Diodes DMG6898LSD User Manual

Page 1
Features
• Low On-Resistance
• Low Input Capacitance
• Fast Switching Speed
• Low Input/Output Leakage
• ESD Protected Up To 2kV
• Lead Free By Design/RoHS Compliant (Note 1)
• "Green" Device (Note 2)
• Qualified to AEC-Q101 Standards for High Reliability
ESD PROTECTED TO 2kV
DUAL N-CHANNEL ENHANCEMENT MODE MOSFET
Mechanical Data
• Case: SO-8
• Case Material: Molded Plastic, “Green” Molding Compound.
UL Flammability Classification Rating 94V-0
• Moisture Sensitivity: Level 1 per J-STD-020
• Terminal Connections: See Diagram Below
• Weight: 0.072 grams (approximate)
D1
D1 D2
D2
Top View Top View
Internal Schematic
DMG6898LSD
G1
S1 G2 S2
Ordering Information (Note 3)
Part Number Qualification Case Packaging
DMG6898LSD-13 Commercial SO-8 2500 / Tape & Reel
DMG6898LSDQ-13 Automotive SO-8 2500 / Tape & Reel
Notes: 1. EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant. No purposely added lead. Halogen and Antimony free.
2. Diodes Inc.’s “Green” Policy can be found on our website at http://www.diodes.com
3. For packaging details, go to our website at http://www.diodes.com.
Marking Information
DMG6898LSD
Document number: DS31947 Rev. 4 - 2
8 5
G6898LD
YY
WW
1 4
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Logo Part no.
Xth week: 01 ~ 53 Y ear: “08” = 2008 “09” = 2009
March 2012
© Diodes Incorporated
Page 2
)
g
g
g
)
r
)
Maximum Ratings @T
= 25°C unless otherwise specified
A
Characteristic Symbol Value Unit Drain-Source Voltage Gate-Source Voltage
T
Continuous Drain Current (Note 4)
Steady
State
= 25°C
A
= 85°C
T
A
Pulsed Drain Current (Note 5)
Thermal Characteristics
Characteristic Symbol Value Unit
Power Dissipation (Note 4) Thermal Resistance, Junction to Ambient @TA = 25°C (Note 4) R Operating and Storage Temperature Range
DMG6898LSD
V
DSS
V
GSS
I
D
I
DM
P
D
θJA
, T
T
J
STG
20 V
±12 V
9.5
7.1
A
30 A
1.28 W
99.3 °C/W
-55 to +150 °C
Electrical Characteristics @T
= 25°C unless otherwise specified
A
Characteristic Symbol Min Typ Max Unit Test Condition
OFF CHARACTERISTICS (Note 6)
Drain-Source Breakdown Voltage Zero Gate Voltage Drain Current TJ = 25°C I Gate-Source Leakage
BV
I
DSS DSS GSS
20 - - V
- - 1.0 μA
- - ±10 μA
VGS = 0V, ID = 250μA VDS = 20V, VGS = 0V
VGS = ±12V, VDS = 0V ON CHARACTERISTICS (Note 6) Gate Threshold Voltage
Static Drain-Source On-Resistance Forward Transfer Admittance
Diode Forward Voltage
V
GS(th
R
DS (ON)
|Y V
fs
SD
0.5 1.0 1.5 V
-
|
- 17 - S
- 0.7 1.2 V
11 17
16 23
VDS = VGS, ID = 250μA
V
= 4.5V, ID = 9.4A
mΩ
GS
VGS = 2.5V, ID = 8.3A
VDS = 5V, ID = 9.4A
VGS = 0V, IS = 1.3A DYNAMIC CHARACTERISTICS (Note 7) Input Capacitance Output Capacitance Reverse Transfer Capacitance Gate Resistance
C
iss
C
oss
C
rss
R Total Gate Charge (VGS = 4.5V) Qg Total Gate Charge (VGS = 10V) Qg Gate-Source Charge Gate-Drain Charge Turn-On Delay Time Turn-On Rise Time Turn-Off Delay Time Turn-Off Fall Time
Notes: 4. Device mounted on FR-4 PCB, with minimum recommended pad layout.
5. Repetitive rating, pulse width limited by junction temperature.
6. Short duration pulse test used to minimize self-heating effect.
7. Guaranteed by design. Not subject to production testing.
DMG6898LSD
Document number: DS31947 Rev. 4 - 2
Q
s
Q
d
t
D(on
t
t
D(off
t
f
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1149
­157
­142
-
1.51
-
11.6
-
-
-
-
-
-
-
-
26
2.7
3.4
11.67
12.49
35.89
12.33
- pF
- pF
- pF
- Ω
V
DS
f = 1.0MHz VDS = 0V, VGS = 0V, f = 1MHz
- nC
- nC
- nC
V
GS
I
D
- nC
- ns
- ns
- ns
V
DD
R
GEN
- ns
= 10V, VGS = 0V,
= 4.5V, VDS = 10V,
= 9.4A
= 10V, VGS = 4.5V,
= 6Ω, ID = 1A
© Diodes Incorporated
March 2012
Page 3
RAIN CUR
REN
T
R
R
OUR
CE ON-R
TANC
R
R
OUR
CE ON-R
TANC
20
V = 8.0V
GS
V = 4.5V
GS
15
V = 3.0V
GS
V = 2.5V
GS
V = 2.0V
GS
10
D
I , DRAIN CURRENT (A)
5
0
0 0.5 1 1.5 2
V , DRAIN-SOURCE VOLTAGE (V)
DS
V = 1.8V
GS
V = 1.5V
GS
Fig. 1 Typical Output Ch ar acteristic
0.06
Ω
20
V = 10V
15
DS
(A)
10
D
I, D
5
T = 150°C
A
T = 125°C
A
0
0 0.5 1 1.5 2 2.5 3
V , GATE-SOURCE VOLTAGE (V)
GS
Fig. 2 Typical Transfer Characteristic
0.04
Ω
DMG6898LSD
T = 85°C
A
T = 25°C
A
T = -55°C
A
E ( )
0.05
V = 4.5V
0.04
V = 1.8V
GS
0.03
ESIS
GS
0.03
0.02
V = 2.5V
GS
V = 4.5V
0.01
DS(ON)
R , DRAIN-SOURCE ON-RESISTANCE ( )
0
0 2 4 6 8101214161820
I , DRAIN-SOURCE CURRENT (A)
D
Fig. 3 Typical On-Resistance
GS
vs. Drain Current and Gate Voltage
1.6
1.4
1.2
V = 4.5V
GS
1.0
I = 500mA
D
0.8
DSON
R , DRAIN-SOURCE
0.6
ON-RESISTANCE (NORMALIZED)
V = 2.5V
GS
I = 150mA
D
T = 150°C
0.02
AIN-S
0.01
, D
DS(ON)
0
A
T = 125°C
A
T = 85°C
A
T = 25°C
A
T = -55°C
A
0246 8101214161820
I , DRAIN CURRENT (A)
D
0.04
Ω
Fig. 4 Typical On-Resistance
vs. Drain C urrent an d Tempera tu r e
E ( )
0.03
ESIS
V = 4.5V
0.02
AIN-S
0.01
GS
I = 500mA
D
V = 2.5V
GS
I = 150mA
D
, D
DSON
0.4
-50 -25 0 25 50 75 100 125 150 T , AMBIENT TEMPERATURE (°C)
A
Fig. 5 On-Resistance Variation with Temperature
0
-50 -25 0 25 50 75 100 125 150 T , AMBIENT TEMPERATURE (°C)
A
Fig. 6 On-Resistance Variation with Temperature
DMG6898LSD
Document number: DS31947 Rev. 4 - 2
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March 2012
© Diodes Incorporated
Page 4
OUR
CE CUR
REN
T
C, CAPACITAN
C
F
GE CUR
RENT
DMG6898LSD
1.8
20
1.6
1.4
15
(A)
T = 25°C
A
1.2
I = 1mA
1.0
D
10
0.8
I = 250µA
D
0.6
S
5
0.4
GS(TH)
0.2
V , GATE THRESHOLD VOLTAGE (V)
0
-50 -25 0 25 50 75 100 125 150 T , AMBIENT TEMPERATURE (°C)
A
Fig. 7 Gate Threshold Variation vs. Ambient Temperature
1,800
I, S
0
0.4 0.6 0.8 1 1.2 V , SOURCE-DRAIN VOLTAGE (V)
SD
Fig. 8 Diode Forward Voltage vs. Current
10,000
1,600
T = 150°C
1,400
)
1,200
E (p
1,000
(nA)
1,000
C
iss
A
T = 125°C
A
100
800
600
400
C
200
0
0 5 10 15 20
V , DRAIN-SOURCE VOLTAGE (V)
DS
oss
C
rss
Fig. 9 Typical Total Capacitance
10
V = 10V
8
DS
I = 9.4A
D
6
4
G
2
GS
V , ATE-SOURCE VOLTAGE (V)
0
04 81216202428
Q , OTAL GATE CHARGE (nC)
T
g
Fig. 11 Gat e- Source Voltage vs. Total Gate Char ge
T = 85°C
10
DSS
I , LEAKA
A
T = 25°C
A
T = -55°C
A
1
0 2 4 6 8 101214161820
V , DRAIN-SOURCE VOLTAGE (V)
DS
Fig. 10 Typical Leakage Current
vs. Drain-S ource Volta ge
DMG6898LSD
Document number: DS31947 Rev. 4 - 2
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© Diodes Incorporated
Page 5
T
R
T T
HER
R
TANC
1
E
D = 0.7
D = 0.5 D = 0.3
ESIS
0.1
D = 0.1
MAL
D = 0.05
D = 0.02
0.01
D = 0.01
ANSIEN
D = 0.005
r(t),
0.001
D = Single P ulse
0.0001
Package Outline Dimensions
e
D
Suggested Pad Layout
D = 0.9
R (t) = r(t) *
θ
JA
R = 205°C/W
JA
P(pk)
t
1
t
2
T - T = P * R (t)
JA JA12θ
Duty Cycle, D = t /t
R
θθJA
0.001 0.01 0.1 1 10 100 1,000 t , PULSE DURA TION TIME (s)
1
Fig. 12 Transient Thermal Response
SO-8
Dim Min Max
A - 1.75
E1
E
A1
Detail ‘A’
L
0.254
Gaug e Plan e Seating Plane
A1 0.10 0.20 A2 1.30 1.50 A3 0.15 0.25
b 0.3 0.5 D 4.85 4.95 E 5.90 6.10
7°~9
h
°
45
A2
A3
A
b
X
°
Detail ‘A’
E1 3.85 3.95
e 1.27 Typ
h - 0.35
L 0.62 0.82
0° 8°
θ
All Dimensions in mm
Dimensions Value (in mm)
X 0.60
C1
Y 1.55
C1 5.4
C2
Y
C2 1.27
DMG6898LSD
DMG6898LSD
Document number: DS31947 Rev. 4 - 2
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© Diodes Incorporated
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DIODES INCORPORATED MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARDS TO THIS DOCUMENT, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION).
Diodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes without further notice to this document and any product described herein. Diodes Incorporated does not assume any liability arising out of the application or use of this document or any product described herein; neither does Diodes Incorporated convey any license under its patent or trademark rights, nor the rights of others. Any Customer or user of this document o r products described herein in such applica tions shall assume all risks of such use and will agree to hold Diodes Incorporated and all the companies whose products are represented on Diodes Incorporated website, harmless against all damages.
Diodes Incorporated does not warrant or accept any liability whatsoever in respect of any products purchased through unauthorized sales channel. Should Customers purchase or use Diodes Incorporated products for any unintended or unauthorize d application, Customers shall indemnify and
hold Diodes Incorporated and its representatives harmless against all claims, damages, expenses, and attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized application.
Products described herein may be covered by one or more United States, international or foreign patents pending. Product names and markings noted herein may also be covered by one or more United States, international or foreign trademarks.
Diodes Incorporated products are specifically not authorized for use as critical components in life support devices or systems without the express written approval of the Chief Executive Officer of Diodes Incorporated. As used herein:
A. Life support devices or systems are devices or systems which:
1. are intended to implant into the body, or
labeling can be reasonably expected to result in significant injury to the user. B. A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the
failure of the life support device or to affect its safety or effectiveness. Customers represent that they have all necessary expertise in the safety and regulatory ramifications of their life support devices or systems, and
acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any use of Diodes Incorporated products in such safety-critical, life support devices or systems, notwithstanding any devices- or systems-related information or support that may be provided by Diodes Incorporated. Further, Customers must fully indemnify Diodes Incorporated and its representatives against any damages arising out of the use of Diodes Incorporated products in such safety-critical, life support devices or systems.
Copyright © 2012, Diodes Incorporated
www.diodes.com
2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the
IMPORTANT NOTICE
LIFE SUPPORT
DMG6898LSD
DMG6898LSD
Document number: DS31947 Rev. 4 - 2
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