NEW PRODUCT
Product Summary
Device
N-Channel 30V
P-Channel -30V
V
(BR)DSS
R
25m @ V
40m @ VGS = 4.5V
50m @ V
80m @ VGS = -4.5V
DS(ON)
max
GS
GS
= 10V
= -10V
Description
This new generation complementary MOSFET H-Bridge features low
on-resistance achievable with low gate drive.
Applications
DC Motor control
DC-AC Inverters
ADVANCE INFORMATION
SO-8
Top View
DMHC3025LSD
30V COMPLEMENTARY ENHANCEMENT MODE MOSFET H-BRIDGE
Features
2 x N + 2 x P channels in a SOIC package
max
I
D
TA = +25°C
6.0
4.6
-4.2
-3.2
Low On-Resistance
Low Input Capacitance
Fast Switching Speed
Totally Lead-Free & Fully RoHS compliant (Notes 1 & 2)
Halogen and Antimony Free. “Green” Device (Note 3)
Qualified to AEC-Q101 Standards for High Reliability
Mechanical Data
Case: SO-8
Case Material: Molded Plastic, "Green" Molding Compound.
UL Flammability Classification Rating 94V-0
Moisture Sensitivity: Level 1 per J-STD-020
Terminal Connections Indicator: See diagram
Terminals: Finish Matte Tin annealed over Copper leadframe.
Solderable per MIL-STD-202, Method 208
Weight: 0.008 grams (approximate)
N2D/P2D
P1S/P2S
P1G
H-Bridge
N1G
Top View
Pin Configuration
P2G N2G
N1S/N2S
N1D/P1D
Internal Schematic
Ordering Information (Note 4)
Part Number Case Packaging
DMHC3025LSD-13 SO-8 2500/Tape & Reel
Notes: 1. No purposely added lead. Fully EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant.
2. See http://www.diodes.com/quality/lead_free.html for more information about Diodes Incorporated’s definitions of Halogen- and Antimony-free, "Green"
and Lead-free.
3. Halogen- and Antimony-free "Green” products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and
<1000ppm antimony compounds.
4. For packaging details, go to our website at http://www.diodes.com/products/packages.html.
Marking Information
1
Y WW
= Manufacturer’s Marking
www.diodes.com
C3025LS = Product Type Marking Code
YYWW = Date Code Marking
YY = Year (ex: 09 = 2009)
WW = Week (01 - 53)
1 of 9
November 2013
© Diodes Incorporated
DMHC3025LSD
Document number: DS35821 Rev. 4 - 2
NEW PRODUCT
Thermal Characteristics (@T
A
Characteristic Symbol Value Units
Total Power Dissipation (Note 5)
Thermal Resistance, Junction to Ambient (Note 5)
Thermal Resistance, Junction to Case
Operating and Storage Temperature Range
Maximum Ratings N-CHANNEL (@T
Characteristic Symbol Value Units
Drain-Source Voltage
Gate-Source Voltage
Continuous Drain Current (Note 5) VGS = 10V
Continuous Drain Current (Note 5) VGS = 4.5V
ADVANCE INFORMATION
Maximum Continuous Body Diode Forward Current (Note 5)
Pulsed Drain Current (10s pulse, duty cycle = 1%)
= +25°C, unless otherwise specified.)
Steady State
t < 10s 50
= +25°C, unless otherwise specified.)
A
= +25C
Steady
State
t < 10s
Steady
State
t < 10s
T
A
T
= +70C
A
= +25C
T
A
T
= +70C
A
= +25C
T
A
T
= +70C
A
= +25C
T
A
T
= +70C
A
T
V
DSS
V
GSS
I
I
I
I
I
I
DM
P
D
R
JA
R
JC
J, TSTG
D
D
D
D
S
DMHC3025LSD
1.5 W
83
°C/W
14.5
-55 to 150 °C
30 V
±20 V
6.0
4.8
7.8
6.1
4.6
3.6
6.1
4.8
A
A
A
A
2.5 A
60 A
Maximum Ratings P-CHANNEL (@T
= +25°C, unless otherwise specified.)
A
Characteristic Symbol Value Units
Drain-Source Voltage
Gate-Source Voltage
T
= +25C
A
= +70C
T
A
= +25C
T
A
T
= +70C
A
T
= +25C
A
= +70C
T
A
= +25C
T
A
T
= +70C
A
Continuous Drain Current (Note 5) VGS = -10V
Continuous Drain Current (Note 5) VGS = -4.5V
Steady
State
t < 10s
Steady
State
t < 10s
Maximum Continuous Body Diode Forward Current (Note 5)
Pulsed Drain Current (10s pulse, duty cycle = 1%)
Note: 5. Device mounted on FR-4 substrate PC board, 2oz copper, with 1inch square copper plate.
DMHC3025LSD
Document number: DS35821 Rev. 4 - 2
2 of 9
www.diodes.com
V
DSS
V
GSS
I
D
I
D
I
D
I
D
I
S
I
DM
30 V
±20 V
-4.2
-3.3
-5.4
-4.3
-3.2
-2.5
-4.3
-3.3
-2.5
A
A
A
A
A
-30 A
November 2013
© Diodes Incorporated
NEW PRODUCT
Electrical Characteristics N-CHANNEL (@T
OFF CHARACTERISTICS (Note 6)
Drain-Source Breakdown Voltage
Zero Gate Voltage Drain Current
Gate-Source Leakage
ON CHARACTERISTICS (Note 6)
Gate Threshold Voltage
Static Drain-Source On-Resistance
Forward Transfer Admittance
Diode Forward Voltage
DYNAMIC CHARACTERISTICS (Note 7)
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
Gate resistance
Total Gate Charge (VGS = 4.5V) Qg
Total Gate Charge (VGS = 10V) Qg
Gate-Source Charge
Gate-Drain Charge
Turn-On Delay Time
Turn-On Rise Time
ADVANCE INFORMATION
Turn-Off Delay Time
Turn-Off Fall Time
Reverse Recovery Time
Reverse Recovery Charge
Characteristic Symbol Min Typ Max Unit Test Condition
= +25°C, unless otherwise specified.)
A
BV
I
I
V
GS(th
R
DS (ON)
|Y
V
C
C
C
Q
Q
t
D(on
t
D(off
DSS
DSS
GSS
SD
iss
oss
rss
R
t
t
t
r
Q
30
— —
— —
1 — 2 V
—
—
—
|
fs
—
—
—
—
—
—
—
—
s
d
f
r
—
—
—
—
—
—
—
—
19 25
26 40
4 — S
0.70 1.2 V
590
122
58
1.5
5.4
11.7
1.8
2.1
11.2
15
17.5
8.7
18.3
12
— V
0.5 A
±1 A
m
—
—
pF
—
—
—
—
—
nC
—
—
—
—
ns
—
—
—
ns
nC
DMHC3025LSD
VGS = 0V, ID = 250A
VDS = 30V, VGS = 0V
VGS = ±20V, VDS = 0V
VDS = VGS, ID = 250A
= 10V, ID = 5A
V
GS
V
= 4.5V, ID = 4A
GS
VDS = 5V, ID = 5A
VGS = 0V, IS = 1.7A
= 15V, VGS = 0V,
V
DS
f = 1MHz
VDS = 0V, VGS = 0V, f = 1MHz
V
= 15V, ID = 7.8A
DS
= 15V, VGS = 4.5V,
V
DD
= 2.4, RG = 1,
R
L
I
= 12A, di/dt = 500A/s
F
Electrical Characteristics P-CHANNEL (@T
= +25°C, unless otherwise specified.)
A
Characteristic Symbol Min Typ Max Unit Test Condition
OFF CHARACTERISTICS (Note 6)
Drain-Source Breakdown Voltage
Zero Gate Voltage Drain Current
Gate-Source Leakage
BV
I
I
DSS
DSS
GSS
-30
— —
— —
— —
-0.5 A
±1 A
V
VGS = 0V, ID = -250A
VDS = -30V, VGS = 0V
VGS = ±20V, VDS = 0V
ON CHARACTERISTICS (Note 6)
Gate Threshold Voltage
Static Drain-Source On-Resistance
Forward Transfer Admittance
Diode Forward Voltage
V
GS(th
R
DS (ON)
|Y
V
fs
SD
-1 — -2 V
—
—
—
|
—
43 50
68 80
3.5 — S
-0.7 -1.2 V
VDS = VGS, ID = -250A
= -10V, ID = -5A
V
m
GS
V
= -4.5V, ID = -4A
GS
VDS = -5V, ID = -5A
VGS = 0V, IS = -1.7A
DYNAMIC CHARACTERISTICS (Note 7)
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
Gate resistance
C
iss
C
oss
C
rss
R
Total Gate Charge (VGS = 4.5V) Qg
Total Gate Charge (VGS = 10V) Qg
Gate-Source Charge
Gate-Drain Charge
Turn-On Delay Time
Turn-On Rise Time
Turn-Off Delay Time
Turn-Off Fall Time
Reverse Recovery Time
Reverse Recovery Charge
Notes: 6. Short duration pulse test used to minimize self-heating effect.
7. Guaranteed by design. Not subject to product testing.
Q
Q
t
D(on
t
D(off
Q
t
t
t
r
—
—
—
—
—
—
—
s
d
f
r
—
—
—
—
—
—
—
631
137
70
10.8
5.5
11.4
1.8
2.4
7.5
4.9
28.2
13.5
15.1
15.3
—
—
—
—
—
—
—
—
—
—
—
—
—
—
pF
pF
pF
= -15V, VGS = 0V,
V
DS
f = 1MHz
VDS = 0V, VGS = 0V, f = 1MHz
nC
nC
V
= -15V, ID = -6A
nC
DS
nC
ns
ns
ns
= -15V, VGS = -10V,
V
DD
R
= 6, ID = -1A
G
ns
ns
nC
= 12A, di/dt = 500A/s
I
F
DMHC3025LSD
Document number: DS35821 Rev. 4 - 2
3 of 9
www.diodes.com
November 2013
© Diodes Incorporated