Diodes DMN2004DWK User Manual

DMN2004DWK
DUAL N-CHANNEL ENHANCEMENT MODE MOSFET
Product Summary
V
(BR)DSS
20V
R
0.55Ω @ V
DS(on) max
= 4.5V
GS
TA = +25°C
Description
This MOSFET has been designed to minimize the on-state
resistance (R
) and yet maintain superior switching
DS(on)
performance, making it ideal for high efficiency power management
applications.
Applications
Load Switch
ESD PROTECTED TO 2kV
I
D
540mA
SOT363
Top View
Features
Dual N-Channel MOSFET
Low On-Resistance
Low Gate Threshold Voltage
Low Input Capacitance
Fast Switching Speed
Low Input/Output Leakage
Ultra-Small Surface Mount Package
Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2)
Halogen and Antimony Free. “Green” Device (Note 3)
Qualified to AEC-Q101 Standards for High Reliability
Mechanical Data
Case: SOT363
Case Material: Molded Plastic, “Green” Molding
Compound. UL Flammability Classification Rating 94V-0
Moisture Sensitivity: Level 1 per J-STD-020
Terminal Connections: See Diagram
Terminals: Finish - Matte Tin annealed over Alloy 42
leadframe. Solderable per MIL-STD-202, Method 208
Weight: 0.006 grams (approximate)
S
G
D
2
S
2
Top View
Internal Schematic
1
1
G
D
1
2
Ordering Information (Note 4)
Part Number Case Packaging
DMN2004DWK-7 SOT363 3000/Tape & Reel
Notes: 1. No purposely added lead. Fully EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant.
2. See http://www.diodes.com/quality/lead_free.html for more information about Diodes Incorporated’s definitions of Halogen- and Antimony-free, "Green" and Lead-free.
3. Halogen- and Antimony-free "Green” products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and <1000ppm antimony compounds.
4. For packaging details, go to our website at http://www.diodes.com/products/packages.html
Marking Information
NAB YM
NAB YM
NAB YM
NAB YM
NAB = Product Type Marking Code YM = Date Code Marking for SAT (Shanghai Assembly/ Test site) YM = Date Code Marking for CAT (Chengdu Assembly/ Test site) Y or Y = Year (ex: A = 2013) M = Month (ex: 9 = September)
Date Code Key
Year 2006 2007 2008 2009 2010 2011 2012 2013 2014 2015 2016 2017
Code T U V W X Y Z A B C D E
Month Jan Feb Mar Apr May Jun Jul Aug Sep Oct Nov Dec
Code 1 2 3 4 5 6 7 8 9 O N D
DMN2004DWK
Document number: DS30935 Rev. 5 - 2
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e3
January 2014
© Diodes Incorporated
Maximum Ratings (@T
= +25°C, unless otherwise specified.)
A
Characteristic Symbol Value Units
Drain-Source Voltage
Gate-Source Voltage
Drain Current (Note 5) Steady State
Pulsed Drain Current (Note 6)
= +25°C
T
A
T
= +85°C
A
V
DSS
V
GSS
I
D
I
DM
Thermal Characteristics (@T
= +25°C, unless otherwise specified.)
A
Characteristic Symbol Value Units
Total Power Dissipation (Note 5)
Thermal Resistance, Junction to Ambient
Operating and Storage Temperature Range
P
R
T
J, TSTG
D
JA
θ
Electrical Characteristics (@T
= +25°C, unless otherwise specified.)
A
Characteristic Symbol Min Typ Max Unit Test Condition
OFF CHARACTERISTICS (Note 7)
Drain-Source Breakdown Voltage
Zero Gate Voltage Drain Current
Gate-Source Leakage
BV
DSS
I
DSS
I
GSS
20
ON CHARACTERISTICS (Note 7)
Gate Threshold Voltage
V
GS(th)
0.5
0.4
Static Drain-Source On-Resistance
R
DS (ON)
0.5
0.7
Forward Transfer Admittance
Diode Forward Voltage (Note 7)
|Y
|
fs
V
SD
200
0.5
DYNAMIC CHARACTERISTICS
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
Notes: 5. Device mounted on FR-4 PCB.
6. Pulse width 10µS, Duty Cycle ≤1%.
7. Short duration pulse test used to minimize self-heating effect.
DMN2004DWK
Document number: DS30935 Rev. 5 - 2
C
iss
C
oss
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DMN2004DWK
20 V
±8 V
540 390
1.5 A
200 mW
625 °C/W
-65 to +150 °C
V
VGS = 0V, ID = 10µA
1 µA
±1
µA
1.0 V
0.55
0.70
0.9
ms
1.4 V
150 pF
25 pF
20 pF
VDS = 16V, VGS = 0V
VGS = ±4.5V, VDS = 0V
VDS = VGS, ID = 250µA
V
GS
VGS = 2.5V, ID = 500mA
VGS = 1.8V, ID = 350mA
V
DS
VGS = 0V, IS = 115mA
V
DS
f = 1.0MHz
mA
= 4.5V, ID = 540mA
=10V, ID = 0.2A
= 16V, V
= 0V
GS
January 2014
© Diodes Incorporated
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