code T U V W X Y Z
Month Jan Feb Mar Apr May Jun Jul Aug Sep Oct Nov Dec
Code 1 2 3 4 5 6 7 8 9 O N D
NAB
YM
DMN2004TK
Document number: DS30936 Rev. 5 - 2
NAB = Product Type Marking Code YM = Date Code Marking Y = Year (ex: T = 2006) M = Month (ex: 9 = September)
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)
)
r
)
Maximum Ratings @T
= 25°C unless otherwise specified
A
Characteristic Symbol Value Units
Drain-Source Voltage Gate-Source Voltage
= 25°C
Drain Current (Note 4) Steady State
T
A
= 85°C
T
A
Pulsed Drain Current (Note 5)
Thermal Characteristics @T
NEW PRODUCT
Characteristic Symbol Value Units
= 25°C unless otherwise specified
A
Total Power Dissipation (Note 4) Thermal Resistance, Junction to Ambient Operating and Storage Temperature Range
V V
I
P
R
T
J, TSTG
DSS
GSS
I
D
DM
D JA
DMN2004T
20 V ±8 V
540 390
mA
1.5 A
150 mW 833 °C/W
-55 to +150 °C
Electrical Characteristics @T
= 25°C unless otherwise specified
A
Characteristic Symbol Min Typ Max Unit Test Condition
OFF CHARACTERISTICS (Note 6)
Drain-Source Breakdown Voltage Zero Gate Voltage Drain Current Gate-Source Leakage
BV
DSS
I
DSS
I
GSS
20
0.8
300
0.9
V
nA
nA
±1 μA
VGS = 0V, ID = 10μA
= 16V, VGS = 0V
V
DS
= 20V, VGS = 0V
V
DS
VGS = ±4.5V, VDS = 0V ON CHARACTERISTICS (Note 6) Gate Threshold Voltage
Static Drain-Source On-Resistance
Forward Transfer Admittance Diode Forward Voltage (Note 6)
V
GS(th
R
DS (ON)
|Y V
SD
|
fs
0.5
200
0.5
0.4
0.5
0.55
0.70
0.7
⎯ ⎯
1.0 V
VDS = VGS, ID = 250μA
V
Ω
0.9
1.4 V
V
VGS = 1.8V, ID = 350mA
ms
VDS =10V, ID = 0.2A
VGS = 0V, IS = 115mA
= 4.5V, ID = 540mA
GS
= 2.5V, ID = 500mA
GS
DYNAMIC CHARACTERISTICS Input Capacitance Output Capacitance Reverse Transfer Capacitance
C
iss
C
oss
C
rss
150 pF
25 pF 20 pF
V
f = 1.0MHz
= 16V, VGS = 0V
DS
SWITCHING CHARACTERISTICS Turn-On Delay Time Rise Time Turn-Off Delay Time Fall Time
Notes: 4. Device mounted on FR-4 PCB.
5. Pulse width ≤10μS, Duty Cycle ≤1%
6. Short duration pulse test used to minimize self-heating effect.
t
d(on
t
d(off
t
t
f
⎯ ⎯ ⎯ ⎯
8.5
9.1 51 28
⎯ ⎯ ⎯ ⎯
ns ns ns ns
V
= 10V, RL = 47Ω, ID = 200mA,
DD
4.5V, RG = 10
V
GEN =
DMN2004TK
Document number: DS30936 Rev. 5 - 2
2 of 6
www.diodes.com
November 2010
© Diodes Incorporated
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