Pulsed Drain Current (10μs pulse, duty cycle = 1%)
Maximum Continuous Body Diode Forward Current (Note 4)
Avalanche Current (Note 5) L = 0.1mH
Repetitive Avalanche Energy (Note 5) L = 0.1mH
T
= 25°C
A
T
= 70°C
A
= 25°C
T
A
= 70°C
T
A
V
DSS
V
GSS
I
D
I
D
I
DM
I
S
I
AR
E
AR
30 V
±20 V
10.5
8.5
14
11
A
A
90 A
3.0 A
22 A
24 mJ
Thermal Characteristics@T
ADVANCE INFORMATION
Total Power Dissipation (Note 3)
Thermal Resistance, Junction to Ambient (Note 3)
Total Power Dissipation (Note 4)
Thermal Resistance, Junction to Ambient (Note 4)
Thermal Resistance, Junction to Case (Note 4)
Operating and Storage Temperature Range
= 25°C unless otherwise specified
A
Characteristic Symbol Value Units
Steady state
t<10s 1.5
Steady state
t<10s 78
Steady state
t<10s 3.5
Steady state
t<10s 33
P
R
P
R
R
T
J, TSTG
D
JA
θ
D
JA
θ
JC
0.9
142
2.2
W
°C/W
W
59
°C/W
11
-55 to +150 °C
100
(A)
E
D
I, D
10
0.1
P = 10sWµ
R
DS(on)
Limited
DC
P = 10s
W
1
P = 1s
W
P = 100ms
W
P = 10ms
W
P = 1ms
W
P = 100µs
W
(W)
IWE
ANSIEN
EAK
100
90
80
70
60
50
40
30
Single Pulse
°
R = 140C/W
θ
JA
R = r * R
θθ
JA(t) (t)JA
T - T = P * R
JAJA(t)
θ
20
(PK)
10
0
0.001 0.010.1110100 1,0000.0001
t1, PULSE DURATION TIME (sec)
Fig. 1 Single Pulse Maximum Power Dissipation
0.01
0.010.1110100
V , DRAIN-SOURCE VOLTAGE (V)
DS
Fig. 2 SOA, Safe Operation Area
POWERDI is a registered trademark of Diodes Incorporated
Characteristic Symbol Min Typ Max Unit Test Condition
OFF CHARACTERISTICS (Note 6)
Drain-Source Breakdown Voltage
Zero Gate Voltage Drain Current
Gate-Source Leakage
BV
I
I
DSS
DSS
GSS
30 - - V
- - 1 A
- - ±100 nA
VGS = 0V, ID = 250A
VDS = 30V, VGS = 0V
VGS = ±20V, VDS = 0V
ON CHARACTERISTICS (Note 6)
Gate Threshold Voltage
Static Drain-Source On-Resistance
Forward Transfer Admittance
Diode Forward Voltage
V
GS(th
R
DS (ON)
|Y
V
fs
SD
1.4 - 2.5 V
- 7 11
- 11 15
|
- 74 - S
- 0.75 1.0 V
VDS = VGS, ID = 250A
= 10V, ID = 20A
V
mΩ
GS
V
= 4.5V, ID = 20A
GS
VDS = 5V, ID = 20A
VGS = 0V, IS = 1A
DYNAMIC CHARACTERISTICS (Note 7)
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
Gate resistance
C
iss
C
oss
C
rss
R
Total Gate Charge (VGS = 4.5V) Qg
Total Gate Charge (VGS = 10V) Qg
Gate-Source Charge
Gate-Drain Charge
Turn-On Delay Time
Turn-On Rise Time
Turn-Off Delay Time
Turn-Off Fall Time
Reverse Recovery Time
Reverse Recovery Charge
Notes: 3. Device mounted on FR-4 substrate PC board, 2oz copper, with minimum recommended pad layout.
4. Device mounted on FR-4 substrate PC board, 2oz copper, with 1inch square copper plate.
5. I
and EAR rating are based on low frequency and duty cycles to keep TJ = 25°C
AR
6. Short duration pulse test used to minimize self-heating effect.
7. Guaranteed by design. Not subject to product testing.
Q
Q
t
D(on
t
D(off
T
Q
s
d
t
t
f
r
r
- 1281 - pF
- 145 - pF
- 125 - pF
- 1.2 -
- 12.5 - nC
- 26.7 - nC
- 3.6 - nC
- 4.4 - nC
- 5.2 - ns
- 21.2 - ns
- 22.3 - ns
- 5.1 - ns
- 8.5 - ns
- 7.0 - nC
V
= 15V, VGS = 0V,
DS
f = 1.0MHz
Ω
VDS = 0V, VGS = 0V, f = 1.0MHz
V
= 15V, ID = 12A
DS
V
= 15V, VGS = 10V,
DD
R
= 1.25, RG = 3,
L
IF = 12A, di/dt = 500A/s
IF = 12A, di/dt = 500A/s
POWERDI is a registered trademark of Diodes Incorporated