Diodes DMG4413LSS User Manual

Product Summary
V
R
(BR)DSS
-30V
7.5m @ V
10.2m @ VGS = -4.5V
DS(ON)
max
= -10V
GS
TA = +25°C
Description
This MOSFET has been designed to minimize the on-state
resistance (R
performance, making it ideal for high efficiency power management
applications.
) and yet maintain superior switching
DS(ON)
Applications
Backlighting
Power Management Functions
DC-DC Converters
SO-8
S
S
G
Top View Top View
I
max
D
-12A
-10A
DMG4413LSS
30V P-CHANNEL ENHANCEMENT MODE MOSFET
Features and Benefits
Low On-Resistance
Low Input Capacitance
Fast Switching Speed
Totally Lead-Free & Fully RoHS compliant (Note 1 & 2)
Halogen and Antimony Free. “Green” Device (Note 3)
Qualified to AEC-Q101 Standards for High Reliability
Mechanical Data
Case: SO-8
Case Material: Molded Plastic, "Green" Molding Compound.
UL Flammability Classification Rating 94V-0
Moisture Sensitivity: Level 1 per J-STD-020
Terminal Connections Indicator: See diagram below
Terminals: Finish Matte Tin annealed over Copper lead
frame. Solderable per MIL-STD-202, Method 208
Weight: 0.074 grams (approximate)
DS
D
D
D
G
D
S
Pin-out
Equivalent Circuit
Ordering Information (Note 4)
Part Number Case Packaging
DMG4413LSS-13 SO-8 2500/Tape & Reel
Notes: 1. No purposely added lead. Fully EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant.
2. See http://www.diodes.com/quality/lead_free.html for more information about Diodes Incorporated’s definitions of Halogen- and Antimony-free, "Green" and Lead-free.
3. Halogen- and Antimony-free "Green” products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and <1000ppm antimony compounds.
4. For packaging details, go to our website at http://www.diodes.com/products/packages.html.
Marking Information
DMG4413LSS
Document number: DS31754 Rev. 5 - 2
8 5
P4413LS
WW
YY
1 4
Chengdu A/T Site Shanghai A/T Site
8 5
P4413LS
YY
WW
1 4
= Manufacturer’s Marking P4413LS = Product Type Marking Code YYWW = Date Code Marking YY or YY = Year (ex: 13 = 2013) WW = Week (01 - 53) YY = Date Code Marking for SAT (Shanghai Assembly/ Test site) YY = Date Code Marking for CAT (Chengdu Assembly/ Test site)
1 of 5
www.diodes.com
September 2013
© Diodes Incorporated
)
)
r
)
DMG4413LSS
Maximum Ratings (@T
= +25°C, unless otherwise specified.)
A
Characteristic Symbol Value Units
Drain-Source Voltage Gate-Source Voltage
Continuous Drain Current (Note 6) VGS = -10V
Continuous Drain Current (Note 6) VGS = -4.5V
Pulsed Drain Current (10µs pulse, duty cycle = 1%) Maximum Body Diode continuous Current
Steady
State
t<10s
Steady
State
t<10s
= +25°C
T
A
T
= +70°C
A
= +25°C
T
A
= +70°C
T
A
= +25°C
T
A
T
= +70°C
A
T
= +25°C
A
= +70°C
T
A
V
DSS
V
GSS
I
D
I
D
I
D
I
D
I
DM
I
S
-30 V
±20 V
-12
-10
-22
-17
-10
-8
-18
-14
A
A
A
A
-100 A
-4 A
Thermal Characteristics
Characteristic Symbol Value Units
= +25°C
T
Total Power Dissipation (Note 5)
Thermal Resistance, Junction to Ambient (Note 5)
Total Power Dissipation (Note 6)
Thermal Resistance, Junction to Ambient (Note 6)
Thermal Resistance, Junction to Case (Note 6) Operating and Storage Temperature Range
A
TA = +70°C
Steady State
t<10s 22
= +25°C
T
A
TA = +70°C
Steady State
t<10s 17
Steady State
P
R
P
R
R
T
J, TSTG
θJA
θJA
θJC
D
D
Electrical Characteristics (@T
= +25°C, unless otherwise specified.)
A
Characteristic Symbol Min Typ Max Unit Test Condition
OFF CHARACTERISTICS (Note 7)
Drain-Source Breakdown Voltage Zero Gate Voltage Drain Current Gate-Source Leakage
BV
I
DSS
I
GSS
DSS
-30
-1
1 A
ON CHARACTERISTICS (Note 7)
Gate Threshold Voltage
Static Drain-Source On-Resistance
Forward Transconductance Diode Forward Voltage
V
R
DS(ON)
V
GS(th
g
fs
SD
-1.1 1.6 -2.1 V

 
6.3
7.9
26
-0.7 -1.0 V
7.5
10.2
DYNAMIC CHARACTERISTICS (Note 8) Input Capacitance Output Capacitance Reverse Transfer Capacitance
Gate Resistance
C
iss
C
oss
C
rss
R

G
4965 1487
711
7.3
  

SWITCHING CHARACTERISTICS (Note 8) Total Gate Charge Gate-Source Charge Gate-Drain Charge Turn-On Delay Time Rise Time Turn-Off Delay Time Fall Time
Notes: 5. Device mounted on FR-4 substrate PC board, 2oz copper, with minimum recommended pad layout.
6. Device mounted on FR-4 substrate PC board, 2oz copper, with 1inch square copper plate.
7. Short duration pulse test used to minimize self-heating effect.
8. Guaranteed by design. Not subject to product testing.
Q
G
Q
GS
Q
GD
t
d(on
t
t

d(off
t

f
DMG4413LSS
Document number: DS31754 Rev. 5 - 2





2 of 5
www.diodes.com
46
17
16
15
9
160
66







1.7
1.1 74
°C/W
2.2
1.4 56
°C/W
2.5
-55 to 150 °C
V
V
= 0V, ID = -250µA
GS
A
V
= -30V, VGS = 0V
DS
VGS = 20V, VDS = 0V
V
= VGS, ID = -250A
DS
V
= -10V, ID = -13A
m
S
GS
= -4.5V, ID = -10A
V
GS
V
= -15V, ID = -13A
DS
VGS = 0V, IS = -2.7A
pF pF pF
= -15V, VGS = 0V
V
DS
f = 1.0MHz
= 0V, VGS = 0V
V
DS
f = 1.0MHz
= -15V, VGS = -5V
V
nC
ns
DS
= -13A
I
D
V
= -15V, VGS = -10V,
DS
I
= -1A, RG = 6.0
D
September 2013
© Diodes Incorporated
W
W
Loading...
+ 3 hidden pages