NEW PRODUCT
DMN10H170SFG
N-CHANNEL ENHANCEMENT MODE MOSFET
POWERDI
D
D
Bottom View
Features
100% Unclamped Inductive Switch (UIS) test in production
Low R
Small form factor thermally efficient package enables higher
density end products
Occupies just 33% of the board area occupied by SO-8 enabling
smaller end product
Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2)
Halogen and Antimony Free. “Green” Device (Note 3)
Qualified to AEC-Q101 Standards for High Reliability
– ensures on state losses are minimized
DS(ON)
Mechanical Data
Case: POWERDI3333
Case Material: Molded Plastic, "Green" Molding Compound.
UL Flammability Classification Rating 94V-0
Moisture Sensitivity: Level 1 per J-STD-020
Terminal Connections Indicator: See diagram
Terminals: Finish Matte Tin annealed over Copper leadframe.
Solderable per MIL-STD-202, Method 208
Weight: 0.034 grams (approximate)
Pin 1
S
S
S
G
D
G
S
Equivalent Circuit
Product Summary
max
I
D
2.9A
2.7A
V
(BR)DSS
100V
R
122m @ V
133m @ VGS = 4.5V
DS(ON)
max
GS
TA = +25°C
= 10V
Description
This MOSFET has been designed to minimize the on-state resistance
(R
) and yet maintain superior switching performance, making it
DS(on)
ideal for high efficiency power management applications.
Applications
Backlighting
Power Management Functions
DC-DC Converters
Top View
POWERDI3333
D
D
Ordering Information (Note 4)
Part Number Compliance Case Packaging
DMN10H170SFG-7 Standard POWERDI3333 2000/Tape & Reel
DMN10H170SFG-13 Standard POWERDI3333 3000/Tape & Reel
Notes: 1. No purposely added lead. Fully EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant.
2. See http://www.diodes.com/quality/lead_free.html for more information about Diodes Incorporated’s definitions of Halogen- and Antimony-free, "Green"
and Lead-free.
3. Halogen- and Antimony-free "Green” products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and
<1000ppm antimony compounds.
4. For packaging details, go to our website at http://www.diodes.com/products/packages.html.
Marking Information
POWERDI is a registered trademark of Diodes Incorporated
G17
DMN10H170SFG
Document number: DS36147 Rev. 4 - 2
G17 = Product marking code
YYWW = Date code marking
YY = Last digit of year (ex: 10 for 2010)
WW = Week code (01 – 53)
1 of 6
www.diodes.com
August 2013
© Diodes Incorporated
®
DMN10H170SFG
Maximum Ratings (@T
= +25°C, unless otherwise specified.)
A
Characteristic Symbol Value Units
Drain-Source Voltage
Gate-Source Voltage
Steady
Continuous Drain Current (Note 6) VGS = 10V
State
t<10s
Maximum Continuous Body Diode Forward Current (Note 6)
Pulsed Drain Current (10µs pulse, duty cycle = 1%)
= +25°C
T
A
T
= +70°C
A
= +25°C
T
C
= +25°C
T
A
T
= +70°C
A
V
DSS
V
GSS
I
D
I
D
I
S
I
DM
Avalanche Current (Note 7) IAR
Avalanche Energy (Note 7) EAR
100 V
±20 V
2.9
2.4
A
8.5
3.7
3.0
A
3.0 A
16 A
5.3 A
20 mJ
NEW PRODUCT
Thermal Characteristics (@T
Characteristic Symbol Value Units
Total Power Dissipation (Note 5)
Thermal Resistance, Junction to Ambient (Note 5)
Total Power Dissipation (Note 6)
Thermal Resistance, Junction to Ambient (Note 6)
Thermal Resistance, Junction to Case (Note 6)
Operating and Storage Temperature Range
= +25°C, unless otherwise specified.)
A
= +25°C
T
A
TA = +70°C
Steady State
t<10s 82 °C/W
= +25°C
T
A
TA = +70°C
Steady State
t<10s 36 °C/W
P
R
P
R
R
T
J, TSTG
JA
JA
JC
D
D
0.94
0.6
137 °C/W
2.0
1.3
60 °C/W
7.0 °C/W
-55 to +150 °C
W
W
Electrical Characteristics (@T
= +25°C, unless otherwise specified.)
A
Characteristic Symbol Min Typ Max Unit Test Condition
OFF CHARACTERISTICS (Note 8)
Drain-Source Breakdown Voltage
Zero Gate Voltage Drain Current
Gate-Source Leakage
BV
I
I
DSS
DSS
GSS
100 — — V
— —
— —
1.0 A
±100 nA
VGS = 0V, ID = 250A
VDS = 100V, VGS = 0V
VGS = ±20V, VDS = 0V
ON CHARACTERISTICS (Note 8)
Gate Threshold Voltage
Static Drain-Source On-Resistance
Forward Transfer Admittance
Diode Forward Voltage
V
GS(th
R
DS(ON)
|Y
V
fs
SD
1.0 — 3.0 V
—
—
—
|
—
99 122
104 133
4.4 — S
0.7 1.0 V
VDS = VGS, ID = 250A
= 10V, ID = 3.3A
V
m
GS
= 4.5V, ID = 3.0A
V
GS
VDS = 10V, ID = 3.3A
VGS = 0V, IS = 3.3A
DYNAMIC CHARACTERISTICS (Note 9)
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
Gate resistance
C
iss
C
oss
C
rss
R
Total Gate Charge (VGS = 4.5V) Qg
Total Gate Charge (VGS = 10V) Qg
Gate-Source Charge
Gate-Drain Charge
Turn-On Delay Time
Turn-On Rise Time
Turn-Off Delay Time
Turn-Off Fall Time
Reverse Recovery Time
Reverse Recovery Charge
Notes: 5. Device mounted on FR-4 substrate PC board, 2oz copper, with minimum recommended pad layout.
6. Device mounted on FR-4 substrate PC board, 2oz copper, with 1inch square copper plate.
7. UIS in production with L = 1.43mH, T
8. Short duration pulse test used to minimize self-heating effect.
POWERDI is a registered trademark of Diodes Incorporated
9. Guaranteed by design. Not subject to product testing.
= +25°C.
J
DMN10H170SFG
Document number: DS36147 Rev. 4 - 2
Q
Q
t
D(on
t
t
D(off
t
f
t
r
Q
r
www.diodes.com
—
—
—
—
—
—
— 3.3 —
s
— 3.0 —
d
— 4.4 —
870.7
40.8
24.6
1.1
7.0
14.9
— 2.3 —
— 13.9 —
— 3.4 —
— 22.4 —
— 19.7 —
2 of 6
—
—
—
—
—
—
pF
V
= 25V, VGS = 0V,
pF
pF
DS
f = 1.0MHz
VDS = 0V, VGS = 0V, f = 1.0MHz
nC
nC
V
= 50V, ID = 3.3A
nC
DS
nC
ns
ns
ns
= 50V, V
V
DD
= 6.0, ID = 3.3A
R
GEN
GEN
ns
ns
I
= 3.3A, dI/dt = 100A/s
S
nC
= 10V,
August 2013
© Diodes Incorporated