Diodes DMHC3025LSD User Manual

4
8
5
C3025LS
Y
Product Summary
Device
N-Channel 30V
P-Channel -30V
V
(BR)DSS
R
25m @ V
40m @ VGS = 4.5V
50m @ V
80m @ VGS = -4.5V
DS(ON)
max
GS
GS
= 10V
= -10V
Description
This new generation complementary MOSFET H-Bridge features low on-resistance achievable with low gate drive.
Applications
DC Motor control  DC-AC Inverters
ADVANCE INFORMATION
SO-8
Top View
DMHC3025LSD
30V COMPLEMENTARY ENHANCEMENT MODE MOSFET H-BRIDGE
Features
2 x N + 2 x P channels in a SOIC package
max
I
D
TA = +25°C
6.0
4.6
-4.2
-3.2
 Low On-Resistance  Low Input Capacitance  Fast Switching Speed  Totally Lead-Free & Fully RoHS compliant (Notes 1 & 2) Halogen and Antimony Free. “Green” Device (Note 3) Qualified to AEC-Q101 Standards for High Reliability
Mechanical Data
Case: SO-8 Case Material: Molded Plastic, "Green" Molding Compound.
UL Flammability Classification Rating 94V-0
Moisture Sensitivity: Level 1 per J-STD-020  Terminal Connections Indicator: See diagram Terminals: Finish Matte Tin annealed over Copper leadframe.
Solderable per MIL-STD-202, Method 208
Weight: 0.008 grams (approximate)
N2D/P2D
P1S/P2S
P1G
H-Bridge
N1G
Top View
Pin Configuration
P2G N2G
N1S/N2S
N1D/P1D
Internal Schematic
Ordering Information (Note 4)
Part Number Case Packaging
DMHC3025LSD-13 SO-8 2500/Tape & Reel
Notes: 1. No purposely added lead. Fully EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant.
2. See http://www.diodes.com/quality/lead_free.html for more information about Diodes Incorporated’s definitions of Halogen- and Antimony-free, "Green" and Lead-free.
3. Halogen- and Antimony-free "Green” products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and <1000ppm antimony compounds.
4. For packaging details, go to our website at http://www.diodes.com/products/packages.html.
Marking Information
1
Y WW
= Manufacturer’s Marking
www.diodes.com
C3025LS = Product Type Marking Code YYWW = Date Code Marking YY = Year (ex: 09 = 2009) WW = Week (01 - 53)
1 of 9
November 2013
© Diodes Incorporated
DMHC3025LSD
Document number: DS35821 Rev. 4 - 2
Thermal Characteristics (@T
A
Characteristic Symbol Value Units
Total Power Dissipation (Note 5)
Thermal Resistance, Junction to Ambient (Note 5)
Thermal Resistance, Junction to Case Operating and Storage Temperature Range
Maximum Ratings N-CHANNEL (@T
Characteristic Symbol Value Units
Drain-Source Voltage Gate-Source Voltage
Continuous Drain Current (Note 5) VGS = 10V
Continuous Drain Current (Note 5) VGS = 4.5V
ADVANCE INFORMATION
Maximum Continuous Body Diode Forward Current (Note 5) Pulsed Drain Current (10s pulse, duty cycle = 1%)
= +25°C, unless otherwise specified.)
Steady State
t < 10s 50
= +25°C, unless otherwise specified.)
A
= +25C
Steady
State
t < 10s
Steady
State
t < 10s
T
A
T
= +70C
A
= +25C
T
A
T
= +70C
A
= +25C
T
A
T
= +70C
A
= +25C
T
A
T
= +70C
A
T
V
DSS
V
GSS
I
I
I
I
I
I
DM
P
D
R
JA
R
JC
J, TSTG
D
D
D
D
S
DMHC3025LSD
1.5 W 83
°C/W
14.5
-55 to 150 °C
30 V
±20 V
6.0
4.8
7.8
6.1
4.6
3.6
6.1
4.8
A
A
A
A
2.5 A
60 A
Maximum Ratings P-CHANNEL (@T
= +25°C, unless otherwise specified.)
A
Characteristic Symbol Value Units
Drain-Source Voltage Gate-Source Voltage
T
= +25C
A
= +70C
T
A
= +25C
T
A
T
= +70C
A
T
= +25C
A
= +70C
T
A
= +25C
T
A
T
= +70C
A
Continuous Drain Current (Note 5) VGS = -10V
Continuous Drain Current (Note 5) VGS = -4.5V
Steady
State
t < 10s
Steady
State
t < 10s
Maximum Continuous Body Diode Forward Current (Note 5) Pulsed Drain Current (10s pulse, duty cycle = 1%)
Note: 5. Device mounted on FR-4 substrate PC board, 2oz copper, with 1inch square copper plate.
DMHC3025LSD
Document number: DS35821 Rev. 4 - 2
2 of 9
www.diodes.com
V
DSS
V
GSS
I
D
I
D
I
D
I
D
I
S
I
DM
30 V
±20 V
-4.2
-3.3
-5.4
-4.3
-3.2
-2.5
-4.3
-3.3
-2.5
A
A
A
A
A
-30 A
November 2013
© Diodes Incorporated
)
g
g
g
)
r
)
r
r
)
g
g
g
)
r
)
r
r
Electrical Characteristics N-CHANNEL (@T
OFF CHARACTERISTICS (Note 6)
Drain-Source Breakdown Voltage Zero Gate Voltage Drain Current Gate-Source Leakage ON CHARACTERISTICS (Note 6) Gate Threshold Voltage
Static Drain-Source On-Resistance
Forward Transfer Admittance Diode Forward Voltage DYNAMIC CHARACTERISTICS (Note 7) Input Capacitance Output Capacitance Reverse Transfer Capacitance Gate resistance Total Gate Charge (VGS = 4.5V) Qg Total Gate Charge (VGS = 10V) Qg Gate-Source Charge Gate-Drain Charge Turn-On Delay Time Turn-On Rise Time
ADVANCE INFORMATION
Turn-Off Delay Time Turn-Off Fall Time Reverse Recovery Time Reverse Recovery Charge
Characteristic Symbol Min Typ Max Unit Test Condition
= +25°C, unless otherwise specified.)
A
BV
I I
V
GS(th
R
DS (ON)
|Y
V
C C C
Q
Q
t
D(on
t
D(off
DSS
DSS
GSS
SD
iss
oss
rss
R
t
t
t
r
Q
30 — — — —
1 — 2 V — — —
|
fs
— — — — — — —
s
d
f
r
— — — — — — —
19 25 26 40
4 — S
0.70 1.2 V
590 122
58
1.5
5.4
11.7
1.8
2.1
11.2 15
17.5
8.7
18.3 12
— V
0.5 A ±1 A
m
— —
pF — —
— — —
nC
— — — —
ns
— — —
ns
nC
DMHC3025LSD
VGS = 0V, ID = 250A VDS = 30V, VGS = 0V VGS = ±20V, VDS = 0V
VDS = VGS, ID = 250A
= 10V, ID = 5A
V
GS
V
= 4.5V, ID = 4A
GS
VDS = 5V, ID = 5A VGS = 0V, IS = 1.7A
= 15V, VGS = 0V,
V
DS
f = 1MHz
VDS = 0V, VGS = 0V, f = 1MHz
V
= 15V, ID = 7.8A
DS
= 15V, VGS = 4.5V,
V
DD
= 2.4, RG = 1,
R
L
I
= 12A, di/dt = 500A/s
F
Electrical Characteristics P-CHANNEL (@T
= +25°C, unless otherwise specified.)
A
Characteristic Symbol Min Typ Max Unit Test Condition
OFF CHARACTERISTICS (Note 6)
Drain-Source Breakdown Voltage Zero Gate Voltage Drain Current Gate-Source Leakage
BV
I I
DSS
DSS
GSS
-30 — — — —
— —
-0.5 A ±1 A
V
VGS = 0V, ID = -250A VDS = -30V, VGS = 0V
VGS = ±20V, VDS = 0V ON CHARACTERISTICS (Note 6) Gate Threshold Voltage
Static Drain-Source On-Resistance
Forward Transfer Admittance Diode Forward Voltage
V
GS(th
R
DS (ON)
|Y
V
fs
SD
-1 — -2 V — — —
|
43 50 68 80
3.5 — S
-0.7 -1.2 V
VDS = VGS, ID = -250A
= -10V, ID = -5A
V
m
GS
V
= -4.5V, ID = -4A
GS
VDS = -5V, ID = -5A
VGS = 0V, IS = -1.7A DYNAMIC CHARACTERISTICS (Note 7) Input Capacitance Output Capacitance Reverse Transfer Capacitance Gate resistance
C
iss
C
oss
C
rss
R Total Gate Charge (VGS = 4.5V) Qg Total Gate Charge (VGS = 10V) Qg Gate-Source Charge Gate-Drain Charge Turn-On Delay Time Turn-On Rise Time Turn-Off Delay Time Turn-Off Fall Time Reverse Recovery Time Reverse Recovery Charge
Notes: 6. Short duration pulse test used to minimize self-heating effect.
7. Guaranteed by design. Not subject to product testing.
Q Q
t
D(on
t
D(off
Q
t
t
t
r
— — — — — — —
s
d
f
r
— — — — — — —
631 137
70
10.8
5.5
11.4
1.8
2.4
7.5
4.9
28.2
13.5
15.1
15.3
— — — — — — — — — — — — — —
pF pF pF
= -15V, VGS = 0V,
V
DS
f = 1MHz
VDS = 0V, VGS = 0V, f = 1MHz nC nC
V
= -15V, ID = -6A
nC
DS
nC ns ns ns
= -15V, VGS = -10V,
V
DD
R
= 6, ID = -1A
G
ns ns nC
= 12A, di/dt = 500A/s
I
F
DMHC3025LSD
Document number: DS35821 Rev. 4 - 2
3 of 9
www.diodes.com
November 2013
© Diodes Incorporated
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